component
MM74HC244WMX
Public Made by Adomby adom
onsemi Buffers / Drivers, SOIC-20-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMM74HC244WMX
onsemi · Buffers / Drivers · SOIC-20-300mil
MM74HC244WMX from onsemi, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1G | input | Active-low 3-STATE enable for the first group of four buffers (1A1-1A4 to 1Y1-1Y4); outputs go high-impedance when high. |
| 2 | 1A1 | input | Buffer input 1 of group 1, non-inverting to 1Y1. |
| 3 | 2Y4 | tri_state | 3-STATE buffer output 4 of group 2, controlled by 2G with 6 mA output drive. |
| 4 | 1A2 | input | Buffer input 2 of group 1, non-inverting to 1Y2. |
| 5 | 2Y3 | tri_state | 3-STATE buffer output 3 of group 2, controlled by 2G with 6 mA output drive. |
| 6 | 1A3 | input | Buffer input 3 of group 1, non-inverting to 1Y3. |
| 7 | 2Y2 | tri_state | 3-STATE buffer output 2 of group 2, controlled by 2G with 6 mA output drive. |
| 8 | 1A4 | input | Buffer input 4 of group 1, non-inverting to 1Y4. |
| 9 | 2Y1 | tri_state | 3-STATE buffer output 1 of group 2, controlled by 2G with 6 mA output drive. |
| 10 | GND | power_in | Ground reference for the device. |
| 11 | 2A1 | input | Buffer input 1 of group 2, non-inverting to 2Y1. |
| 12 | 1Y4 | tri_state | 3-STATE buffer output 4 of group 1, controlled by 1G with 6 mA output drive. |
| 13 | 2A2 | input | Buffer input 2 of group 2, non-inverting to 2Y2. |
| 14 | 1Y3 | tri_state | 3-STATE buffer output 3 of group 1, controlled by 1G with 6 mA output drive. |
| 15 | 2A3 | input | Buffer input 3 of group 2, non-inverting to 2Y3. |
| 16 | 1Y2 | tri_state | 3-STATE buffer output 2 of group 1, controlled by 1G with 6 mA output drive. |
| 17 | 2A4 | input | Buffer input 4 of group 2, non-inverting to 2Y4. |
| 18 | 1Y1 | tri_state | 3-STATE buffer output 1 of group 1, controlled by 1G with 6 mA output drive. |
| 19 | 2G | input | Active-low 3-STATE enable for the second group of four buffers (2A1-2A4 to 2Y1-2Y4); outputs go high-impedance when high. |
| 20 | VCC | power_in | Positive supply voltage, recommended 2 to 6 V (absolute maximum -0.5 to +7.0 V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-20-300mil |
| Category | Logic ICs |
| Pins | 20 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC | -0.5 | 7 | V | 3 | ||
| DC Input Voltage | VIN | -1.5 | V | -1.5 to VCC +1.5V | 3 | ||
| DC Output Voltage | VOUT | -0.5 | V | -0.5 to VCC +0.5V | 3 | ||
| Clamp Diode Current | IIK, IOK | -20 | 20 | mA | 3 | ||
| DC Output Current, per pin | IOUT | -35 | 35 | mA | 3 | ||
| DC VCC or GND Current, per pin | ICC | -70 | 70 | mA | 3 | ||
| Storage Temperature Range | TSTG | -65 | 150 | °C | 3 | ||
| Power Dissipation | PD | 500 | mW | S.O. Package only | 3 | ||
| Lead Temperature | TL | 260 | °C | Soldering 10 seconds | 3 | ||
| Supply Voltage | VCC | 2 | 6 | V | 3 | ||
| DC Input or Output Voltage | VIN, VOUT | 0 | V | 0 to VCC | 3 | ||
| Operating Temperature Range | TA | -40 | 85 | °C | 3 | ||
| Input Rise or Fall Times | tr, tf | 1000 | ns | VCC = 2.0V | 3 | ||
| Input Rise or Fall Times | tr, tf | 500 | ns | VCC = 4.5V | 3 | ||
| Input Rise or Fall Times | tr, tf | 400 | ns | VCC = 6.0V | 3 | ||
| Minimum HIGH Level Input Voltage | VIH | 1.5 | V | VCC = 2.0V, TA = -40 to 85°C | 3 | ||
| Minimum HIGH Level Input Voltage | VIH | 3.15 | V | VCC = 4.5V, TA = -40 to 85°C | 3 | ||
| Minimum HIGH Level Input Voltage | VIH | 4.2 | V | VCC = 6.0V, TA = -40 to 85°C | 3 | ||
| Maximum LOW Level Input Voltage | VIL | 0.5 | V | VCC = 2.0V, TA = -40 to 85°C | 3 | ||
| Maximum LOW Level Input Voltage | VIL | 1.35 | V | VCC = 4.5V, TA = -40 to 85°C | 3 | ||
| Maximum LOW Level Input Voltage | VIL | 1.8 | V | VCC = 6.0V, TA = -40 to 85°C | 3 | ||
| Minimum HIGH Level Output Voltage | VOH | 1.9 | 2 | V | VIN = VIH or VIL, /IOUT/ ≤ 20 µA, VCC = 2.0V, TA = -40 to 85°C | 3 | |
| Minimum HIGH Level Output Voltage | VOH | 4.4 | 4.5 | V | VIN = VIH or VIL, /IOUT/ ≤ 20 µA, VCC = 4.5V, TA = -40 to 85°C | 3 | |
| Minimum HIGH Level Output Voltage | VOH | 5.9 | 6 | V | VIN = VIH or VIL, /IOUT/ ≤ 20 µA, VCC = 6.0V, TA = -40 to 85°C | 3 | |
| Minimum HIGH Level Output Voltage | VOH | 3.84 | 4.2 | V | VIN = VIH or VIL, /IOUT/ ≤ 6.0 mA, VCC = 4.5V, TA = -40 to 85°C | 3 | |
| Minimum HIGH Level Output Voltage | VOH | 5.34 | 5.7 | V | VIN = VIH or VIL, /IOUT/ ≤ 7.8 mA, VCC = 6.0V, TA = -40 to 85°C | 3 | |
| Maximum LOW Level Output Voltage | VOL | 0 | 0.1 | V | VIN = VIH or VIL, /IOUT/ ≤ 20 µA, VCC = 2.0V, TA = -40 to 85°C | 3 | |
| Maximum LOW Level Output Voltage | VOL | 0.2 | 0.33 | V | VIN = VIH or VIL, /IOUT/ ≤ 6.0 mA, VCC = 4.5V, TA = -40 to 85°C | 3 | |
| Maximum Input Current | IIN | -1 | 0.1 | 1 | µA | VIN = VCC or GND, VCC = 6.0V, TA = -40 to 85°C | 3 |
| Maximum 3-STATE Output Leakage Current | IOZ | -5 | 0.5 | 5 | µA | VIN = VIH or VIL, VOUT = VCC or GND, G = VIH, VCC = 6.0V, TA = -40 to 85°C | 3 |
| Maximum Quiescent Supply Current | ICC | 8 | 80 | µA | VIN = VCC or GND, IOUT = 0 µA, VCC = 6.0V, TA = -40 to 85°C | 3 | |
| Maximum Propagation Delay | tPHL, tPLH | 14 | 20 | ns | VCC = 5V, TA = 25°C, CL = 45 pF | 4 | |
| Maximum Enable Delay to Active Output | tPZH, tPZL | 17 | 28 | ns | VCC = 5V, TA = 25°C, RL = 1 kΩ, CL = 45 pF | 4 | |
| Maximum Disable Delay from Active Output | tPHZ, tPLZ | 15 | 25 | ns | VCC = 5V, TA = 25°C, RL = 1 kΩ, CL = 5 pF | 4 | |
| Maximum Propagation Delay | tPHL, tPLH | 58 | 145 | ns | CL = 50 pF, VCC = 2.0V, TA = -40 to 85°C | 4 | |
| Maximum Propagation Delay | tPHL, tPLH | 83 | 208 | ns | CL = 150 pF, VCC = 2.0V, TA = -40 to 85°C | 4 | |
| Maximum Propagation Delay | tPHL, tPLH | 14 | 29 | ns | CL = 50 pF, VCC = 4.5V, TA = -40 to 85°C | 4 | |
| Maximum Propagation Delay | tPHL, tPLH | 17 | 42 | ns | CL = 150 pF, VCC = 4.5V, TA = -40 to 85°C | 4 | |
| Maximum Propagation Delay | tPHL, tPLH | 10 | 25 | ns | CL = 50 pF, VCC = 6.0V, TA = -40 to 85°C | 4 | |
| Maximum Propagation Delay | tPHL, tPLH | 14 | 35 | ns | CL = 150 pF, VCC = 6.0V, TA = -40 to 85°C | 4 | |
| Maximum Output Enable Time | tPZH, tPZL | 75 | 189 | ns | RL = 1 kΩ, CL = 50 pF, VCC = 2.0V, TA = -40 to 85°C | 4 | |
| Maximum Output Enable Time | tPZH, tPZL | 100 | 252 | ns | RL = 1 kΩ, CL = 150 pF, VCC = 2.0V, TA = -40 to 85°C | 4 | |
| Maximum Output Enable Time | tPZH, tPZL | 15 | 38 | ns | RL = 1 kΩ, CL = 50 pF, VCC = 4.5V, TA = -40 to 85°C | 4 | |
| Maximum Output Enable Time | tPZH, tPZL | 30 | 50 | ns | RL = 1 kΩ, CL = 150 pF, VCC = 4.5V, TA = -40 to 85°C | 4 | |
| Maximum Output Enable Time | tPZH, tPZL | 13 | 32 | ns | RL = 1 kΩ, CL = 50 pF, VCC = 6.0V, TA = -40 to 85°C | 4 | |
| Maximum Output Enable Time | tPZH, tPZL | 17 | 43 | ns | RL = 1 kΩ, CL = 150 pF, VCC = 6.0V, TA = -40 to 85°C | 4 | |
| Maximum Output Disable Time | tPHZ, tPLZ | 75 | 189 | ns | RL = 1 kΩ, VCC = 2.0V, TA = -40 to 85°C | 4 | |
| Maximum Output Disable Time | tPHZ, tPLZ | 15 | 38 | ns | CL = 50 pF, VCC = 4.5V, TA = -40 to 85°C | 4 | |
| Maximum Output Disable Time | tPHZ, tPLZ | 13 | 32 | ns | VCC = 6.0V, TA = -40 to 85°C | 4 | |
| Maximum Output Rise and Fall Time | tTLH, tTHL | 60 | 90 | ns | VCC = 2.0V, TA = -40 to 85°C | 4 | |
| Maximum Output Rise and Fall Time | tTLH, tTHL | 12 | 18 | ns | VCC = 4.5V, TA = -40 to 85°C | 4 | |
| Maximum Output Rise and Fall Time | tTLH, tTHL | 10 | 15 | ns | VCC = 6.0V, TA = -40 to 85°C | 4 | |
| Maximum Input Capacitance | CIN | 5 | 10 | pF | TA = -40 to 85°C | 4 | |
| Maximum Output Capacitance | COUT | 10 | 20 | pF | TA = -40 to 85°C | 4 | |
| Power Dissipation Capacitance (per buffer) | CPD | 12 | pF | G = VIH | 4 | ||
| Power Dissipation Capacitance (per buffer) | CPD | 50 | pF | G = VIL | 4 |
CAD (KiCad official)
- Symbol:
MM74HC244WMX - Footprint:
Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm - 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
- 3D model files:
mm74hc244wmx-etched.step/mm74hc244wmx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mm74hc244wmx.step/mm74hc244wmx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (8 pp, sha256
de4b4c7bf6fc2071, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).