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Contents

README

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AD5542ARZ

Analog Devices · Digital To Analog Converters (DACs) · SOIC-14

AD5542ARZ from Analog Devices, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RFB passive Feedback resistor pin; in bipolar mode, connect this pin to the external op amp output.
2 VOUT output Analog output voltage from the DAC.
3 AGNDF power_in Ground reference point for analog circuitry (Force).
4 AGNDS power_in Ground reference point for analog circuitry (Sense).
5 REFS input Voltage reference input (Sense) for the DAC; connect to an external 2.5 V reference, which can range from 2 V to VDD.
6 REFF input Voltage reference input (Force) for the DAC; connect to an external 2.5 V reference, which can range from 2 V to VDD.
7 CS input Logic input chip select signal used to frame the serial data input.
8 SCLK input Clock input; data is clocked into the input register on the rising edge of SCLK, with duty cycle between 40% and 60%.
9 NC unconnected No connect.
10 DIN input Serial data input accepting 16-bit words, clocked into the input register on the rising edge of SCLK.
11 LDAC input LDAC input; when taken low, the DAC register is simultaneously updated with the contents of the input register.
12 DGND power_in Digital ground; ground reference for digital circuitry.
13 INV passive Connected to the internal scaling resistors of the DAC; connect to the external op amp inverting input in bipolar mode.
14 VDD power_in Analog supply voltage, 5 V ± 10%.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SOIC-14
Category ADC/DAC/Data Conversion
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Relative Accuracy (INL), A grade INL 0.5 4 LSB A grade 3
Differential Nonlinearity DNL 0.5 1 LSB Guaranteed monotonic 3
Gain Error (25°C) 0.5 2 LSB TA = 25°C 3
Gain Error (over temperature) 3 LSB 3
Unipolar Zero Code Error (25°C) 0.3 0.7 LSB TA = 25°C 3
Unipolar Zero Code Error (over temperature) 1.5 LSB 3
Bipolar Resistor Matching Ratio Error RFB/RINV 0.0015 0.0076 % Ratio error 3
Bipolar Zero Offset Error (25°C) 1 5 LSB TA = 25°C 3
Bipolar Zero Offset Error (over temperature) 6 LSB 3
Bipolar Zero Code Offset Error (25°C) 1 5 LSB TA = 25°C 3
Bipolar Zero Code Offset Error (over temperature) 6 LSB 3
Bipolar Gain Error (25°C) 1 5 LSB TA = 25°C 3
Bipolar Gain Error (over temperature) 6 LSB 3
Reference Input Range VREF 2 V upper limit VDD 3
Input Current (logic) -1 1 μA 3
Input Low Voltage VINL 0.8 V 3
Input High Voltage VINH 2.4 V 3
Supply Voltage VDD 2.7 5.5 V 4
Supply Current IDD 125 150 μA Digital inputs at rails 4
Power Dissipation 0.625 0.825 mW Digital inputs at rails 4
Gain Error Temperature Coefficient 0.1 ppm/°C ± 3
Unipolar Zero Code Temperature Coefficient 0.05 ppm/°C ± 3
Bipolar Zero Temperature Coefficient 0.2 ppm/°C ± 3
Bipolar Gain Temperature Coefficient 0.1 ppm/°C ± 3
Bipolar Resistor Matching RFB/RINV 1 Ω/Ω typically RFB = RINV = 28 kΩ 3
Output Voltage Settling Time 1 μs To 1/2 LSB of FS, CL = 10 pF 3
Slew Rate 17 V/μs CL = 10 pF, measured from 0% to 63% 3
DAC Output Impedance 6.25 kΩ Tolerance typically 20% 3
Reference Input Resistance, unipolar 9 kΩ Unipolar operation 3
Reference Input Resistance, bipolar 7.5 kΩ AD5542, bipolar operation 3
SCLK cycle frequency fSCLK 25 MHz 4
SCLK cycle time t1 40 ns 4
SCLK high time t2 20 ns 4
SCLK low time t3 20 ns 4
CS low to SCLK high setup t4 10 ns 4
CS high to SCLK high setup t5 15 ns 4
SCLK high to CS low hold time t6 30 ns 4
SCLK high to CS high hold time t7 20 ns 4
Data setup time t8 15 ns 4
Data hold time t9 4 ns VINH = 90% of VDD, VINL = 10% of VDD 4
Data hold time t9 7.5 ns VINH = 3V, VINL = 0 V 4
LDAC pulse width t10 30 ns 4
CS high to LDAC low setup t11 30 ns 4
CS high time between active periods t12 30 ns 4
VDD to AGND VDD -0.3 6 V TA = 25°C 5
AGND, AGNDF, AGNDS to DGND -0.3 0.3 V 5
Input Current to Any Pin Except Supplies -10 10 mA 5
Operating Temperature Range, Industrial (A version) -40 85 °C A, B, C versions 5
Storage Temperature Range -65 150 °C 5
Maximum Junction Temperature TJ max 150 °C 5
Thermal Impedance, SOIC (R-14) θJA 104.5 °C/W SOIC (R-14) 5
Lead Temperature, Soldering Peak 260 °C As per JEDEC Standard 20 5
ESD (HBM) 5 kV HBM Classification 5

CAD (KiCad official)

  • Symbol: AD5542ARZ
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: ad5542arz-etched.step / ad5542arz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ad5542arz.step / ad5542arz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (20 pp, sha256 6a9cdf0db0bc1b51, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF