component
BV08C-MS
Public Made by Adomby adom
MSKSEMI ESD And Surge Protection (TVS/ESD), SOD-323. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBV08C-MS
MSKSEMI · ESD And Surge Protection (TVS/ESD) · SOD-323
BV08C-MS from MSKSEMI, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised bidirectional ESD/TVS diode; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised bidirectional ESD/TVS diode; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Working Voltage | VRWM | 8 | V | 3 | |||
| Breakdown Voltage | VB | 8.5 | V | IT = 1 mA | 3 | ||
| Clamping Voltage @1A | VC@1A | 13.4 | V | IPP = 1 A | 3 | ||
| Clamping Voltage | VC | 24 | V | @ 18 A | 3 | ||
| Reverse Leakage Current | IR | 1 | µA | 3 | |||
| Junction Capacitance | CT | 0.8 | pF | 3 | |||
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 | 30 | kV | 3 | ||
| ESD per IEC 61000-4-2 (Air) | VESD | -30 | 30 | kV | 3 | ||
| Peak Pulse Power | PPP | 350 | W | 8/20μs | 3 | ||
| Operating Temperature | TOPT | -55 | 150 | ℃ | 3 | ||
| Storage Temperature | TSTG | -55 | 150 | ℃ | 3 | ||
| Lead Soldering Temperature | TL | 260 | ℃ | 3 |
CAD (KiCad official)
- Symbol:
BV08C-MS - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
bv08c-ms-etched.step/bv08c-ms-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bv08c-ms.step/bv08c-ms.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MSKSEMI datasheet (6 pp, sha256
0112dcfd5d70a2a7, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).