MAX33011EASA+ from Maxim Integrated, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	TXD	input	Transmit Data Input: a CMOS/TTL compatible input from the CAN controller with an internal pullup to VDD (RPU_TXD 100 kΩ to 250 kΩ), and the driver is disabled if TXD stays low longer than tDOM (1.3 ms to 4.3 ms).
2	GND	power_in	Ground reference; all device voltages are referenced to GND.
3	VDD	power_in	Supply Voltage: operates from 4.5 V to 5.5 V and must be bypassed to GND with a 0.1 µF capacitor.
4	RXD	output	Receive Data Output: a CMOS/TTL compatible output driven from the physical bus lines CANH and CANL, with VOH of at least VL - 0.4 V sourcing 4 mA and VOL of at most 0.4 V sinking 4 mA.
5	FAULT	output	Fault Detected Indication: stays low when no fault is detected and goes high when an overcurrent, overvoltage, or transmission failure is detected.
6	CANL	bidirectional	CAN Bus Line Low: fault protected to -65 V to +65 V with respect to GND, and the driver output is current limited (ISC_CANL 175 mA to 250 mA).
7	CANH	bidirectional	CAN Bus Line High: fault protected to -65 V to +65 V with respect to GND, and the driver output is current limited (ISC_CANH 175 mA to 250 mA).
8	S	input	Silent Mode Input: drive S high to disable the transmitter regardless of TXD, drive it low for normal operation, and a 26.1 kΩ resistor to ground selects slow slew mode (S has an internal pullup of 100 kΩ to 250 kΩ).

Key specifications

Parameter	Value
Manufacturer	Maxim Integrated
Package	SOIC-8
Category	Communication Interface Chip/UART/485/232
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Dominant Supply Current	IDD_DOM		5	8	mA	TXD = 0V, No load	4
Dominant Supply Current	IDD_DOM		50	70	mA	TXD = 0V, RL = 60Ω	4
Recessive Supply Current (no load)	IDD_REC			4	mA	VDD = 5V, TXD = VL, No load	4
Recessive Supply Current (CANH shorted to CANL)	IDD_REC			4	mA	VDD = 5V, TXD = VL, CANH shorted to CANL	4
Silent Mode Supply Current	IS			3	mA	S = VL	4
UVLO Threshold Rising	VUVLO_R			4.25	V	VDD rising	4
UVLO Threshold Falling	VUVLO_F			3.45	V	VDD falling	4
ESD CANH and CANL HBM		-45		45	kV	HBM JEDEC JS-001, Note 3	4
ESD CANH and CANL IEC 61000-4-2 Air Gap		-30		30	kV	IEC 61000-4-2, Air Gap	4
ESD CANH and CANL IEC 61000-4-2 Contact		-12		12	kV	IEC 61000-4-2, Contact	4
ESD Other Pins	ESDALL	-4		4	kV	HBM JEDEC JS-001, Note 3	4
Fault Protection Range (CANH or CANL to GND)	VFP	-65		65	V	CANH or CANL to GND	4
Thermal Shutdown	TSHDN			160	°C		4
Thermal Shutdown Hysteresis	THYST			20	°C		4
TXD Input Pullup Resistance	RPU_TXD	100		250	kΩ		4
S Input Pullup Resistance	RPU_S	100		250	kΩ		4
Output Low Voltage (RXD)	VOL			0.4	V	Sinking 4mA	5
Bus Output Voltage (Dominant) CANH	VO_DOM	2.75		4.5	V	t < tDOM, TXD = 0V, RL = 60Ω	5
Bus Output Voltage (Dominant) CANL	VO_DOM	0.5		2.25	V	t < tDOM, TXD = 0V, RL = 60Ω	5
Bus Output Voltage (Recessive)	VO_REC	2		3	V	TXD = VL, no load	5
Bus Output Differential Voltage (Dominant)	VOD_DOM	1.5		3	V	TXD = 0V, RL = 60Ω, -5V ≤ VCM ≤ 10V, RCM = 156Ω, Figure 1	5
Bus Output Differential Voltage (Recessive)	VOD_REC	-120		12	mV	TXD = VL, RL = 60Ω	5
Bus Output Differential Voltage (Recessive)	VOD_REC	-500		50	mV	TXD = VL, No load	5
High-Side Short-Circuit Current	ISC_CANH	175		250	mA	TXD = CANH = 0V	5
Low-Side Short-Circuit Current	ISC_CANL	175		250	mA	TXD = 0V, CANL = VDD	5
Common-Mode Input Range	VCM	-25		25	V	CANH or CANL to GND, RXD output valid	5
Input Differential Threshold Voltage (Dominant)	VID_DOM			0.9	V	-25V ≤ VCM ≤ +25V, TXD = VL	5
Input Differential Threshold Voltage (Recessive)	VID_REC			0.5	V	-25V ≤ VCM ≤ +25V, TXD = VL	5
Input Differential Hysteresis	VID_HYS			100	mV	-25V ≤ VCM ≤ +25V	5
Input Resistance	RIN	10		50	kΩ	TXD = VL	5
Differential Input Resistance	RIN_DIFF	20		100	kΩ	TXD = VL	5
Input Capacitance	CIN		22	39	pF	TXD = VL (Note 2)	6
Differential Input Capacitance	CIN_DIFF		12	22	pF	TXD = VL (Note 2)	6
Input Leakage Current	ILKG		150	280	μA	VDD = VL = 0V, CANH = CANL = VDD	6
Data Rate				5	Mbps	RL = 60Ω, CLD = 100pF, RCM is open, Figure 1	6
Driver Rise Time	tR			10	ns	RL = 60Ω, CLD = 100pF, RCM is open, Figure 1	6
Driver Fall Time	tF			14	ns	RL = 60Ω, CLD = 100pF, RCM is open, Figure 1	6
Slow Slew Driver Rise Time	tSSR			160	ns	RL = 60Ω, CLD = 100pF, RCM is open, Figure 1	6
Slow Slew Driver Fall Time	tSSF			130	ns	RL = 60Ω, CLD = 100pF, RCM is open, Figure 1	6
TXD to RXD Loop Delay	tLOOP		60	100	ns	RL = 60Ω, Dominant to Recessive and Recessive to Dominant, Figure 2	6
TXD Propagation Delay (Recessive to Dominant)	tONTXD		30	50	ns	RL = 60Ω, CLD = 100pF, RCM is open, Figure 1	6
TXD Propagation Delay (Dominant to Recessive)	tOFFTXD		25	50	ns	RL = 60Ω, CLD = 100pF, RCM is open, Figure 1	6
RXD Propagation Delay (Recessive to Dominant)	tONRXD		25	70	ns	CL = 15pF, Figure 3	6
RXD Propagation Delay (Dominant to Recessive)	tOFFRXD		30	70	ns	CL = 15pF, Figure 3	6
TXD-Dominant TimeOut	tDOM	1.3		4.3	ms	Figure 4	6
Fault Interrupt on Delay (Overcurrent, Overvoltage)	tFAULT_LH			4	μs	100kΩ pullup resistor to VDD, 2.5MHz signal on TXD, Figure 6; Overcurrent and overvoltage	6
Fault Interrupt on Delay (Transmission Failure)	tFAULT_LH			8	μs	100kΩ pullup resistor to VDD, 2.5MHz signal on TXD, Figure 6; Transmission failure	6
Operating Temperature Range		-40		125	°C		3
Supply Voltage VDD (absolute maximum)	VDD	-0.3		6	V	Voltages referenced to GND	3
TXD, RXD, STBY, S, LPBK, FAULT (absolute maximum, as printed)		-0.3		6	V	Voltages referenced to GND	3
CANH or CANL (Continuous)		-65		65	V	Continuous	3
Junction Temperature				150	°C		3
Storage Temperature Range		-60		150	°C		3
Soldering Temperature (reflow)				260	°C		3
Continuous Power Dissipation, 8 SO single-layer board				470.6	mW	TA = +70°C, derate 5.9mW/°C above +70°C	3
Continuous Power Dissipation, 8 SO multilayer board				606.1	mW	TA = +70°C, derate 7.6mW/°C above +70°C	3
Thermal Resistance Junction to Ambient, single-layer board (8 SO)	θJA			170	°C/W	Single-layer board	3
Thermal Resistance Junction to Ambient, four-layer board (8 SO)	θJA			132	°C/W	Four-layer board	3

CAD (KiCad official)

Symbol: MAX33011EASA+
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: max33011easa-etched.step / max33011easa-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max33011easa.step / max33011easa.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Maxim Integrated datasheet (22 pp, sha256 5a5f67063f9bcb80, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

MAX33011EASA+

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3D Model

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