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SI2307CDS-T1-E3

Public Made by Adom

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Vishay Intertech MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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SI2307CDS-T1-E3

Vishay Intertech · MOSFETs · SOT-23

SI2307CDS-T1-E3 from Vishay Intertech, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate of the P-channel MOSFET; gate-source voltage is rated ±20 V (absolute maximum).
2 S passive Source of the P-channel MOSFET; the continuous source-drain diode current IS is rated -1.5 A at TC = 25 °C.
3 D passive Drain of the P-channel MOSFET; drain-source voltage is rated -30 V, and this pin also serves as the thermal connection from the package to the PC board.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -30 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current (TJ = 150 °C), TC = 25 °C ID -3.5 A TC = 25 °C 1
Continuous Drain Current (TJ = 150 °C), TC = 70 °C ID -2.8 A TC = 70 °C 1
Continuous Drain Current (TJ = 150 °C), TA = 25 °C ID -2.7 A TA = 25 °C 1
Continuous Drain Current (TJ = 150 °C), TA = 70 °C ID -2.2 A TA = 70 °C 1
Pulsed Drain Current IDM -12 A 10 µs Pulse Width 1
Continuous Source-Drain Diode Current, TC = 25 °C IS -1.5 A TC = 25 °C 1
Continuous Source-Drain Diode Current, TA = 25 °C IS -0.91 A TA = 25 °C 1
Maximum Power Dissipation, TC = 25 °C PD 1.8 W TC = 25 °C 1
Maximum Power Dissipation, TC = 70 °C PD 1.14 W TC = 70 °C 1
Maximum Power Dissipation, TA = 25 °C PD 1.1 W TA = 25 °C 1
Maximum Power Dissipation, TA = 70 °C PD 0.7 W TA = 70 °C 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Soldering Recommendations (Peak Temperature) 260 °C 1
Maximum Junction-to-Ambient RthJA 90 115 °C/W t ≤ 5 s 1
Maximum Junction-to-Ambient, steady state RthJA 166 °C/W Steady State (note c) 1
Maximum Junction-to-Foot (Drain) RthJF 55 70 °C/W Steady State 1
Drain-Source Breakdown Voltage VDS -30 V VGS = 0 V, ID = -250 µA 2
Gate-Source Threshold Voltage VGS(th) -1 -3 V VDS = VGS, ID = -250 µA 2
Gate-Source Leakage IGSS -100 nA VDS = 0 V, VGS = ± 20 V 2
Zero Gate Voltage Drain Current IDSS -1 µA VDS = -30 V, VGS = 0 V 2
Zero Gate Voltage Drain Current, TJ = 55 °C IDSS -10 µA VDS = -30 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current ID(on) -6 A VDS ≤ 5 V, VGS = -10 V 2
Drain-Source On-State Resistance, VGS = -10 V RDS(on) 0.073 0.088 Ω VGS = -10 V, ID = -3.5 A 2
Drain-Source On-State Resistance, VGS = -4.5 V RDS(on) 0.11 0.138 Ω VGS = -4.5 V, ID = -2.5 A 2
Total Gate Charge Qg 4.1 6.2 nC VDS = -15 V, VGS = -4.5 V, ID = -2.5 A 2
Turn-On Delay Time (VGEN = -4.5 V) td(on) 40 60 ns VDD = -15 V, RL = 15 Ω, ID ≅ -1 A, VGEN = -4.5 V, Rg = 1 Ω 2
Rise Time (VGEN = -4.5 V) tr 40 60 ns VDD = -15 V, RL = 15 Ω, ID ≅ -1 A, VGEN = -4.5 V, Rg = 1 Ω 2
Turn-Off Delay Time (VGEN = -4.5 V) td(off) 20 40 ns VDD = -15 V, RL = 15 Ω, ID ≅ -1 A, VGEN = -4.5 V, Rg = 1 Ω 2
Fall Time (VGEN = -4.5 V) tf 17 30 ns VDD = -15 V, RL = 15 Ω, ID ≅ -1 A, VGEN = -4.5 V, Rg = 1 Ω 2
Turn-On Delay Time (VGEN = -10 V) td(on) 5.5 10 ns VDD = -15 V, RL = 15 Ω, ID ≅ -1 A, VGEN = -10 V, Rg = 1 Ω 2
Rise Time (VGEN = -10 V) tr 13 25 ns VDD = -15 V, RL = 15 Ω, ID ≅ -1 A, VGEN = -10 V, Rg = 1 Ω 2
Turn-Off Delay Time (VGEN = -10 V) td(off) 17 30 ns VDD = -15 V, RL = 15 Ω, ID ≅ -1 A, VGEN = -10 V, Rg = 1 Ω 2
Fall Time (VGEN = -10 V) tf 7.7 15 ns VDD = -15 V, RL = 15 Ω, ID ≅ -1 A, VGEN = -10 V, Rg = 1 Ω 2
Continuous Source-Drain Diode Current IS -1.5 A TC = 25 °C 2
Pulse Diode Forward Current ISM -12 A 2
Body Diode Voltage VSD -0.8 -1.2 V IS = -0.75 A, VGS = 0 V 2
Body Diode Reverse Recovery Time trr 17 30 ns IF = -2.5 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Body Diode Reverse Recovery Charge Qrr 11 20 nC IF = -2.5 A, dI/dt = 100 A/µs, TJ = 25 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper pattern, a plane of copper overlies the drain pin and provides 7

CAD (KiCad official)

  • Symbol: SI2307CDS-T1-E3
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: si2307cds-t1-e3-etched.step / si2307cds-t1-e3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si2307cds-t1-e3.step / si2307cds-t1-e3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (9 pp, sha256 698646fe8ca6dfb8, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF