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Contents

README

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LM3150MHX

Texas Instruments · DC-DC Converters · HTSSOP-14-EP

LM3150MHX from Texas Instruments, in a HTSSOP-14-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_out Internal LDO output supplying the FET gate drivers and internal bias. Nominally regulated to 5.95 V. Connect a 1.0 µF to 4.7 µF decoupling capacitor from this pin to ground.
2 VIN power_in Input supply pin to the device. Nominal input voltage range is 6 V to 42 V (abs max 47 V).
3 EN input Enable input. Apply a logic-high signal greater than 1.26 V (typ) to enable the IC, or leave floating. Ground this pin to disable the controller. Recommended operating range 0 V to 5 V.
4 FB input Feedback input to the regulation, overvoltage, and short-circuit comparators. Regulation setting is 0.6 V. Connect to a feedback resistor divider from the output to set VOUT.
5 SGND power_in Signal ground for all internal bias and reference circuitry. Should be tied to PGND at a single point. Pin 5 and pin 9 are both SGND and must be connected together.
6 SS passive Soft-start capacitor node. An internal 7.7 µA current source charges an external capacitor from this pin to ground to program the output ramp rate at start-up.
7 RON input On-time programming pin. An external resistor from VIN to this pin sets the high-side switch on-time and therefore the switching frequency.
8 ILIM input Current-limit sense input. Monitors the low-side FET current and triggers current-limit operation when the inductor valley current exceeds the threshold set by R_LIM and the 85 µA (typ) I_LIM-TH sense current sourced from this pin.
9 SGND power_in Signal ground (second connection). Tie to PGND at a single point. Must be connected to pin 5.
10 SW power_in Switch node. Connection to the source of the high-side NMOS and drain of the low-side NMOS, and lower supply rail for the high-side gate driver. Boost capacitor (BST) is referenced to this pin. Abs max −3 V to 47 V.
11 HG output High-side NMOS gate drive output. Driver is supplied by the differential voltage between BST and SW (typically ~5.95 V bootstrap rail).
12 BST power_in Bootstrap capacitor connection. Connect a 0.33 µF to 0.47 µF capacitor from SW to this pin. An internal diode charges the cap during the high-side off-time. Do not connect to an external supply rail. Abs max BST-SW 7 V; BST-GND 52 V.
13 LG output Low-side NMOS gate drive output. Driver upper rail is supplied by VCC (~5.95 V).
14 PGND power_in Power ground; source connection for the synchronous low-side MOSFET driver. Tie to the power ground plane and to SGND at a single point.
EP EP passive Exposed die-attach thermal pad. Connect directly to SGND and to the PCB ground plane for heat dissipation.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-14-EP
Category PMIC
Pins 15

Ordering variants

Same part, different packaging or reel option.

  • LM3150MHX

CAD (KiCad official)

  • Symbol: LM3150MHX
  • Footprint: Package_SO:TSSOP-14-1EP_4.4x5mm_P0.65mm
  • 3D model: HTSSOP-14-EP (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
lm3150mhx.step 305 KB You want the bare part, or you mark your own boards.
lm3150mhx-etched.step 1.5 MB You want the part with LM3150MHX already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 414 faces against 99 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 262f4efa528d8294, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF