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Contents

README

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1SMB5945BT3G

onsemi · Zener Diodes · SMB

1SMB5945BT3G from onsemi, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage VZ (nominal, min/max at IZT) VZ 64.6 68 71.4 V @ IZT = 5.5 mA; TL = 30°C unless otherwise noted 3
Zener voltage tolerance (type number designation) -5 5 % Type number indicates ±5% tolerance (Note 2) 3
Maximum Zener impedance at IZT ZZT 120 Ω @ IZT, 60 Hz, IZ(ac) = 0.1 IZ(dc) (Note 4) 3
Maximum Zener impedance at IZK ZZK 1700 Ω @ IZK = 0.25 mA, 60 Hz, IZ(ac) = 0.1 IZ(dc) (Note 4) 3
Reverse leakage current IR IR 1 µA @ VR = 51.7 V 3
Maximum DC Zener current IZM 22 mA(dc) 3
Forward voltage VF VF 1.5 V @ IF = 200 mA(dc) for all types 2
Steady state power dissipation PD at TL PD 3 W @ TL = 75°C; measured at zero lead length 1
Derating above 75°C (TL) 40 mW/°C Derate above TL = 75°C 1
Thermal resistance junction-to-lead RθJL 25 °C/W Junction-to-lead 1
Steady state power dissipation PD at TA PD 550 mW @ TA = 25°C; FR-4 board, recommended footprint (Note 1) 1
Derating above 25°C (TA) 4.4 mW/°C Derate above TA = 25°C 1
Thermal resistance junction-to-ambient RθJA 226 °C/W Junction-to-ambient; FR-4 board, recommended footprint (Note 1) 1
Operating and storage temperature range TJ, Tstg -65 150 °C Operating junction and storage temperature 1

CAD (KiCad official)

  • Symbol: 1SMB5945BT3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: 1smb5945bt3g-etched.step / 1smb5945bt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1smb5945bt3g.step / 1smb5945bt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 e95f4deeabd8ea97, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF