component

FDG6318PZ-VB

Public Made by Adom

by adom

VBsemi Elec MOSFETs, SC-70-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componenttransistors-thyristorsfdg6318pz-vbfactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity

3D Model

Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

Datasheet

Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

FDG6318PZ-VB

VBsemi Elec · MOSFETs · SC-70-6

FDG6318PZ-VB from VBsemi Elec, in a SC-70-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of the first P-channel MOSFET; the device absolute maximum drain-source voltage is -20 V and gate-source voltage is ±12 V.
2 G1 input Gate of the first P-channel MOSFET; gate-source voltage is limited to ±12 V.
3 D2 passive Drain of the second P-channel MOSFET; drain-source voltage is limited to -20 V.
4 S2 passive Source of the second P-channel MOSFET; the device absolute maximum drain-source voltage is -20 V and gate-source voltage is ±12 V.
5 G2 input Gate of the second P-channel MOSFET; gate-source voltage is limited to ±12 V.
6 D1 passive Drain of the first P-channel MOSFET; drain-source voltage is limited to -20 V.

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package SC-70-6
Category Transistors/Thyristors
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -20 V 1
Gate-Source Voltage VGS -12 12 V 1
Continuous Drain Current ID -1.5 A TC = 70 °C 1
Continuous Drain Current ID -1.6 A TA = 25 °C 1
Continuous Drain Current ID -1.1 A TA = 70 °C 1
Pulsed Drain Current IDM -2.5 A 1
Continuous Source-Drain Diode Current IS -1.1 A TC = 25 °C 1
Continuous Source-Drain Diode Current IS -0.95 A TA = 25 °C 1
Maximum Power Dissipation PD 1.4 W TC = 25 °C 1
Maximum Power Dissipation PD 0.9 W TC = 70 °C 1
Maximum Power Dissipation PD 1.14 W TA = 25 °C 1
Maximum Power Dissipation PD 0.73 W TA = 70 °C 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Maximum Junction-to-Ambient RthJA 93 110 °C/W t ≤ 5 s 1
Maximum Junction-to-Ambient RthJA 150 °C/W steady state (from note d) 1
Maximum Junction-to-Foot RthJF 75 90 °C/W steady state 1
Gate Threshold Voltage VGS(th) -1.5 -0.5 V VDS = VGS, ID = -250 µA 2
Gate-Source Leakage IGSS -100 100 nA VDS = 0 V, VGS = ±12 V 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS = -20 V, VGS = 0 2
Zero Gate Voltage Drain Current IDSS 10 µA VDS = -20 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current ID(on) -8 A VDS ≤ -5 V, VGS = -4.5 V 2
Drain-Source On-State Resistance RDS(on) 0.155 Ω VGS = -4.5 V, ID = -2.5 A 2
Drain-Source On-State Resistance RDS(on) 0.235 Ω VGS = -2.5 V, ID = -1 A 2
Drain-Source Breakdown Voltage VDS -20 V VGS = 0 V, ID = -250 µA 2
Gate Resistance Rg 2 7 14 Ω f = 1 MHz 2
Total Gate Charge Qg 5.2 8 nC VDS = -15 V, VGS = -4.5 V, ID = -2.6 A 2
Total Gate Charge Qg 2.7 4 nC VDS = -15 V, VGS = -4.5 V, ID = -2.6 A 2
Turn-On Delay Time td(on) 39 59 ns VDD = -15 V, RL = 7.1 Ω, ID ≈ -2.1 A, VGEN = -4.5 V, Rg = 1 Ω 2
Rise Time tr 25 38 ns VDD = -15 V, RL = 7.1 Ω, ID ≈ -2.1 A, VGEN = -4.5 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 13 20 ns VDD = -15 V, RL = 7.1 Ω, ID ≈ -2.1 A, VGEN = -4.5 V, Rg = 1 Ω 2
Fall Time tf 9 18 ns VDD = -15 V, RL = 7.1 Ω, ID ≈ -2.1 A, VGEN = -4.5 V, Rg = 1 Ω 2
Body Diode Voltage VSD 0.85 1.2 V IS = -2.1 A, VGS = 0 V 2
Body Diode Reverse Recovery Time trr 13 20 ns IF = -2.1 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Body Diode Reverse Recovery Charge Qrr 6 12 nC IF = -2.1 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Continuous Source-Drain Diode Current IS 1.17 A TC = 25 °C 2
Pulse Diode Forward Current ISM 8 A 2
VDS Temperature Coefficient ΔVDS/ΔTJ -17 mV/°C ID = -250 µA 2
VGS(th) Temperature Coefficient ΔVGS(th)/ΔTJ 3.5 mV/°C 2
Forward Transconductance gfs 5 S VDS = -15 V, ID = -2.6 A 2
Input Capacitance Ciss 210 pF VDS = -15 V, VGS = 0 V, f = 1 MHz 2
Output Capacitance Coss 45 pF VDS = -15 V, VGS = 0 V, f = 1 MHz 2
Reverse Transfer Capacitance Crss 33 pF VDS = -15 V, VGS = 0 V, f = 1 MHz 2
Gate-Source Charge Qgs 0.94 nC VDS = -15 V, VGS = -4.5 V, ID = -2.6 A 2
Gate-Drain Charge Qgd 1.3 nC VDS = -15 V, VGS = -4.5 V, ID = -2.6 A 2
Reverse Recovery Fall Time ta 9 ns 2
Reverse Recovery Rise Time tb 4 ns 2

CAD (KiCad official)

  • Symbol: FDG6318PZ-VB
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SC-70-6 (KiCad packages3D, STEP)
  • 3D model files: fdg6318pz-vb-etched.step / fdg6318pz-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fdg6318pz-vb.step / fdg6318pz-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (7 pp, sha256 d011959461d9e9b4, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF