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Contents

README

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BQ76PL102RGTR

Texas Instruments · Battery Management · VQFN-16-EP(3x3)

BQ76PL102RGTR from Texas Instruments, in a VQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VSS power_in Connect to the most-negative cell voltage (cell 1 negative) of the series string.
2 VLDO power_out Low-dropout regulator output that must be connected to VPP and bypassed with a 4.7 µF capacitor.
3 TDI unconnected Do not connect.
4 SDI input PowerLAN serial data input from the lower (south, downstream) part, capacitively coupled, with rise and fall times limited to 500 ns.
5 PUMP1S output Charge-balance gate drive for cell 1 south, switching the cell-balancing MOSFET that pumps charge to the next lower cell.
6 PUMP1N output Charge-balance gate drive for cell 1 north, switching the cell-balancing MOSFET that pumps charge from cell 1 to cell 2.
7 PUMP2S output Charge-balance gate drive for cell 2 south, switching the cell-balancing MOSFET that pumps charge from cell 2 to cell 1.
8 PUMP2N output Charge-balance gate drive for cell 2 north, switching the cell-balancing MOSFET that pumps charge to the next higher cell.
9 SDO output PowerLAN serial data output to the north (upstream) part, capacitively coupled with output logic high of 0.9 VLDO minimum.
10 TCK unconnected Do not connect.
11 TMD unconnected Do not connect.
12 V2 power_in Connect to the most-positive cell voltage (cell 2 positive); also an analog input for cell 2 voltage measurement, and to V1 of the topmost device when the stack has an odd number of cells.
13 XT2 input External temperature sensor 2 analog input, using a calibrated 50 µA sensor current.
14 XT1 input External temperature sensor 1 analog input, using a calibrated 50 µA sensor current.
15 V1 input Midpoint cell connection (cell 1 positive and cell 2 negative) used as an analog input for cell voltage measurement.
16 VPP power_in Connect to VLDO, the low-dropout regulator output.
17 Thermal pad power_in Exposed thermal pad that must be connected to VSS and soldered to the PCB for thermal and mechanical performance.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-16-EP(3x3)
Category Power Management (PMIC)
Pins 17

CAD (KiCad official)

  • Symbol: BQ76PL102RGTR
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: VQFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: bq76pl102rgtr-etched.step / bq76pl102rgtr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bq76pl102rgtr.step / bq76pl102rgtr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (22 pp, sha256 fe8ff75e3d430c51, retrieved 2026-10-07, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF