Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

TPS73130MDBVREP

Texas Instruments · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-5

TPS73130MDBVREP from Texas Instruments, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in Unregulated input supply to the regulator, with an input voltage range of 1.7 V to 5.5 V and an absolute maximum VIN range of -0.3 V to 6 V.
2 GND power_in Ground reference pin for the regulator.
3 EN input Driving EN high turns on the regulator and driving it low puts the regulator into shutdown mode; EN can be connected to IN if not used, and its absolute maximum range is -0.3 V to 6 V.
4 NR passive For fixed voltage versions only, connecting an external capacitor to this pin bypasses noise generated by the internal bandgap, reducing output noise to very low levels.
5 OUT power_out Output of the regulator, with no output capacitor requirements for stability and an output voltage range of 1.2 V to 5 V for fixed versions.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOT-23-5
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage range VIN 1.7 5.5 V 4
Output voltage accuracy, nominal TA = 25°C VOUT -0.5 0.5 % TA = 25°C 4
Output voltage accuracy over line, load and temperature VOUT -1 1 % VOUT + 0.5 V ≤ VIN ≤ 5.5 V, 10 mA ≤ IOUT ≤ 150 mA 4
Dropout voltage VDO 30 100 mV IOUT = 150 mA (VIN = VOUT (nom), 0.1 V) 4
Output current limit ICL 150 360 500 mA VOUT = 0.9 × VOUT(nom) 4
Reverse leakage current IREV 0.1 15 μA VEN ≤ 0.5 V, 0 V ≤ VIN ≤ VOUT 4
Ground pin current at IOUT = 10 mA IGND 400 550 μA IOUT = 10 mA (IQ) 4
Ground pin current at IOUT = 150 mA IGND 550 750 μA IOUT = 150 mA 4
Shutdown current ISHDN 0.02 1 μA VEN ≤ 0.5 V, VOUT ≤ VIN ≤ 5.5 V 4
Enable high voltage VEN(HI) 1.7 V Enable high (enabled) 4
Enable low voltage VEN(LO) 0 0.5 V Enable low (shutdown) 4
Enable pin current (enabled) IEN(HI) 0.02 0.1 μA VEN = 5.5 V 4
Operating ambient temperature TA -55 125 °C 4
Power-supply rejection ratio at 100 Hz PSRR 58 dB f = 100 Hz, IOUT = 150 mA 4
Power-supply rejection ratio at 10 kHz PSRR 37 dB f = 10 kHz, IOUT = 150 mA 4
Thermal shutdown temperature, shutdown TSD 160 °C Shutdown, temperature increasing 4
Thermal shutdown temperature, reset TSD 140 °C Reset, temperature decreasing 4
Input voltage (absolute maximum) VIN -0.3 6 V Over operating junction temperature range 3
Enable voltage (absolute maximum) VEN -0.3 6 V Over operating junction temperature range 3
Output voltage (absolute maximum) VOUT -0.3 5.5 V Over operating junction temperature range 3
Ambient temperature range (absolute maximum) TA -55 150 °C Over operating junction temperature range 3
Storage temperature range TSTG -65 150 °C 3
ESD rating, HBM ESD 2 kV HBM 3
ESD rating, CDM ESD 500 V CDM 3
Junction-to-ambient thermal resistance, low-K board RΘJA 255 °C/W DBV package, JEDEC Low-K (1s) board 3
Junction-to-ambient thermal resistance, high-K board RΘJA 180 °C/W DBV package, JEDEC High-K (2s2p) board 3
Junction-to-case thermal resistance RΘJC 64 °C/W DBV package 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper out of the IN pin due to voltage applied on the OUT boards are shown in the Power Dissipation Ratings pin. There is additional current flowing into the OUT table. Using heavier copper increases the 15

CAD (KiCad official)

  • Symbol: TPS73130MDBVREP
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: tps73130mdbvrep-etched.step / tps73130mdbvrep-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps73130mdbvrep.step / tps73130mdbvrep.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (23 pp, sha256 095d3e44c142baf2, retrieved 2026-11-06, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF