component
PMEG60T30ELP-QX
Public Made by Adomby adom
Nexperia Schottky Diodes, SOD-128. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownPMEG60T30ELP-QX
Nexperia · Schottky Diodes · SOD-128
PMEG60T30ELP-QX from Nexperia, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode terminal of the Trench MEGA Schottky barrier rectifier, connected to the cathode tab that is referenced as the solder point for thermal resistance. |
| 2 | A | passive | Anode terminal of the Trench MEGA Schottky barrier rectifier. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOD-128 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse voltage | VR | 60 | V | Tj = 25 °C | 2 | ||
| Forward current | IF | 4.2 | A | δ = 1; Tsp ≤ 150 °C | 2 | ||
| Average forward current | IF(AV) | 3 | A | δ = 0.5; f = 20 kHz; square wave; Tsp ≤ 155 °C | 2 | ||
| Non-repetitive peak forward current | IFSM | 50 | A | tp = 8 ms; square wave; Tj(init) = 25 °C | 2 | ||
| Total power dissipation | Ptot | 0.75 | W | Tamb ≤ 25 °C; [1] FR4 PCB, single-sided copper, standard footprint | 2 | ||
| Total power dissipation | Ptot | 1.2 | W | [2] FR4 PCB, single-sided copper, mounting pad for cathode 1 cm2 | 2 | ||
| Junction temperature | Tj | 175 | °C | 2 | |||
| Ambient temperature | Tamb | -55 | 175 | °C | 2 | ||
| Storage temperature | Tstg | -65 | 175 | °C | 2 | ||
| Thermal resistance from junction to ambient in free air | Rth(j-a) | 200 | K/W | In free air; [2] FR4 PCB, single-sided copper, tin-plated, standard footprint | 3 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 120 | K/W | [3] FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 | 3 | ||
| Thermal resistance from junction to solder point | Rth(j-sp) | 12 | K/W | [4] Soldering point of cathode tab | 3 | ||
| Reverse breakdown voltage | V(BR)R | 60 | V | IR = 1 mA; pulsed; Tj = 25 °C [1] | 4 | ||
| Forward voltage | VF | 380 | 450 | mV | IF = 0.1 A; pulsed; Tj = 25 °C [1] | 4 | |
| Forward voltage | VF | 440 | 510 | mV | IF = 0.5 A; pulsed; Tj = 25 °C [1] | 4 | |
| Forward voltage | VF | 470 | 540 | mV | IF = 1 A; pulsed; Tj = 25 °C [1] | 4 | |
| Forward voltage | VF | 515 | 590 | mV | IF = 2 A; pulsed; Tj = 25 °C [1] | 4 | |
| Forward voltage | VF | 550 | 620 | mV | IF = 3 A; pulsed; Tj = 25 °C [1] | 4 | |
| Reverse current | IR | 0.14 | 0.9 | µA | VR = 10 V; pulsed; Tj = 25 °C [1] | 4 | |
| Reverse current | IR | 0.3 | 1.8 | µA | VR = 60 V; pulsed; Tj = 25 °C [1] | 4 |
CAD (KiCad official)
- Symbol:
PMEG60T30ELP-QX - Footprint:
Diode_SMD:D_SOD-128 - 3D model: SOD-128 (KiCad packages3D, STEP)
- 3D model files:
pmeg60t30elp-qx-etched.step/pmeg60t30elp-qx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);pmeg60t30elp-qx.step/pmeg60t30elp-qx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (13 pp, sha256
09dea50ba6723d6a, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).