component
REF192FSZ-REEL7
Public Made by Adomby adom
Analog Devices Voltage Reference, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownREF192FSZ-REEL7
Analog Devices · Voltage Reference · SOIC-8
REF192FSZ-REEL7 from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | TP | unconnected | Test Pin 1 is reserved for in-package Zener zap trimming and the user should leave it unconnected. |
| 2 | VS | power_in | Supply input that must be at least 100 mV above the output voltage to keep the output in regulation (low dropout). |
| 3 | SLEEP | input | Applying a low TTL or CMOS level to this pin turns the output off and reduces supply current to less than 15 µA. |
| 4 | GND | power_in | Ground reference pin for the reference; the datasheet gives no further electrical limits for this pin. |
| 5 | TP | unconnected | Test Pin 5 is reserved for in-package Zener zap trimming and the user should leave it unconnected. |
| 6 | OUTPUT | output | Precision voltage reference output, nominally 2.50 V for the REF192, with a stated high output current of 30 mA. |
| 7 | NC | unconnected | No internal connection; the pin is not connected on the package. |
| 8 | NC | unconnected | No internal connection; the pin is not connected on the package. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | SOIC-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Initial accuracy (F grade) | VO | 2.495 | 2.505 | V | 6 | ||
| Line regulation (F and G grades) | ΔVO/ΔVIN | 4 | 8 | ppm/V | 6 | ||
| Load regulation (F and G grades) | ΔVO/ΔVLOAD | 6 | 15 | ppm/mA | 6 | ||
| Dropout voltage | VS − VO | 1 | V | VS = 3.5 V, ILOAD = 10 mA | 6 | ||
| Dropout voltage | VS − VO | 1.4 | V | VS = 3.9 V, ILOAD = 30 mA | 6 | ||
| Long-term stability | DVO | 1.2 | mV | 1000 hours @ 125°C | 6 | ||
| Noise voltage | eN | 25 | μV p-p | 0.1 Hz to 10 Hz | 6 | ||
| Temperature coefficient (F grade, −40°C to +85°C) | TCVO/°C | 5 | 10 | ppm/°C | 7 | ||
| Line regulation (F and G grades, −40°C to +85°C) | ΔVO/ΔVIN | 10 | 20 | ppm/V | 7 | ||
| Load regulation (F and G grades, −40°C to +85°C) | ΔVO/ΔVLOAD | 10 | 20 | ppm/mA | 7 | ||
| Dropout voltage (−40°C to +85°C) | VS − VO | 1 | V | VS = 3.5 V, ILOAD = 10 mA | 7 | ||
| Dropout voltage (−40°C to +85°C) | VS − VO | 1.5 | V | VS = 4.0 V, ILOAD = 25 mA | 7 | ||
| Logic high input voltage (SLEEP) | VH | 2.4 | V | 7 | |||
| Logic high input current (SLEEP) | IH | -8 | μA | 7 | |||
| Logic low input voltage (SLEEP) | VL | 0.8 | V | 7 | |||
| Logic low input current (SLEEP) | IL | -8 | μA | 7 | |||
| Supply current | 45 | μA | No load | 7 | |||
| Sleep mode supply current | 15 | μA | No load | 7 | |||
| Temperature coefficient (F grade, −40°C to +125°C) | TCVO/°C | 5 | 10 | ppm/°C | 8 | ||
| Line regulation (F and G grades, −40°C to +125°C) | ΔVO/ΔVIN | 10 | 20 | ppm/V | 8 | ||
| Load regulation (F and G grades, −40°C to +125°C) | ΔVO/ΔVLOAD | 10 | 20 | ppm/mA | 8 | ||
| Dropout voltage (−40°C to +125°C) | VS − VO | 1 | V | VS = 3.5 V, ILOAD = 10 mA | 8 | ||
| Supply voltage (absolute maximum) | -0.3 | 18 | V | 16 | |||
| Output to GND (absolute maximum) | -0.3 | V | 16 | ||||
| Storage temperature range (PDIP, SOIC package) | -65 | 150 | °C | 16 | |||
| Junction temperature range (PDIP, SOIC package) | -65 | 150 | °C | 16 | |||
| Lead temperature (soldering) | 300 | °C | Soldering 60 sec | 16 | |||
| Operating temperature range (REF19x) | -40 | 125 | °C | 16 | |||
| Thermal resistance junction-to-ambient (SOIC) | θJA | 158 | °C/W | 8-Lead SOIC (R), soldered in circuit board | 16 | ||
| Thermal resistance junction-to-case (SOIC) | θJC | 43 | °C/W | 8-Lead SOIC (R) | 16 |
CAD (KiCad official)
- Symbol:
REF192FSZ-REEL7 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
ref192fsz-reel7-etched.step/ref192fsz-reel7-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ref192fsz-reel7.step/ref192fsz-reel7.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (28 pp, sha256
71d24ecc74f76ebc, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).