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Contents

README

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AT24C32D-XHM-B

Microchip Tech · Pre-ordered Chips · TSSOP-8

AT24C32D-XHM-B from Microchip Tech, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Hard-wired device address input that must be tied to GND or VCC; if left floating it is internally pulled down to GND, and Microchip recommends a known state with any pull-up resistor 10 kΩ or less.
2 A1 input Hard-wired device address input that must be tied to GND or VCC; if left floating it is internally pulled down to GND, and Microchip recommends a known state with any pull-up resistor 10 kΩ or less.
3 A2 input Hard-wired device address input that must be tied to GND or VCC; if left floating it is internally pulled down to GND, and Microchip recommends a known state with any pull-up resistor 10 kΩ or less.
4 GND power_in Ground reference for the power supply, which should be connected to the system ground.
5 SDA bidirectional Open-drain serial data input/output that must be pulled high with an external pull-up resistor not exceeding 10 kΩ and may be wire-ORed with other open-drain devices on the bus.
6 SCL input Serial clock input that latches SDA input data on its rising edge and clocks SDA output data on its falling edge; it must be forced high when the bus is idle or pulled high with an external pull-up resistor.
7 WP input Write-protect input: connected to GND allows normal write operations, while connected to VCC inhibits writes to the full array; if floating it is internally pulled down to GND.
8 VCC power_in Supplies the device source voltage over the stated 1.7 V to 5.5 V range; operation at invalid VCC voltages may produce spurious results and should not be attempted.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package TSSOP-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Temperature under bias -55 125 °C 9
Storage temperature -65 150 °C 9
VCC VCC 6.25 V 9
Voltage on any pin with respect to ground -1 7 V 9
DC output current 5 mA 9
ESD protection 3 kV 9
Operating Temperature (Case), Industrial Temperature Range -40 85 °C 9
VCC Power Supply, Low Voltage Grade VCC 1.7 5.5 V 9
Supply Voltage VCC1 1.7 5.5 V 9
Supply Current (read) ICC1 0.4 1 mA VCC = 5.0V, Read at 400 kHz 9
Supply Current (write) ICC2 2 3 mA VCC = 5.0V, Write at 400 kHz 9
Standby Current ISB1 1 μA VCC = 1.7V, VIN = VCC or GND 9
Standby Current 6 μA VCC = 5.0V, VIN = VCC or GND 9
Input Leakage Current ILI 0.1 3 μA VIN = VCC or GND; VCC = 5.0V 9
Output Leakage Current ILO 0.05 3 μA VOUT = VCC or GND; VCC = 5.0V 9
Input Low Level VIL -0.6 V Note 2 9
Output Low Level VOL1 0.2 V VCC = 1.7V, IOL = 0.15 mA 10
Output Low Level VOL2 0.4 V VCC = 3.0V, IOL = 2.1 mA 10
Time required after VCC is stable before the device can accept commands tPUP 100 µs 11
Power-on Reset Threshold Voltage VPOR 1.5 V 11
Minimum time at VCC = 0V between power cycles tPOFF 500 ms 11
Input/Output Capacitance (SDA) CI/O 8 pF VI/O = 0V 12
Input Capacitance (A0, A1, A2 and SCL) CIN 6 pF VIN = 0V 12
Write Endurance 1e+06 Write Cycles TA = 25°C, VCC = 3.3V, Page Write mode 12
Data Retention 100 Years TA = 55°C 12
Clock Frequency, SCL fSCL 400 kHz 1.7V column 10
Clock Frequency, SCL fSCL 1000 kHz 2.5V, 5.0V column 10
Clock Pulse Width Low tLOW 1300 ns 1.7V column 10
Clock Pulse Width Low tLOW 500 ns 2.5V, 5.0V column 10
Clock Pulse Width High tHIGH 600 ns 1.7V column 10
Clock Pulse Width High tHIGH 400 ns 2.5V, 5.0V column 10
Noise Suppression Time tI 100 ns 1.7V column 10
Noise Suppression Time tI 50 ns 2.5V, 5.0V column 10
Clock Low to Data Out Valid tAA 50 900 ns 1.7V column 10
Clock Low to Data Out Valid tAA 50 450 ns 2.5V, 5.0V column 10
Bus Free Time between Stop and Start tBUF 1300 ns 1.7V column 10
Bus Free Time between Stop and Start tBUF 500 ns 2.5V, 5.0V column 10
Start Hold Time tHD.STA 600 ns 1.7V column 10
Start Hold Time tHD.STA 250 ns 2.5V, 5.0V column 10
Start Set-up Time tSU.STA 600 ns 1.7V column 10
Start Set-up Time tSU.STA 250 ns 2.5V, 5.0V column 10
Data In Hold Time tHD.DAT 0 ns 1.7V column 10
Data In Set-up Time tSU.DAT 100 ns 1.7V column 10
Inputs Rise Time tR 300 ns 1.7V column 10
Inputs Fall Time tF 300 ns 1.7V column 10
Inputs Fall Time tF 100 ns 2.5V, 5.0V column 10
Stop Set-up Time tSU.STO 600 ns 1.7V column 10
Stop Set-up Time tSU.STO 250 ns 2.5V, 5.0V column 10
Data Out Hold Time tDH 50 ns 1.7V column 10
Write Cycle Time tWR 5 ms 1.7V column 10

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] © 2017 Microchip Technology Inc. 25

CAD (KiCad official)

  • Symbol: AT24C32D-XHM-B
  • Footprint: Package_SO:TSSOP-8_3x3mm_P0.65mm
  • 3D model: TSSOP-8 (KiCad packages3D, STEP)
  • 3D model files: at24c32d-xhm-b-etched.step / at24c32d-xhm-b-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at24c32d-xhm-b.step / at24c32d-xhm-b.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (41 pp, sha256 68bd4a84ddf57535, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF