MAX14781EESA+ from Maxim Integrated, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RO	output	Receiver output; RO is high impedance when RE is high, and the receiver output is logic-high when the inputs are shorted or open (fail-safe).
2	RE	input	Receiver output enable: drive RE low to enable RO, and drive RE high with DE low to enter low-power shutdown; RE is a hot-swap input.
3	DE	input	Driver output enable: drive DE high to enable the driver outputs, which are high impedance when DE is low; DE is a hot-swap input.
4	DI	input	Driver input that controls the driver outputs when the driver is enabled, per the Transmitting Functional Table.
5	GND	power_in	Ground reference for all voltages on the device.
6	A	bidirectional	Noninverting receiver input and driver output at the default power-up polarity; it becomes the inverting input/output when polarity correction is applied.
7	B	bidirectional	Inverting receiver input and driver output at the default power-up polarity; it becomes the noninverting input/output when polarity correction is applied.
8	VCC	power_in	Positive supply, 4.5V to 5.5V per the electrical characteristics, to be bypassed to GND with a 0.1µF capacitor.

Key specifications

Parameter	Value
Manufacturer	Maxim Integrated
Package	SOIC-8
Category	Interface ICs
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply Voltage	VCC	4.5		5.5	V		2
Differential Driver Output	VOD	3			V	RL = 100Ω, Figure 1	2
Differential Driver Output	VOD	2			V	RL = 54Ω, Figure 1	2
Change in Magnitude of Differential Output Voltage	ΔVOD			0.2	V	RL = 100Ω or 54Ω, Figure 1	2
Driver Common-Mode Output Voltage	VOC			3	V	RL = 100Ω or 54Ω, Figure 1 (Note 4)	2
Change in Magnitude of Common-Mode Output Voltage	ΔVOC			0.2	V	RL = 54Ω, Figure 1 (Note 4)	2
Input Voltage High	VIH	3			V	DE, DI, RE	2
Input Voltage Low	VIL			0.8	V	DE, DI, RE	2
Input Current	IIN	-1		1	μA	DE, RE	2
Input Impedance Until First Transition at Power-Up (DE, RE)	RFTPU	3.65		8.8	kΩ	Until the first DE/RE transition occurs, Figure 9 (Note 7)	2
Input Impedance Until First Transition After POR Delay (DE, RE)	RFTPOR	7		60	kΩ	Until the first DE/RE transition occurs, Figure 9	2
Driver Short-Circuit Output Current, output low	IOSD	40		250	mA	Driver is in short circuit (Note 5), 0V ≤ VOUT ≤ 12V	2
Driver Short-Circuit Output Current, output high	IOSD	-250		-40	mA	Driver is in short circuit (Note 5), -7V ≤ VOUT ≤ VCC	2
Input Current (A and B)	IA,B			125	μA	DE = low, VCC = 0V or 5V, VIN = 12V	3
Input Current (A and B)	IA,B	-100			μA	DE = low, VCC = 0V or 5V, VIN = -7V	3
Receiver Differential Threshold, normal mode	VTH1	-200	-125	-50	mV	-7V ≤ VCM ≤ +12V, Normal/noninverted mode	3
Receiver Differential Threshold, inverted mode	VTH2	50	125	200	mV	-7V ≤ VCM ≤ +12V, Inverted mode	3
Receiver Output Voltage Low	VOL			0.4	V	RE = low, ISINK = 1mA	3
Receiver Three-State Output Current	IOZR	-1		1	μA	RE = high, 0V ≤ VRO ≤ VCC	3
Receiver Output Short Circuit Current	IOSR	-110		110	mA	0V ≤ VRO ≤ VCC	3
Maximum A-B Voltage Difference for Inverted Polarity	VPI			-200	mV	(VA - VB) for at least tPM	3
Minimum A-B Voltage Difference for Normal Polarity	VPN	200			mV	(VA - VB) for at least tPM	3
Supply Current	ICC		1.2	1.8	mA	DE = high, RE = low, no load	3
Shutdown Supply Current	ISHDN			10	μA	DE = low, RE = high	3
Thermal Shutdown Threshold	TSHDN		175		°C	Temperature rising	3
Thermal Shutdown Hysteresis	THYST		15		°C		3
Receiver Input Hysteresis	ΔVTH		15		mV	VA + VB = 0V	3
Driver Propagation Delay	tDPLH	200		1000	ns	RL = 54Ω, CL = 50pF, Figures 2, 3	4
Differential Driver Output Skew	tDSKEW			140	ns	RL = 54Ω, CL = 50pF, Figures 2, 3	4
Driver Differential Output Rise or Fall Time	tR, tF	250		900	ns	RL = 54Ω, CL = 50pF, Figures 2, 3	4
Driver Enable to Output High	tDZH			2500	ns	RL = 500Ω, CL = 50pF, Figures 4, 5 (Note 9)	4
Driver Enable to Output Low	tDZL			2500	ns	RL = 500Ω, CL = 50pF, Figures 4, 5 (Note 9)	4
Driver Disable Time from Low	tDLZ			100	ns	RL = 500Ω, CL = 50pF, Figures 4, 5 (Note 9)	4
Driver Disable Time from High	tDHZ			100	ns	RL = 500Ω, CL = 50pF, Figures 4, 5 (Note 9)	4
Driver Enable from Shutdown to Output High	tDZH(SHDN)			5.5	μs	RL = 1kΩ, CL = 15pF, Figures 4, 5 (Note 9)	4
Driver Enable from Shutdown to Output Low	tDZL(SHDN)			5.5	μs	RL = 1kΩ, CL = 15pF, Figures 4, 5 (Note 9)	4
Time to Shutdown	tSHDN	50	340	700	ns	(Note 10)	4
Receiver Propagation Delay	tRPLH			200	ns	CL = 15pF, Figures 6, 7	4
Receiver Output Skew	tRSKEW			30	ns	CL = 15pF, Figures 6, 7	4
Receiver Maximum Data Rate	DRMAX	0.125		500	kbps		4
Receiver Enable to Output High	tRZH			50	ns	RL = 1kΩ, CL = 15pF, Figure 8 (Note 9)	4
Receiver Enable to Output Low	tRZL			50	ns	RL = 1kΩ, CL = 15pF, Figure 8 (Note 9)	5
Receiver Disable Time from Low	tRLZ			50	ns	RL = 1kΩ, CL = 15pF, Figure 8 (Note 9)	5
Receiver Disable Time from High	tRHZ			50	ns	RL = 1kΩ, CL = 15pF, Figure 8 (Note 9)	5
Receiver Enable from Shutdown to Output High	tRZH(SHDN)			5.5	μs	RL = 1kΩ, CL = 15pF, Figure 8 (Note 9)	5
Receiver Enable from Shutdown to Output Low	tRZL(SHDN)			5.5	μs	RL = 1kΩ, CL = 15pF, Figure 8 (Note 9)	5
ESD Protection (A and B Pins), Human Body Model			25		kV	Human Body Model	3
ESD Protection (A and B Pins), IEC 61000-4-2 Air Gap			15		kV	IEC 61000-4-2 Air Gap Discharge to GND	3
ESD Protection (A and B Pins), IEC 61000-4-2 Contact			9		kV	IEC 61000-4-2 Contact Discharge to GND	3
ESD Protection (All Other Pins)			2		kV	Human Body Model	3
Supply Voltage (absolute maximum)	VCC	-0.3		6	V	All voltages referenced to GND	2
DE, DI Voltage (absolute maximum)		-0.3		6	V	All voltages referenced to GND	2
A, B Voltage (absolute maximum)		-8		13	V	All voltages referenced to GND	2
Operating Temperature Range		-40		85	°C		2
Junction Temperature				150	°C		2
Storage Temperature Range		-65		150	°C		2
Lead Temperature (soldering 10 sec)				300	°C		2
Soldering Temperature (reflow)				260	°C		2

CAD (KiCad official)

Symbol: MAX14781EESA+
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: max14781eesa-etched.step / max14781eesa-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max14781eesa.step / max14781eesa.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Maxim Integrated datasheet (19 pp, sha256 6af64a6c2b73893d, retrieved 2026-11-02, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

MAX14781EESA+

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3D Model

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