component
RT6150BGQW
Public Made by Adomby adom
Richtek Tech DC-DC Converters, WSON-10-EP(2.5x2.5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownRT6150BGQW
Richtek Tech · DC-DC Converters · WSON-10-EP(2.5x2.5)
RT6150BGQW from Richtek Tech, in a WSON-10-EP(2.5x2.5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUT | power_out | Output of the Buck-Boost converter; connect a capacitor between VOUT and GND. |
| 2 | LX2 | passive | Second switch node; connect this pin to the inductor. |
| 3 | GND | power_in | Power ground; the exposed pad must be soldered to a large PCB and connected to GND for maximum power dissipation. |
| 4 | LX1 | passive | First switch node; connect this pin to the inductor. |
| 5 | VIN | power_in | Power input; connect an at least 10µF capacitor between VIN and GND. |
| 6 | EN | input | Enable control input for the Buck-Boost converter; EN high starts operation with soft-start and EN low shuts the device down. |
| 7 | PS | input | PSM control input; pull low for PSM operation and pull high for fixed-frequency operation. |
| 8 | VINA | power_in | Supply voltage input for the control circuit; UVLO requires VINA above 1.65V to enable the converter. |
| 9 | GND | power_in | Power ground, one of three GND pins that must connect to the common ground. |
| 10 | FB | input | Feedback input; for adjustable versions connect a resistive divider (output adjustable from 1.8V to 5.5V), and for the fixed version it must be connected to VOUT. |
| 11 | GND | power_in | Power ground, one of three GND pins; the exposed pad must be soldered to a large PCB and connected to GND for maximum power dissipation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Richtek Tech |
| Package | WSON-10-EP(2.5x2.5) |
| Category | Power Management (PMIC) |
| Pins | 11 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage UVLO High-Level | 1.65 | 1.8 | V | 4 | |||
| Input Voltage UVLO Low-Level | 1.4 | 1.55 | V | 4 | |||
| Feedback Voltage | VFB | 0.495 | 0.5 | 0.505 | V | VPS = VIN | 4 |
| Feedback Input Current | 1 | 50 | nA | VFB = 0.5V | 4 | ||
| Shutdown Current (Leakage) | 0.1 | 1 | μA | EN = 0V, not including switch leakage | 4 | ||
| N-MOSFET Switch Leakage | 0.1 | 5 | μA | 4 | |||
| P-MOSFET Switch Leakage | 0.1 | 10 | μA | 4 | |||
| Switch Current Limit | ILIM | 1.6 | A | VIN = 3.6V | 4 | ||
| Oscillator Frequency | fOSC | 0.8 | 1 | 1.2 | MHz | 4 | |
| Soft-Start Time | tSS | 0.65 | 1 | ms | Time from when EN signal asserts to output voltage IOUT = 0mA | 4 | |
| EN and PS Input Logic-High Voltage | 1.2 | V | 5 | ||||
| EN and PS Input Logic-Low Voltage | 0.4 | V | 5 | ||||
| EN and PS Input Current | 0.01 | 1 | μA | VEN = VPS = VIN | 5 | ||
| Thermal Shutdown | TSD | 140 | °C | 5 | |||
| VOUT, VIN, EN, PS, VINA, FB Pin Voltage | -0.3 | 6 | V | 4 | |||
| Switch Output Voltage LX1, LX2 Pin | -0.3 | 6 | V | 4 | |||
| Switch Output Voltage LX1, LX2 Pin (transient) | -2 | 7.5 | V | < 10ns | 4 | ||
| Power Dissipation PD, WDFN-10 2.5x2.5 | PD | 2.44 | W | TA = 25°C | 4 | ||
| Junction Temperature | 150 | °C | 4 | ||||
| Storage Temperature Range | -65 | 150 | °C | 4 | |||
| Lead Temperature (Soldering) | 260 | °C | 10 sec. | 4 | |||
| ESD Susceptibility HBM | 2 | kV | HBM | 4 | |||
| ESD Susceptibility MM | 200 | V | MM | 4 | |||
| Supply Input Voltage | VIN | 1.8 | 5.5 | V | 4 | ||
| Junction Temperature Range | -40 | 125 | °C | 4 | |||
| Ambient Temperature Range | -40 | 85 | °C | 4 | |||
| Package Thermal Resistance Junction-to-Ambient, WDFN-10 2.5x2.5 | θJA | 40.9 | °C/W | Note 2, JEDEC 51-7 four-layer board | 4 | ||
| Package Thermal Resistance Junction-to-Case, WDFN-10 2.5x2.5 | θJC | 18.6 | °C/W | measured at exposed pad | 4 | ||
| Quiescent Current, Power Save Mode | 60 | μA | IOUT = 0mA, PS = 0V (Note 5) | 4 | |||
| N-MOSFET Switch On Resistance | RDS(ON)_N | 0.15 | 4 | ||||
| P-MOSFET Switch On Resistance | RDS(ON)_P | 0.15 | 4 |
CAD (KiCad official)
- Symbol:
RT6150BGQW - Footprint:
Package_SON:WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm - 3D model: WSON-10-EP(2.5x2.5) (KiCad packages3D, STEP)
- 3D model files:
rt6150bgqw-etched.step/rt6150bgqw-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rt6150bgqw.step/rt6150bgqw.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Richtek Tech datasheet (13 pp, sha256
048971dce8b8a2c3, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).