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Contents

README

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ESD56181W09-2

WILLSEMI Will Semicon · ESD And Surge Protection (TVS/ESD) · SOD-323

ESD56181W09-2 from WILLSEMI Will Semicon, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Pin1 passive Terminal 1 of the uni-directional TVS, with voltage measured from pin 1 to pin 2 for the ESD56181W09 (reverse stand-off VRWM 9.0 V, breakdown VBR 9.7 V min, leakage 0.1 µA max at VRWM).
2 Pin2 passive Terminal 2 of the uni-directional TVS, the reference for the pin 1 to pin 2 measurements in Table 3, with forward voltage 0.60 V min to 1.10 V max at IF = 20 mA.

Key specifications

Parameter Value
Manufacturer WILLSEMI Will Semicon
Package SOD-323
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak pulse power (tp = 8/20μs) Ppk 1800 W tp = 8/20μs 2
ESD according to IEC61000-4-2 air discharge VESD -30 30 kV IEC61000-4-2 air discharge 2
ESD according to IEC61000-4-2 contact discharge VESD -30 30 kV IEC61000-4-2 contact discharge 2
Junction temperature TJ 125 oC 2
Operating temperature TOP -40 85 oC 2
Lead temperature TL 260 oC 2
Storage temperature TSTG -55 150 oC 2
Reverse stand-off voltage VRWM 9 V 3
Breakdown voltage VBR 9.7 10.5 11.3 V IBR = 1mA 3
Reverse leakage current IRM 0.1 μA at VRWM 3
Forward voltage VF 0.6 1.1 V IF = 20mA 3
Junction capacitance 600 700 pF F = 1MHz, VR=0V 3
Rated peak pulse current IPP 90 A 8/20μs waveform per IEC61000-4-5, non-repetitive (notes 1, 2) 3
Clamping voltage VCL 17 20 V at IPP, non-repetitive per IEC61000-4-5 / IEC61000-4-2 (notes 1, 2) 3

CAD (KiCad official)

  • Symbol: ESD56181W09-2
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: esd56181w09-2-etched.step / esd56181w09-2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd56181w09-2.step / esd56181w09-2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WILLSEMI Will Semicon datasheet (6 pp, sha256 1bc91373e0256c4a, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF