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BD00IC0MEFJ-ME2
Public Made by Adomby adom
ROHM Semicon Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBD00IC0MEFJ-ME2
ROHM Semicon · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOP-8-EP
BD00IC0MEFJ-ME2 from ROHM Semicon, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VO | power_out | Regulated output pin; requires a ceramic output capacitor of 1.0μF or more to GND, output current up to 1.0A. |
| 2 | FB | input | Feedback pin (FB/Vo_s) for the variable type, regulated to 0.800V typ. with external divider R1, R2 (R1+R2 = 1k to 90kΩ recommended) to set VO from 0.8V to 4.5V. |
| 3 | GND | power_in | Ground pin. |
| 4 | N.C. | unconnected | Non connection pin; can be connected to GND or left open. |
| 5 | EN | input | Enable pin; low 0 to 0.8V shuts down the device, high 2.4V to 5.5V enables it (absolute maximum 7.0V). |
| 6 | N.C. | unconnected | Non connection pin; can be connected to GND or left open. |
| 7 | N.C. | unconnected | Non connection pin; can be connected to GND or left open. |
| 8 | VCC | power_in | Input supply pin, recommended operating range 2.4V to 5.5V (absolute maximum 7.0V), with a ceramic input capacitor of 1.0μF or more. |
| 9 | FIN | passive | Reverse-side exposed fin (substrate), to be connected to GND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | SOP-8-EP |
| Category | Power Management (PMIC) |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Circuit current at shutdown | ISD | 0 | 5 | µA | EN=0V, OFF mode, 25℃ | 4 | |
| Circuit current at shutdown | ISD | 5 | µA | EN=0V, OFF mode, -40~105℃ | 4 | ||
| Bias current | ICC | 250 | 500 | µA | 25℃ | 4 | |
| Bias current | ICC | 700 | µA | -40~105℃ | 4 | ||
| Line regulation | Reg.I | 25 | 50 | mV | VCC=(Vo+0.6V)→5.5V, 25℃ | 4 | |
| Line regulation | Reg.I | 50 | mV | VCC=(Vo+0.6V)→5.5V, -40~105℃ | 4 | ||
| Load regulation | Reg IO | 25 | 75 | mV | IO=0→1.0A, 25℃ | 4 | |
| Load regulation | Reg IO | 75 | mV | IO=0→1.0A, -40~105℃ | 4 | ||
| Minimum dropout voltage | VCO | 0.4 | 0.6 | V | VCC=3.3V, IO=1.0A, 25℃ | 4 | |
| Minimum dropout voltage | VCO | 0.9 | V | VCC=3.3V, IO=1.0A, -40~105℃ | 4 | ||
| Output reference voltage (variable type) | VFB | 0.792 | 0.8 | 0.808 | V | IO=0mA, 25℃ | 4 |
| Output reference voltage (variable type) | VFB | 0.776 | 0.824 | V | IO=0mA, -40~105℃ | 4 | |
| EN Low voltage | VEN(Low) | 0 | 0.8 | V | 25℃ and -40~105℃ | 4 | |
| EN High voltage | VEN(High) | 2.4 | 5.5 | V | 25℃ and -40~105℃ | 4 | |
| EN Bias current | IEN | 1 | 3 | 9 | µA | 25℃ | 4 |
| EN Bias current | IEN | 9 | µA | -40~105℃ | 4 | ||
| Power supply voltage | VCC | 7 | V | Ta=25℃; not to exceed Pd | 4 | ||
| EN voltage | VEN | 7 | V | Ta=25℃ | 4 | ||
| Power dissipation HTSOP-J8 | Pd | 2110 | mW | Reduced by 16.9mW/℃ above Ta 25℃; 70mm×70mm×1.6mm glass-epoxy two layer board | 4 | ||
| Operating temperature range | Topr | -40 | 105 | ℃ | 4 | ||
| Storage temperature range | Tstg | -55 | 150 | ℃ | 4 | ||
| Junction temperature | Tjmax | 150 | ℃ | 4 | |||
| Input power supply voltage | VCC | 2.4 | 5.5 | V | Ta=25℃ | 4 | |
| EN voltage | VEN | 0 | 5.5 | V | Ta=25℃ | 4 | |
| Output voltage setting range | VO | 0.8 | 4.5 | V | Ta=25℃ | 4 | |
| Output current | IO | 0 | 1 | A | Ta=25℃ | 4 | |
| Thermal resistance junction-ambient | θj-a | 249.5 | ℃/W | IC only | 14 | ||
| Thermal resistance junction-ambient | θj-a | 153.2 | ℃/W | 1-layer (copper foil 0mm×0mm), 70mm×70mm×1.6mm board | 14 | ||
| Thermal resistance junction-ambient | θj-a | 113.6 | ℃/W | 2-layer (copper foil 15mm×15mm), 70mm×70mm×1.6mm board | 14 | ||
| Thermal resistance junction-ambient | θj-a | 59.2 | ℃/W | 2-layer (copper foil 70mm×70mm), 70mm×70mm×1.6mm board | 14 | ||
| Thermal resistance junction-ambient | θj-a | 33.3 | ℃/W | 4-layer (copper foil 70mm×70mm), 70mm×70mm×1.6mm board | 14 | ||
| TSD ON temperature | 175 | ℃ | typ. | 18 | |||
| TSD hysteresis temperature | 15 | ℃ | typ. | 18 |
CAD (KiCad official)
- Symbol:
BD00IC0MEFJ-ME2 - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm - 3D model: SOP-8-EP (KiCad packages3D, STEP)
- 3D model files:
bd00ic0mefj-me2-etched.step/bd00ic0mefj-me2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bd00ic0mefj-me2.step/bd00ic0mefj-me2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (24 pp, sha256
3bb765f22c0d6388, retrieved 2026-10-27, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).