component
TPA0211DGNR
Public Made by Adomby adom
Texas Instruments Audio Amplifiers, HVSSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads on click. Unloads only if this page sits in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads on click. Unloads only if this page sits in the background.
PCB Footprint
Open full view ↗Loads on click. Unloads only if this page sits in the background.
Datasheet
Open in new tab ↗Loads on click. Unloads only if this page sits in the background.
README
markdownTPA0211DGNR
Texas Instruments · Audio Amplifiers · HVSSOP-8
TPA0211DGNR from Texas Instruments, in a HVSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | input | Audio input terminal |
| 2 | SHUTDOWN | input | Shutdown control that places entire device in shutdown mode when held low; TTL compatible input |
| 3 | VDD | power_in | Supply voltage terminal (2.5 V to 5.5 V operating range) |
| 4 | BYPASS | input | Bypass tap to voltage divider for internal mid-supply bias; connect to 0.1-µF to 1-µF capacitor |
| 5 | VO+ | output | Positive audio output for BTL and SE modes |
| 6 | SE/BTL | input | Mode selection input: held low for BTL mode, held high for SE mode |
| 7 | GND | power_in | Ground connection |
| 8 | VO- | output | Negative audio output in BTL mode; high-impedance output in SE mode |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HVSSOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
TPA0211DGNR - Footprint:
Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm - 3D model: HVSSOP-8, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
tpa0211dgnr-etched.step/tpa0211dgnr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tpa0211dgnr.step/tpa0211dgnr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (37 pp, sha256
b6d5396eedd57b7b, retrieved 2026-10-05, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).