component
MCP2200-I
Public Made by Adomby adom
Microchip Tech USB ICs, SSOP-20-208mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMCP2200-I
Microchip Tech · USB ICs · SSOP-20-208mil
MCP2200-I from Microchip Tech, in a SSOP-20-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Power supply input with an operating voltage of 3.0V-5.5V; VDD sets the logic-high level of the Rx/Tx and RTS/CTS GPIO pins. |
| 2 | OSC1 | input | Oscillator input; the input clock must be 12 MHz for the USB module. |
| 3 | OSC2 | output | Oscillator output for the 12 MHz quartz crystal or ceramic resonator. |
| 4 | RST | input | Reset input that must be externally biased; holding it low generates a Reset, and a resistor of 1 kΩ to 10 kΩ to VDD enables the on-chip POR. |
| 5 | GP7/TxLED | bidirectional | General purpose I/O pin GP7; alternate function is the USB transmit activity LED output (TxLED). |
| 6 | GP6/RxLED | bidirectional | General purpose I/O pin GP6; alternate function is the USB receive activity LED output (RxLED). |
| 7 | GP5 | bidirectional | General purpose I/O pin GP5. |
| 8 | GP4 | bidirectional | General purpose I/O pin GP4. |
| 9 | GP3 | bidirectional | General purpose I/O pin GP3. |
| 10 | Tx | output | UART TX output of the USART. |
| 11 | RTS | output | Hardware flow control 'Request to Send' output signal. |
| 12 | Rx | input | UART RX input of the USART. |
| 13 | CTS | input | Hardware flow control 'Clear to Send' input signal. |
| 14 | GP2 | bidirectional | General purpose I/O pin GP2. |
| 15 | GP1/USBCFG | bidirectional | General purpose I/O pin GP1; alternate function is the USB configuration status output (USBCFG), which goes high after the device configures on USB. |
| 16 | GP0/SSPND | bidirectional | General purpose I/O pin GP0; alternate function is the USB suspend status output (SSPND), which is active-low when USB Suspend is issued by the host. |
| 17 | VUSB | power_out | USB power pin internally connected to 3.3V that must be locally bypassed with a high-quality ceramic capacitor (0.22 µF to 0.47 µF recommended). |
| 18 | D- | bidirectional | USB D- data line. |
| 19 | D+ | bidirectional | USB D+ data line. |
| 20 | VSS | power_in | Ground reference for the device. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SSOP-20-208mil |
| Category | Interface ICs |
| Pins | 20 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VDD | 3 | 5.5 | V | 3.0V VDD 5.5V at -40C TA +85C (I-Temp) | 27 | |
| Operating Temperature | TA | -40 | 85 | °C | I-Temp | 29 | |
| Ambient temperature under bias | -40 | 85 | °C | 26 | |||
| Storage temperature | -65 | 150 | °C | 26 | |||
| Voltage on VDD with respect to VSS | VDD | -0.3 | 6 | V | with respect to VSS | 26 | |
| Voltage on MCLR with respect to Vss | MCLR | -0.3 | 9 | V | with respect to Vss | 26 | |
| Voltage on VUSB pin with respect to VSS | VUSB | -0.3 | 4 | V | with respect to VSS | 26 | |
| Maximum current out of VSS pin | 95 | mA | 26 | ||||
| Maximum current into VDD pin | 95 | mA | 26 | ||||
| Clamp current | IK | 20 | mA | VPIN < 0 or VPIN > VDD | 26 | ||
| Maximum current sunk by all ports | 90 | mA | 26 | ||||
| Maximum current sourced by all ports | 90 | mA | 26 | ||||
| Supply Current | IDD | 10 | 12 | mA | VDD = 3.0V; FOSC = 12 MHz (330 nF on VUSB) | 27 | |
| Supply Current | IDD | 13 | 15 | mA | VDD = 5.0V; FOSC = 12 MHz (330 nF on VUSB) | 27 | |
| VDD Rise Rate to Ensure Power-on Reset | SVDD | 0.05 | V/ms | Design guidance only, Not tested | 27 | ||
| Input Low-Voltage TTL (CTS pin) | VIL | 0.8 | V | 4.5V VDD 5.5V | 27 | ||
| Input High-Voltage TTL (RTS pin) | VIH | 2 | V | 4.5V VDD 5.5V | 27 | ||
| Input Leakage Current GPIO, CTS | IIL | -100 | 100 | nA | VSS VPIN VDD, pin at high Z | 27 | |
| Input Leakage Current RST | IIL | -200 | 200 | nA | 27 | ||
| Input Leakage Current OSC1 | IIL | -100 | 100 | nA | 27 | ||
| Output Low-Voltage GPIO, UART Tx/Rx | VOL | 0.6 | V | IOL = 8.0 mA, VDD = 5.0V | 27 | ||
| Capacitive Loading OSC2 | COSC2 | 15 | pF | 27 | |||
| Capacitive Loading GPIO | CIO | 50 | pF | 27 | |||
| USB Voltage | VUSB | 3 | 3.6 | V | Voltage on Vusb pin must be in this range for proper USB operation | 28 | |
| Input Leakage on Pin | Iil | -1 | 1 | μA | Vss VPIN VDD pin at high-impedance | 28 | |
| Input Low Voltage for USB Buffer | Vilusb | 0.8 | V | For Vusb range | 28 | ||
| Input High Voltage for USB Buffer | Vihusb | 2 | V | For Vusb range | 28 | ||
| Differential Input Sensitivity | Vdifs | 0.2 | V | The difference between D+ and D- must exceed this value while Vcm is met | 28 | ||
| Differential Common Mode Range | Vcm | 0.8 | 2.5 | V | 28 | ||
| Driver Output Impedance | Zout | 28 | 44 | 28 | |||
| Voltage Output Low | Vol | 0 | 0.3 | V | 1.5 kload connected to 3.6V | 28 | |
| Voltage Output High | Voh | 2.8 | 3.6 | V | 1.5 kload connected to ground | 28 | |
| Clock input accuracy | -0.25 | 0.25 | % | 12 MHz input clock | 9 | ||
| Clock input accuracy | -2500 | 2500 | ppm | 12 MHz input clock | 9 | ||
| Power-Up Timer | TPWRT | 40 | 65 | 140 | ms | 31 | |
| MCLR Pulse Width (low) | TRST | 2 | μs | 31 | |||
| EEPROM endurance | 100 | K | erase/write cycles | 8 | |||
| Thermal Resistance Junction to Ambient, SSOP | θJA | 108.1 | C/W | 20-pin SSOP package | 29 | ||
| Thermal Resistance Junction to Case, SSOP | θJC | 24 | C/W | 20-pin SSOP package | 29 | ||
| Maximum Junction Temperature | TJMAX | 150 | C | 29 | |||
| Oscillator Start-Up Time | TOST | 1024 | TOST | 31 |
CAD (KiCad official)
- Symbol:
MCP2200-I - Footprint:
Package_SO:SSOP-20_5.3x7.2mm_P0.65mm - 3D model: SSOP-20-208mil (KiCad packages3D, STEP)
- 3D model files:
mcp2200-i-etched.step/mcp2200-i-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp2200-i.step/mcp2200-i.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (44 pp, sha256
7715ea566328c5fe, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).