AD5258BRMZ1-R7 from Analog Devices, in a MSOP-10. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	W	passive	Wiper terminal, constrained to GND ≤ VW ≤ VDD.
2	AD0	input	Programmable pin 0 for multiple package decoding, with its state registered on power-up.
3	AD1	input	Programmable pin 1 for multiple package decoding, with its state registered on power-up.
4	SDA	bidirectional	Serial data input/output for the I2C-compatible interface.
5	SCL	input	Serial clock input, positive edge triggered.
6	VLOGIC	power_in	Logic power supply for the interface, specified at 5 V ±10% or 3 V ±10%.
7	GND	power_in	Digital ground.
8	VDD	power_in	Positive power supply, operating from a 3 V to 5 V single supply.
9	B	passive	B terminal, constrained to GND ≤ VB ≤ VDD.
10	A	passive	A terminal, constrained to GND ≤ VA ≤ VDD.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	MSOP-10
Category	ADC/DAC/Data Conversion
Pins	10

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Power Supply Range	VDD	2.7		5.5	V		4
Logic Supply	VLOGIC	2.7		5.5	V		4
Operating Temperature Range	TA	-40		85	°C		3
VDD to GND	VDD	-0.3		7	V	TA = 25°C	6
Digital Inputs and Output Voltage to GND		0		7	V		6
IMAX Pulsed	IMAX	-20		20	mA	Pulsed	6
IMAX Continuous	IMAX	-5		5	mA	Continuous	6
Operating Temperature Range		-40		85	°C		6
Maximum Junction Temperature	TJMAX			150	°C		6
Storage Temperature		-65		150	°C		6
Reflow Soldering Peak Temperature				260	°C		6
Time at Peak Temperature		20		40	sec		6
Thermal Resistance θJA	θJA		200		°C/W	MSOP-10	6
Positive Supply Current	IDD		0.5	2	µA		4
Logic Supply Current	ILOGIC		3	6	µA	VIH = 5 V or VIL = 0 V, −40°C < TA < 85°C	4
Logic Supply Current	ILOGIC			9	µA	VIH = 5 V or VIL = 0 V, 85°C < TA < 125°C	4
Programming Mode Current (EEPROM)	ILOGIC(PROG)		35		mA	VIH = 5 V or VIL = 0 V	4
Power Dissipation	PDISS		20	40	µW	VIH = 5 V or VIL = 0 V, VDD = 5 V	4
Leakage Current SDA, AD0, AD1 (low input)	IIL	-1	0.01	1	µA	VIN = 0 V or 5 V	3
Leakage Current SCL Logic High	IIL	-2.5	-1.4	1	µA	VIN = 0 V	3
Leakage Current SCL Logic Low	IIL	-1	0.01	1	µA	VIN = 5 V	3
Input Capacitance	CIL		5		pF		3
Capacitance A	CA		45		pF	f = 1 MHz, measured to GND, code = 0x20	3
Capacitance B	CB		45		pF	f = 1 MHz, measured to GND, code = 0x20	3
Capacitance W	CW		60		pF	f = 1 MHz, measured to GND, code = 0x20	3
Common-Mode Leakage Current	ICM		10		nA	VA = VB = VDD/2	3
Total Wiper Resistance	RWB		75	350	Ω	Code = 0x00	3
Resistance Temperature Coefficient	(ΔRAB × 10^6)/(RAB × ΔT)		200		ppm/°C	Code = 0x00	3
Resistance Temperature Coefficient	(ΔRAB × 10^6)/(RAB × ΔT)		15		ppm/°C	Code = 0x20	3
Voltage Divider Temperature Coefficient	(ΔVW × 10^6)/(VW × ΔT)		120		ppm/°C	Code = 0x00	3
Voltage Divider Temperature Coefficient	(ΔVW × 10^6)/(VW × ΔT)		15		ppm/°C	Code = 0x20	3
Power Supply Rejection Ratio	PSRR	-0.06	0.01	0.06	%/%	VDD = +5 V ± 10%, Code = 0x20	4
I2C SCL Clock Frequency	fSCL	0		400	kHz		5
Bus-Free Time Between Stop and Start	tBUF	1.3			µs		5
Hold Time (Repeated start)	tHD;STA	0.6			µs		5
Low Period of SCL Clock	tLOW	1.3			µs		5
High Period of SCL Clock	tHIGH	0.6			µs		5
Setup Time for Repeated Start Condition	tSU;STA	0.6			µs		5
Data Hold Time	tHD;DAT	0		0.9	µs		5
Data Setup Time	tSU;DAT	100			ns		5
Fall Time of Both SDA and SCL	tF			300	ns		5
Rise Time of Both SDA and SCL	tR			300	ns		5
Setup Time for Stop Condition	tSU;STO	0.6			µs		5
EEPROM Data Storing Time	tEEMEM_STORE			26	ms		5
EEPROM Data Restoring Time at Power On	tEEMEM_RESTORE1			300	µs	VDD rise time dependant. Measure without decoupling capacitors at VDD and GND.	5
EEPROM Data Restoring Time upon Restore Command	tEEMEM_RESTORE2			300	µs	VDD = 5 V	5
EEPROM Data Rewritable Time	tEEMEM_REWRITE			540	µs		5
Endurance		100	700		kCycles	Qualified to JEDEC A117 at −40°C, +25°C, +85°C; typ at +25°C	5
Data Retention		100			Years	TJ = 55°C per JEDEC A117	5

CAD (KiCad official)

Symbol: AD5258BRMZ1-R7
Footprint: Package_SO:MSOP-10_3x3mm_P0.5mm
3D model: MSOP-10 (KiCad packages3D, STEP)
3D model files: ad5258brmz1-r7-etched.step / ad5258brmz1-r7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ad5258brmz1-r7.step / ad5258brmz1-r7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (24 pp, sha256 74f43a20356ca908, retrieved 2026-11-02, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

AD5258BRMZ1-R7

Verified AD5258BRMZ1-R7

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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