component
HMC7992LP3DETR
Public Made by Adomby adom
Analog Devices RF Switches, LFCSP-16(3x3). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHMC7992LP3DETR
Analog Devices · RF Switches · LFCSP-16(3x3)
HMC7992LP3DETR from Analog Devices, in a LFCSP-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RF4 | bidirectional | RF port 4, DC-coupled and 50 Ω matched; DC blocking capacitor required on this pin. |
| 2 | GND | power_in | Ground connected to package bottom exposed metal pad for RF/DC ground plane. |
| 3 | GND | power_in | Ground connected to package bottom exposed metal pad for RF/DC ground plane. |
| 4 | RF3 | bidirectional | RF port 3, DC-coupled and 50 Ω matched; DC blocking capacitor required on this pin. |
| 5 | GND | power_in | Ground connected to package bottom exposed metal pad for RF/DC ground plane. |
| 6 | VDD | power_in | Supply voltage input; recommended 3.3 V to 5.0 V. |
| 7 | B | input | Logic control input B for 2:4 decoder; selects one of four RF paths with input A. |
| 8 | A | input | Logic control input A for 2:4 decoder; selects one of four RF paths with input B. |
| 9 | RF2 | bidirectional | RF port 2, DC-coupled and 50 Ω matched; DC blocking capacitor required on this pin. |
| 10 | GND | power_in | Ground connected to package bottom exposed metal pad for RF/DC ground plane. |
| 11 | GND | power_in | Ground connected to package bottom exposed metal pad for RF/DC ground plane. |
| 12 | RF1 | bidirectional | RF port 1, DC-coupled and 50 Ω matched; DC blocking capacitor required on this pin. |
| 13 | GND | power_in | Ground connected to package bottom exposed metal pad for RF/DC ground plane. |
| 14 | GND | power_in | Ground connected to package bottom exposed metal pad for RF/DC ground plane. |
| 15 | RFC | bidirectional | RF common port, DC-coupled and 50 Ω matched; DC blocking capacitor required on this pin. |
| 16 | GND | power_in | Ground connected to package bottom exposed metal pad for RF/DC ground plane. |
| 17 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | LFCSP-16(3x3) |
| Category | RF And Wireless |
| Pins | 17 |
CAD (KiCad official)
- Symbol:
HMC7992LP3DETR - Footprint:
Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm - 3D model: LFCSP-16(3x3) (KiCad packages3D, STEP)
- 3D model files:
hmc7992lp3detr-etched.step/hmc7992lp3detr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hmc7992lp3detr.step/hmc7992lp3detr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (12 pp, sha256
568c1778043a2b19, retrieved 2026-09-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).