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Contents

README

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HMC7992LP3DETR

Analog Devices · RF Switches · LFCSP-16(3x3)

HMC7992LP3DETR from Analog Devices, in a LFCSP-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RF4 bidirectional RF port 4, DC-coupled and 50 Ω matched; DC blocking capacitor required on this pin.
2 GND power_in Ground connected to package bottom exposed metal pad for RF/DC ground plane.
3 GND power_in Ground connected to package bottom exposed metal pad for RF/DC ground plane.
4 RF3 bidirectional RF port 3, DC-coupled and 50 Ω matched; DC blocking capacitor required on this pin.
5 GND power_in Ground connected to package bottom exposed metal pad for RF/DC ground plane.
6 VDD power_in Supply voltage input; recommended 3.3 V to 5.0 V.
7 B input Logic control input B for 2:4 decoder; selects one of four RF paths with input A.
8 A input Logic control input A for 2:4 decoder; selects one of four RF paths with input B.
9 RF2 bidirectional RF port 2, DC-coupled and 50 Ω matched; DC blocking capacitor required on this pin.
10 GND power_in Ground connected to package bottom exposed metal pad for RF/DC ground plane.
11 GND power_in Ground connected to package bottom exposed metal pad for RF/DC ground plane.
12 RF1 bidirectional RF port 1, DC-coupled and 50 Ω matched; DC blocking capacitor required on this pin.
13 GND power_in Ground connected to package bottom exposed metal pad for RF/DC ground plane.
14 GND power_in Ground connected to package bottom exposed metal pad for RF/DC ground plane.
15 RFC bidirectional RF common port, DC-coupled and 50 Ω matched; DC blocking capacitor required on this pin.
16 GND power_in Ground connected to package bottom exposed metal pad for RF/DC ground plane.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Analog Devices
Package LFCSP-16(3x3)
Category RF And Wireless
Pins 17

CAD (KiCad official)

  • Symbol: HMC7992LP3DETR
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: LFCSP-16(3x3) (KiCad packages3D, STEP)
  • 3D model files: hmc7992lp3detr-etched.step / hmc7992lp3detr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hmc7992lp3detr.step / hmc7992lp3detr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (12 pp, sha256 568c1778043a2b19, retrieved 2026-09-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF