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Contents

README

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G50N03D5

GOFORD · MOSFETs · DFN-8L(5x6)

G50N03D5 from GOFORD, in a DFN-8L(5x6). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source terminal of the N-channel MOSFET. Pins 1, 2, and 3 are internally tied together as the source connection; typically bonded to the ground/return rail in low-side switching. Body diode anode.
2 S passive Source terminal (parallel connection with pins 1 and 3) to share current and reduce package resistance/inductance. Rated for ID = 50A continuous, IDM = 200A pulsed.
3 S passive Source terminal (parallel connection with pins 1 and 2). Body-diode anode; VSD ≤ 1.2V at ISD = 20A.
4 G input Gate terminal. Controls the channel via VGS; threshold VGS(th) = 1.1-2.4V (typ 1.6V). Absolute maximum VGS = ±20V. Total gate charge Qg ≈ 38.4nC at VGS = 10V.
5 D passive Drain terminal. Pins 5, 6, 7, 8 (and the exposed thermal pad) are internally the drain connection for the N-channel MOSFET. VDS rating = 30V. Body-diode cathode.
6 D passive Drain terminal (parallel with pins 5, 7, 8 and exposed pad). Used to carry drain current and conduct heat to the PCB.
7 D passive Drain terminal (parallel with pins 5, 6, 8 and exposed pad). Continuous drain current ID = 50A at TC = 25°C.
8 D passive Drain terminal (parallel with pins 5, 6, 7 and exposed thermal pad). All drain leads plus the pad should be soldered together to a copper plane to meet the 4.9°C/W junction-to-case thermal spec.

Key specifications

Parameter Value
Manufacturer GOFORD
Package DFN-8L(5x6)
Category Transistors/Thyristors
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • G50N03D5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 30 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID 50 A 1
Pulsed Drain Current IDM 200 A note 1 1
Power Dissipation PD 25.5 W 1
Single pulse avalanche energy EAS 81 mJ note 2 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 ºC 1
Thermal Resistance, Junction-to-Ambient RthJA 49.8 ºC/W 1
Maximum Junction-to-Case RthJC 4.9 ºC/W 1
Drain-Source Breakdown Voltage V(BR)DSS 30 V VGS = 0V, ID = 250µA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS = 30 V, VGS = 0V 2
Gate-Source Leakage IGSS -100 100 nA VGS = ±20V 2
Gate-Source Threshold Voltage VGS(th) 1.1 1.6 2.4 V VDS = VGS, ID = 250µA 2
Drain-Source On-Resistance RDS(on) 3.2 4 mΩ VGS = 10V, ID = 20A 2
Drain-Source On-Resistance RDS(on) 5.9 7 mΩ VGS = 4.5V, ID = 20A 2
Continuous Body Diode Current IS 50 A TC = 25ºC 2
Body Diode Voltage VSD 1.2 V TJ = 25ºC, ISD = 20A, VGS = 0V 2

CAD (KiCad official)

  • Symbol: G50N03D5
  • Footprint: Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm
  • 3D model: DFN-8L(5x6) (KiCad packages3D, STEP)
  • 3D model files: g50n03d5-etched.step / g50n03d5-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); g50n03d5.step / g50n03d5.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GOFORD datasheet (None pp, sha256 731b3d4e30fe7344, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF