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Contents

README

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PMEG2005EH

Nexperia · Schottky Barrier Diodes (SBD) · SOD-123F

PMEG2005EH from Nexperia, in a SOD-123F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Schottky barrier rectifier, marked by the marking bar; the device is rated for a reverse voltage VR of 20 V (Tamb = 25 °C) and a forward current IF of 0.5 A (Tsp ≤ 55 °C).
2 A passive Anode of the Schottky barrier rectifier; the repetitive peak forward current IFRM is limited to 7 A (tp ≤ 1 ms; δ ≤ 0.25) and the non-repetitive peak forward current IFSM to 10 A (tp = 8 ms).

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-123F
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
reverse voltage VR 20 V Tamb = 25 °C 2
forward current IF 0.5 A Tsp ≤ 55 °C 2
repetitive peak forward current IFRM 7 A tp ≤ 1 ms; δ ≤ 0.25 2
non-repetitive peak forward current IFSM 10 A tp = 8 ms; square wave; Tj(init) = 25 °C 2
total power dissipation Ptot 375 mW Tamb ≤ 25 °C; [1] FR4 PCB, single-sided copper, tin-plated, standard footprint 2
total power dissipation Ptot 830 mW [2] FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 2
junction temperature Tj 150 °C 2
ambient temperature Tamb -65 150 °C 2
storage temperature Tstg -65 150 °C 2
thermal resistance from junction to ambient in free air Rth(j-a) 330 K/W in free air; [2] FR4 PCB, single-sided copper, tin-plated, standard footprint 2
thermal resistance from junction to ambient in free air (mounting pad for cathode 1 cm²) 150 K/W in free air; [1][3] FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² 2
thermal resistance from junction to solder point Rth(j-sp) 60 K/W 2
forward voltage VF 90 130 mV IF = 0.1 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C 3
forward voltage VF 150 190 mV IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C 3
forward voltage VF 210 240 mV IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C 3
forward voltage VF 280 330 mV IF = 100 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C 3
forward voltage VF 355 390 mV IF = 500 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C 3
reverse current IR 15 40 µA VR = 10 V; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C 3
reverse current IR 40 200 µA VR = 20 V; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C 3
diode capacitance Cd 66 80 pF VR = 1 V; f = 1 MHz; Tamb = 25 °C 3

CAD (KiCad official)

  • Symbol: PMEG2005EH
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123F (KiCad packages3D, STEP)
  • 3D model files: pmeg2005eh-etched.step / pmeg2005eh-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg2005eh.step / pmeg2005eh.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (8 pp, sha256 3a0882ba9f0d5723, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF