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LM2750SDX-ADJ
Public Made by Adomby adom
Texas Instruments DC-DC Converters, WSON-10-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLM2750SDX-ADJ
Texas Instruments · DC-DC Converters · WSON-10-EP(3x3)
LM2750SDX-ADJ from Texas Instruments, in a WSON-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUT | power_out | Output voltage pin that must be connected externally; for the ADJ version the output is set between 3.8 V and 5.2 V. |
| 2 | VOUT | power_out | Output voltage pin that must be connected externally; for the ADJ version the output is set between 3.8 V and 5.2 V. |
| 3 | FB | input | Feedback pin on the LM2750-ADJ that sets the output voltage; on the LM2750-5.0 this pin is GND instead. |
| 4 | SD | input | Active-low shutdown input with an internal 200-kΩ resistor to GND that pulls the pin to 0 V and shuts the part down when left floating. |
| 5 | GND | power_in | Ground pin that must be connected externally to the other ground pins and the DAP. |
| 6 | GND | power_in | Ground pin that must be connected externally to the other ground pins and the DAP. |
| 7 | CAP- | passive | Flying capacitor negative terminal, connected to the external 1 µF flying capacitor. |
| 8 | VIN | power_in | Input voltage pin that must be connected externally; the input range is 2.7 V to 5.6 V. |
| 9 | VIN | power_in | Input voltage pin that must be connected externally; the input range is 2.7 V to 5.6 V. |
| 10 | CAP+ | passive | Flying capacitor positive terminal, connected to the external 1 µF flying capacitor. |
| 11 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-10-EP(3x3) |
| Category | Power Supply Chip |
| Pins | 11 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VIN pin voltage to GND | -0.3 | 6 | V | 4 | |||
| SD pin voltage to GND | -0.3 | V | 4 | ||||
| Junction temperature, TJ-MAX-ABS | TJ | 150 | °C | 4 | |||
| Maximum output current | 175 | mA | 4 | ||||
| Maximum lead temperature (soldering) | 260 | °C | 5 seconds | 4 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| LM2750-ADJ input voltage | 2.7 | V | 3.8 V ≤ VOUT ≤ 4.9 V; max is (VOUT + 0.7) V | 4 | |||
| LM2750-ADJ input voltage | 2.7 | 5.6 | V | 4.9 V ≤ VOUT ≤ 5.2 V | 4 | ||
| LM2750-ADJ output voltage | 3.8 | 5.2 | V | 4 | |||
| Recommended output current | 0 | 120 | mA | 2.9 V ≤ VIN ≤ 5.6 V | 4 | ||
| Recommended output current | 0 | 40 | mA | 2.7 V ≤ VIN ≤ 2.9 V | 4 | ||
| Junction temperature | TJ | -40 | 125 | °C | 4 | ||
| Ambient temperature | TA | -40 | 85 | °C | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 45.6 | °C/W | 5 | |||
| Junction-to-case (top) thermal resistance | RθJC(top) | 46.2 | °C/W | 5 | |||
| Junction-to-board thermal resistance | RθJB | 21.5 | °C/W | 5 | |||
| Junction-to-top characterization parameter | ψJT | 0.7 | °C/W | 5 | |||
| Junction-to-board characterization parameter | ψJB | 21.8 | °C/W | 5 | |||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 6.5 | °C/W | 5 | |||
| Current limit | ILIM | 300 | mA | VOUT shorted to GND | 5 | ||
| Operating supply current | IQ | 5 | 10 | mA | IOUT = 0 mA, TJ = 25°C, VIH(MIN) ≤ V(SD) ≤ VIN | 5 | |
| Operating supply current | IQ | 12 | mA | IOUT = 0 mA, VIH(MIN) ≤ V(SD) ≤ VIN | 5 | ||
| Shutdown supply current | ISD | 2 | µA | V(SD) = 0V | 5 | ||
| Feedback pin voltage (LM2750-ADJ) | VFB | 1.17 | 1.232 | 1.294 | V | VIN = 3.1 V | 5 |
| Feedback pin input current (LM2750-ADJ) | IFB | 1 | nA | VFB = 1.4 V | 5 | ||
| Output ripple | VR | 4 | mVp-p | COUT = 10 µF, IOUT = 100 mA | 5 | ||
| Output ripple | VR | 15 | mVp-p | COUT = 2.2 µF, IOUT = 100 mA | 5 | ||
| Switching frequency | ƒSW | 1 | 1.7 | MHz | 5 | ||
| Logic-high SD input | VIH | 1.3 | V | max is VIN | 6 | ||
| Logic-low SD input | VIL | 0 | 0.4 | V | 6 | ||
| SD input current | IIH | 15 | 50 | µA | 1.3 V ≤ V(SD) ≤ VIN | 6 | |
| SD input current | IIL | -1 | 1 | µA | V(SD) = 0 V | 6 | |
| Required input capacitance | CIN | 1 | µF | IOUT ≤ 60 mA | 6 | ||
| Required input capacitance | CIN | 2 | µF | 60 mA ≤ IOUT ≤ 120 mA | 6 | ||
| Required output capacitance | COUT | 1 | µF | IOUT ≤ 60 mA | 6 | ||
| Required output capacitance | COUT | 2 | µF | 60 mA ≤ IOUT ≤ 120 mA | 6 | ||
| VOUT turnon time | tON | 0.5 | ms | VIN = 3 V, IOUT = 100 mA | 6 |
CAD (KiCad official)
- Symbol:
LM2750SDX-ADJ - Footprint:
Package_SON:VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm - 3D model: WSON-10-EP(3x3) (KiCad packages3D, STEP)
- 3D model files:
lm2750sdx-adj-etched.step/lm2750sdx-adj-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm2750sdx-adj.step/lm2750sdx-adj.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (29 pp, sha256
c7095b23764710eb, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).