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Contents

README

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TLV62090RGTT

Texas Instruments · DC-DC Converters · QFN-16-EP(3x3)

TLV62090RGTT from Texas Instruments, in a QFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW bidirectional Switch pin of the power stage (datasheet classifies it as I/O); pins 1 and 2 are both SW.
2 SW bidirectional Switch pin of the power stage (datasheet classifies it as I/O); pins 1 and 2 are both SW.
3 DEF input Used for internal logic and needs to be pulled high; it should not be left floating.
4 PG output Open-drain power good output that is high impedance when the output is within regulation and pulled low when below nominal; the pull-up resistor must not be connected to any voltage higher than the device input voltage.
5 FB input Feedback pin; connect a resistor divider to set the output voltage.
6 AGND power_in Analog ground; the exposed thermal pad is connected to AGND.
7 CP bidirectional Internal charge pump flying capacitor; connect a 10 nF capacitor between CP and CN.
8 CN bidirectional Internal charge pump flying capacitor; connect a 10 nF capacitor between CP and CN.
9 SS input Soft-start control pin; a capacitor on this pin sets the soft-start time, and leaving it floating sets the minimum start-up time.
10 AVIN power_in Bias supply input voltage pin.
11 PVIN power_in Power supply input voltage pin; input voltage range is 2.5 V to 5.5 V.
12 PVIN power_in Power supply input voltage pin; input voltage range is 2.5 V to 5.5 V.
13 EN input Device enable; must be pulled high to enable the device and pulled low to disable it, with an internal pull-down of typically 400 kΩ active when EN is low.
14 PGND power_in Power ground connection.
15 PGND power_in Power ground connection.
16 VOS input Output voltage sense pin; must be connected to the output voltage.
17 Exposed Thermal Pad passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package QFN-16-EP(3x3)
Category Power Management (PMIC)
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Voltage range PVIN, AVIN, FB, SS, EN, DEF, VOS -0.3 7 V 5
Voltage range SW (DC), PG -0.3 V 5
Voltage range SW (AC, less than 10 ns) -3 10 V less than 10 ns 5
Voltage range CN, CP -0.3 V 5
Power Good sink current PG 1 mA 5
Operating junction temperature range TJ -40 150 °C 5
Storage temperature Tstg -65 150 °C 5
Input voltage range VIN 2.5 5.5 V 5
Operating ambient temperature TA -40 85 °C 5
Operating junction temperature TJ -40 125 °C 5
Input voltage range VIN 2.5 5.5 V 6
Shutdown current Isd 0.6 5 µA Into PVIN and AVIN 6
Undervoltage lockout threshold VUVLO 2.1 2.2 2.3 V VIN falling 6
Softstart current ISS 6.3 7.5 8.7 µA 6
Power good threshold, output voltage rising VTH_PG 93 95 97 % Output voltage rising 6
Power good threshold, output voltage falling VTH_PG 88 90 92 % Output voltage falling 6
Input leakage current (EN) Ilkg 10 100 nA EN = GND or VIN 6
Leakage current (PG) Ilkg 10 100 nA VPG = 3.6 V 6
High side FET switch current limit ILIMF 3.7 4.6 5.5 A 6
Output voltage range VOUT 0.8 V 6
Feedback voltage accuracy (PWM, TJ = 25°C) VFB -1 1 % VIN ≥ VOUT + 1 V; IOUT = 1 A, PWM mode, TJ = 25°C 6
Feedback voltage accuracy (PWM) VFB -1.4 1.4 % VIN ≥ VOUT + 1 V; IOUT = 1 A, PWM mode 6
Feedback voltage accuracy (PFM, VOUT ≥ 1.2 V) VFB -1.4 3 % VIN ≥ VOUT + 1 V; IOUT = 0 mA, VOUT ≥ 1.2 V, PFM mode 6
Feedback voltage accuracy (PFM, VOUT < 1.2 V) VFB -1.4 3.7 % VIN ≥ VOUT + 1 V; IOUT = 0 mA, VOUT < 1.2 V, PFM mode 6
Feedback input bias current IFB 10 100 nA VFB = 0.8 V 6
Junction-to-ambient thermal resistance RθJA 47 °C/W 5
Junction-to-case (top) thermal resistance RθJC(top) 60 °C/W 5
Junction-to-board thermal resistance RθJB 20 °C/W 5
Junction-to-top characterization parameter ψJT 1.5 °C/W 5
Junction-to-board characterization parameter ψJB 20 °C/W 5
Junction-to-case (bottom) thermal resistance RθJC(bot) 5.3 °C/W 5

CAD (KiCad official)

  • Symbol: TLV62090RGTT
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: QFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: tlv62090rgtt-etched.step / tlv62090rgtt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlv62090rgtt.step / tlv62090rgtt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 0986be12af6c7689, retrieved 2026-10-11, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF