component
ESD3Z3V3BU
Public Made by Adomby adom
MDD(Microdiode Electronics) ESD Protection Devices, SOD-323. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownESD3Z3V3BU
MDD(Microdiode Electronics) · ESD Protection Devices · SOD-323
ESD3Z3V3BU from MDD(Microdiode Electronics), in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Pin 1 is one terminal of the single-line ESD protection diode, which the datasheet rates for 3.3V reverse working voltage, 0.25pF typical capacitance, and ±15kV air / ±8kV contact IEC 61000-4-2 protection. |
| 2 | 2 | passive | Pin 2 is the other terminal of the single-line ESD protection diode, which the datasheet rates for 3.3V reverse working voltage, 0.25pF typical capacitance, and ±15kV air / ±8kV contact IEC 61000-4-2 protection. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MDD(Microdiode Electronics) |
| Package | SOD-323 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Working Voltage | VRWM | 3.3 | V | 2 | |||
| Reverse Breakdown Voltage | VBR | 4.2 | V | IT = 1mA | 2 | ||
| Reverse Leakage Current | IR | 100 | nA | VRWM = 3.3V | 2 | ||
| Clamping Voltage | VC | 12 | V | IPP = 1A, tp = 8/20μs | 2 | ||
| Clamping Voltage | VC | 25 | V | IPP = 4A, tp = 8/20μs | 2 | ||
| Junction Capacitance | CJ | 0.25 | 0.4 | pF | VR = 0V, f = 1MHz | 2 | |
| ESD per IEC 61000-4-2 (Air) | VESD | -20 | 20 | KV | ESD per IEC 61000-4-2 (Air) | 1 | |
| ESD per IEC 61000-4-2 (Contact) | VESD | -20 | 20 | KV | ESD per IEC 61000-4-2 (Contact) | 1 | |
| Peak Pulse Power | PPP | 100 | W | 8/20us | 1 | ||
| Operating Temperature | TOPT | -55 | 125 | °C | 1 | ||
| Lead Solder Temperature - Maximum | TL | 260 | °C | 10 second duration | 1 | ||
| Storage Temperature | TSTG | -55 | 150 | °C | 1 |
CAD (KiCad official)
- Symbol:
ESD3Z3V3BU - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
esd3z3v3bu-etched.step/esd3z3v3bu-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esd3z3v3bu.step/esd3z3v3bu.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MDD(Microdiode Electronics) datasheet (4 pp, sha256
aa34183650a93ae0, retrieved 2026-11-05, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).