component

1TG100DHNS001R

Public Made by Adom

by adom

KDS Daishinku Crystals, DT-26. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

componentcrystals, oscillators, resonators1tg100dhns001rfactory-2.0.0extractor-text
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3D Model

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Symbol & Footprint

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PCB Footprint

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Datasheet

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Contents

README

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1TG100DHNS001R

KDS Daishinku · Crystals · DT-26

1TG100DHNS001R from KDS Daishinku, in a DT-26. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of a two-terminal crystal; either orientation.
2 2 passive Terminal 2 of a two-terminal crystal; either orientation.

Key specifications

Parameter Value
Manufacturer KDS Daishinku
Package DT-26
Category Crystals, Oscillators, Resonators
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Frequency tolerance -20 20 ×10-6 2
Drive level tolerance -0.2 0.2 μW 2
Drive level 1 2 μW 2
Series resistance 40 kΩ 2
Insulation resistance 500 MΩ DC100±15V (Lead to lead, Lead to case) 2
Operating temperature range -10 60 °C 2
Storage temperature range -20 70 °C 2
Parabolic coefficient -0.04 ×10-6 / °C2 2
Turnover temperature tolerance -5 5 °C 2
Frequency variation after tests (Table-1 grade A) -3 3 ×10-6 Table-1 grade A, after shock, vibration, heat and humidity tests 7
Series resistance variation after tests (Table-1 grade A) -15 15 % Table-1 grade A, after tests; larger of ±15 % or ±5 kΩ applies 7
Series resistance variation after tests (Table-1 grade A), absolute -5 5 kΩ Table-1 grade A, after tests; use larger specification 7
Lead dipping soldering temperature 280 °C Dipping at leads, 5 s max 8
Lead dipping soldering temperature 260 °C Dipping at leads, 10 s max 8
Hand soldering temperature 350 °C Hand soldering, 3 s max 8
Package temperature limit 150 °C Package temperature; characteristic deterioration may occur at or above this value 8
Storage temperature 40 °C Storage, to preserve solderability 8
Storage humidity 80 % Storage, non-condensing 8
Turnover temperature 25 °C 2
Nominal frequency 40.003 kHz 1
Loading capacitance (CL) CL 10 pF 2
Shunt capacitance 0.75 pF 2

CAD (KiCad official)

  • Symbol: 1TG100DHNS001R
  • Footprint: Crystal:Crystal_DS26_D2.0mm_L6.0mm_Vertical
  • 3D model: DT-26 (KiCad packages3D, STEP)
  • 3D model files: 1tg100dhns001r-etched.step / 1tg100dhns001r-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1tg100dhns001r.step / 1tg100dhns001r.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: KDS Daishinku datasheet (10 pp, sha256 ``, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary crystal numbering (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF