component
S3M
Public Made by Adomby adom
TWGMC Diodes - General Purpose, SMB. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownS3M
TWGMC · Diodes - General Purpose · SMB
S3M from TWGMC, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TWGMC |
| Package | SMB |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage (S3M) | VRRM | 1000 | V | S3M column (1000 V variant) | 1 | ||
| Maximum RMS voltage (S3M) | VRMS | 700 | V | S3M column (1000 V variant) | 1 | ||
| Maximum DC blocking voltage (S3M) | VDC | 1000 | V | S3M column (1000 V variant) | 1 | ||
| Operating junction and storage temperature range | TJ,TSTG | -50 | 150 | C | 1 | ||
| Maximum average forward rectified current | I(AV) | 3 | Amps | at TL=110 C | 1 | ||
| Peak forward surge current | IFSM | 100 | Amps | 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) | 1 | ||
| Maximum instantaneous forward voltage | VF | 1.1 | Volts | at 3.0A | 1 | ||
| Maximum DC reverse current | IR | 5 | µA | TA=25 C, at rated DC blocking voltage | 1 | ||
| Maximum DC reverse current | IR | 100 | µA | TA=100 C, at rated DC blocking voltage | 1 | ||
| Typical junction capacitance | CJ | 60 | pF | Measured at 1MHz and applied reverse voltage of 4.0V D.C. | 1 | ||
| Typical thermal resistance, junction to ambient | RθJA | 50 | C/W | P.C.B. mounted with 0.2x0.2" (5.0x5.0mm) copper pad areas | 1 |
CAD (KiCad official)
- Symbol:
S3M - Footprint:
Diode_SMD:D_SMB - 3D model: SMB (KiCad packages3D, STEP)
- 3D model files:
s3m-etched.step/s3m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);s3m.step/s3m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TWGMC datasheet (2 pp, sha256
992648d509e5ed77, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).