Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity

3D Model

Open in new tab ↗

Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗

Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗

Loads when you scroll to it. Unloads after 5 minutes in the background.

Datasheet

Open in new tab ↗

Loads when you scroll to it. Unloads after 5 minutes in the background.

Download PDF

Contents

Pinout
Key specifications
Electrical characteristics
Materials and finish
CAD (KiCad official)
Provenance

README

markdown

ESP32-H2-MINI-1-H4

Espressif Systems · RF and Wireless · 61-SMD Module

ESP32-H2-MINI-1-H4 from Espressif Systems, in a 61-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	GND	power_in	Ground.
2	GND	power_in	Ground.
3	3V3	power_in	Power supply; VDD33 recommended operating range is 3.0 to 3.6 V with 3.3 V typical.
4	NC	unconnected	Marked NC in Table 3; no function is assigned.
5	IO2	bidirectional	GPIO2 with alternate functions FSPIWP, ADC1_CH1 and MTMS.
6	IO3	bidirectional	GPIO3 with alternate functions FSPIHD, ADC1_CH2 and MTDO.
7	NC	unconnected	Marked NC in Table 3; no function is assigned.
8	EN	input	High enables the chip and low powers it off; do not leave the EN pin floating.
9	IO0	bidirectional	GPIO0 with alternate function FSPIQ.
10	IO1	bidirectional	GPIO1 with alternate functions FSPICS0 and ADC1_CH0.
11	GND	power_in	Ground.
12	IO13	bidirectional	GPIO13 with alternate function XTAL_32K_P.
13	IO14	bidirectional	GPIO14 with alternate function XTAL_32K_N.
14	GND	power_in	Ground.
15	VBAT	power_in	Connected to internal 3V3 power supply by default, or to an external battery power supply of 3.0 to 3.6 V.
16	IO12	bidirectional	GPIO12.
17	NC	unconnected	Marked NC in Table 3; no function is assigned.
18	IO4	bidirectional	GPIO4 with alternate functions FSPICLK, ADC1_CH3 and MTCK.
19	IO5	bidirectional	GPIO5 with alternate functions FSPID, ADC1_CH4 and MTDI.
20	IO10	bidirectional	GPIO10 with alternate function ZCD0.
21	IO11	bidirectional	GPIO11 with alternate function ZCD1.
22	IO8	bidirectional	GPIO8, which is also a chip boot mode strapping pin.
23	IO9	bidirectional	GPIO9, which is also a chip boot mode strapping pin with a weak pull-up by default.
24	IO22	bidirectional	GPIO22.
25	IO25	bidirectional	GPIO25 with alternate function FSPICS3; also the JTAG signal source strapping pin.
26	IO26	bidirectional	GPIO26 with alternate functions FSPICS4 and USB_D-.
27	IO27	bidirectional	GPIO27 with alternate functions FSPICS5 and USB_D+.
28	NC	unconnected	Marked NC in Table 3; no function is assigned.
29	NC	unconnected	Marked NC in Table 3; no function is assigned.
30	RXD0	bidirectional	Pin named RXD0 carrying GPIO23 with alternate functions FSPICS1 and U0RXD.
31	TXD0	bidirectional	Pin named TXD0 carrying GPIO24 with alternate functions FSPICS2 and U0TXD.
32	NC	unconnected	Marked NC in Table 3; no function is assigned.
33	NC	unconnected	Marked NC in Table 3; no function is assigned.
34	NC	unconnected	Marked NC in Table 3; no function is assigned.
35	NC	unconnected	Marked NC in Table 3; no function is assigned.
36	GND	power_in	Ground.
37	GND	power_in	Ground.
38	GND	power_in	Ground.
39	GND	power_in	Ground.
40	GND	power_in	Ground.
41	GND	power_in	Ground.
42	GND	power_in	Ground.
43	GND	power_in	Ground.
44	GND	power_in	Ground.
45	GND	power_in	Ground.
46	GND	power_in	Ground.
47	GND	power_in	Ground.
48	GND	power_in	Ground.
49	GND	power_in	Ground; the datasheet notes soldering this EPAD to the base board ground is optional but improves thermal performance.
50	GND	power_in	Ground.
51	GND	power_in	Ground.
52	GND	power_in	Ground.
53	GND	power_in	Ground.

Key specifications

Parameter	Value
Manufacturer	Espressif Systems
Package	61-SMD Module
Category	RF and Wireless
Pins	53

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Power supply voltage	VDD33	-0.3		3.6	V		24
Storage temperature	TSTORE	-40		105	°C		24
Power supply voltage	VDD33	3	3.3	3.6	V		24
Current delivered by external power supply	IVDD	0.35			A		24
Operating ambient temperature	TA	-40		105	°C		24
Low-level input voltage	VIL	-0.3			V	DC Characteristics (3.3 V, 25 °C)	24
Chip reset voltage	VIL_nRST	-0.3			V	DC Characteristics (3.3 V, 25 °C)	24
High-level input current	IIH			50	nA	DC Characteristics (3.3 V, 25 °C)	24
Low-level input current	IIL			50	nA	DC Characteristics (3.3 V, 25 °C)	24

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	THERMOPLASTIC		HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;	36
contacts	COPPER ALLOY	gold	CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;	36
shell	COPPER ALLOY	gold	SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;	36

CAD (KiCad official)

Symbol: ESP32-H2-MINI-1-H4
Footprint: PCM_Espressif:ESP32-H2-MINI-1
3D model: 61-SMD Module (KiCad packages3D, STEP)
3D model files: esp32-h2-mini-1-h4-etched.step / esp32-h2-mini-1-h4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-h2-mini-1-h4.step / esp32-h2-mini-1-h4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Espressif Systems datasheet (45 pp, sha256 33f21dd6428aa348, retrieved 2026-10-28, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF