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Contents

README

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APX810-26SAG-7

Diodes Incorporated · Supervisor And Reset ICs · SOT-23

APX810-26SAG-7 from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 RESET output Push-pull reset output, active high for the APX810; it asserts when VCC falls below the 2.63V typical threshold and stays asserted for the reset timeout period (200ms typ) after VCC rises above it.
3 VCC power_in Operating voltage input, 1.1V to 5.5V recommended supply range (absolute maximum -0.3V to +6.0V).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC Range VCC 1 5.5 V TA = 0°C to +70°C 3
Supply Current ICC 30 40 μA VTH + 0.2V 3
Reset Threshold (APX809/810-26) VTH 2.59 2.63 2.69 V TA = 0°C to +85°C 3
Reset Threshold (APX809/810-26) VTH 2.57 2.63 2.69 V TA = -40°C to +85°C 3
Output Voltage Low (RESET, APX810) VOL 0.3 V VCC = VTH +0.2, ISINK = 1.2mA 3
Output Voltage Low (RESET, APX810) VOL 0.4 V VCC = VTH +0.2, ISINK = 3.2mA 3
Reset Active Timeout Period tDELAY 140 200 280 ms TA = 0°C to +85°C 3
Reset Threshold Tempco 30 ppm/oC 3
Supply Voltage (recommended) VCC 1.1 5.5 V 3
Operating Ambient Temperature Range TA -40 85 oC 3
VCC Rising Time tR 100 µs VCC = 0 to VT 3
ESD Human Body Model Protection ESD HBM 5 kV 2
ESD Machine Model Protection ESD MM 500 V 2
Supply Voltage VCC -0.3 6 V 2
Input Current, VCC ICC 20 mA 2
Output Current, RESET, RESET IO 20 mA 2
Continuous Power Dissipation PD 400 mW TA = +70°C, de-rate 4mW/°C above +70°C 2
Operating Junction Temperature Range TOP -40 105 °C 2
Storage Temperature Range TST -65 150 °C 2
Set-up Time tS 20 μs VCC = VTH to (VTH - 100mV) 3
Thermal Resistance Junction-to-Ambient θJA 201 oC/W SOT23 (Note 4): FR-4 PCB, 2oz copper, minimum recommended pad layout 3
Thermal Resistance Junction-to-Case θJC 56 oC/W SOT23 (Note 4): FR-4 PCB, 2oz copper, minimum recommended pad layout 3

CAD (KiCad official)

  • Symbol: APX810-26SAG-7
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: apx810-26sag-7-etched.step / apx810-26sag-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); apx810-26sag-7.step / apx810-26sag-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (8 pp, sha256 6cea3bdb5cde9297, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF