component
HX293DDRG
Public Made by Adomby adom
HANSCHIP semiconductor Stepper Motor Driver, SOP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
README
markdownHX293DDRG
HANSCHIP semiconductor · Stepper Motor Driver · SOP-20
HX293DDRG from HANSCHIP semiconductor, in a SOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ENABLE1 | input | Enable input for channels 1 and 2 (OUTPUT1 and OUTPUT2); high (2.3 V to Vss) enables them, low (max 1.5 V) turns them off to high impedance. |
| 2 | INPUT1 | input | Logic input controlling OUTPUT1, TTL compatible with low level max 1.5 V and high level 2.3 V to Vss. |
| 3 | OUTPUT1 | tri_state | Driver output 1 with 600 mA continuous (1 A peak, under 5 ms) capability and internal clamp diodes, high impedance when ENABLE1 is low. |
| 4 | GND | power_in | Ground pin, also used for heat dissipation. |
| 5 | GND | power_in | Ground pin, also used for heat dissipation. |
| 6 | GND | power_in | Ground pin, also used for heat dissipation. |
| 7 | GND | power_in | Ground pin, also used for heat dissipation. |
| 8 | OUTPUT2 | tri_state | Driver output 2 with 600 mA continuous (1 A peak, under 5 ms) capability and internal clamp diodes, high impedance when ENABLE1 is low. |
| 9 | INPUT2 | input | Logic input controlling OUTPUT2, TTL compatible with low level max 1.5 V and high level 2.3 V to Vss. |
| 10 | VS | power_in | Output driver supply voltage, Vss to 36 V operating (absolute maximum 36 V). |
| 11 | ENABLE2 | input | Enable input for channels 3 and 4 (OUTPUT3 and OUTPUT4); high (2.3 V to Vss) enables them, low (max 1.5 V) turns them off to high impedance. |
| 12 | INPUT3 | input | Logic input controlling OUTPUT3, TTL compatible with low level max 1.5 V and high level 2.3 V to Vss. |
| 13 | OUTPUT3 | tri_state | Driver output 3 with 600 mA continuous (1 A peak, under 5 ms) capability and internal clamp diodes, high impedance when ENABLE2 is low. |
| 14 | GND | power_in | Ground pin, also used for heat dissipation. |
| 15 | GND | power_in | Ground pin, also used for heat dissipation. |
| 16 | GND | power_in | Ground pin, also used for heat dissipation. |
| 17 | GND | power_in | Ground pin, also used for heat dissipation. |
| 18 | OUTPUT4 | tri_state | Driver output 4 with 600 mA continuous (1 A peak, under 5 ms) capability and internal clamp diodes, high impedance when ENABLE2 is low. |
| 19 | INPUT4 | input | Logic input controlling OUTPUT4, TTL compatible with low level max 1.5 V and high level 2.3 V to Vss. |
| 20 | VSS | power_in | Logic supply voltage, 4.5 V to 7 V recommended (5 V typical, absolute maximum 8 V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HANSCHIP semiconductor |
| Package | SOP-20 |
| Category | Motor Driver ICs |
| Pins | 20 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage (Vs), absolute maximum | Vs | 36 | V | 3 | |||
| Logic supply voltage (Vss), absolute maximum | Vss | 8 | V | 3 | |||
| Input voltage, absolute maximum | Vi | 6 | V | 3 | |||
| Enable voltage, absolute maximum | Ven | 6 | V | 3 | |||
| Maximum output current (non-sustained peak) | Io(MAX) | 1 | A | 不可持续，持续时间<5ms | 3 | ||
| Maximum continuous output current | Io | 600 | mA | 3 | |||
| Maximum power | P | 4 | W | 3 | |||
| Maximum junction temperature | TJ | 150 | ℃ | 3 | |||
| Storage temperature range | T | -55 | 150 | ℃ | 3 | ||
| Lead temperature (soldering) | TLEAD | 245 | ℃ | 焊接 10s | 3 | ||
| Supply voltage (Vs), recommended | Vs | 36 | V | 4 | |||
| Logic supply voltage (Vss), recommended | Vss | 4.5 | 7 | V | 4 | ||
| High-level input voltage | 2.3 | V | Vss≤6V | 4 | |||
| High-level input voltage | 2.3 | 6 | V | Ven≥6V | 4 | ||
| Low-level input voltage | 0 | 1.5 | V | 4 | |||
| Operating temperature | 0 | 70 | ℃ | 4 | |||
| Supply voltage (Vs, Pin 8) | Vs | 36 | V | 工作情况下 | 4 | ||
| Logic supply voltage (Vss, Pin 16) | Vss | 4.5 | 5 | 7 | V | 4 | |
| Quiescent current (Pin 8) | Is | 6 | mA | Ven=H; IL=0, Vi=L | 4 | ||
| Quiescent current (Pin 8) | Is | 24 | mA | Ven=H; IL=0, Vi=H | 4 | ||
| Quiescent current (Pin 8) | Is | 4 | mA | Ven=L, Vi=X | 4 | ||
| Logic quiescent current (Pin 16) | Iss | 60 | mA | Ven=H; IL=0, Vi=L | 4 | ||
| Logic quiescent current (Pin 16) | Iss | 22 | mA | Ven=H; IL=0, Vi=H | 4 | ||
| Logic quiescent current (Pin 16) | Iss | 24 | mA | Ven=L, Vi=X | 4 | ||
| Input low voltage (pins 2,7,10,15) | ViL | -0.3 | 1.5 | V | 4 | ||
| Input high voltage (pins 2,7,10,15) | ViH | 2.3 | V | 4 | |||
| Low-level input current (pins 2,7,10,15) | IiL | -10 | uA | VIL = 1.5 V | 4 | ||
| High-level input current (pins 2,7,10,15) | IiH | 30 | 100 | uA | 2.3 V ≤Ven H≤VSS, 0.6 V | 4 | |
| Enable low voltage (pins 1,9) | VenL | -0.3 | 1.5 | V | 4 | ||
| Enable high voltage (pins 1,9) | VenH | 2.3 | V | 4 | |||
| Low-voltage enable current (pins 1,9) | Ien=L | -30 | -100 | uA | Ven L = 1.5 V | 4 | |
| High-voltage enable current (pins 1,9) | Ien=H | -10 | 10 | uA | 2.3 V ≤Ven H≤VSS, 0.6 V | 4 | |
| Source saturation voltage (output high) | VCEsat (H) | 1.35 | 1.8 | V | IO =, 0.6 A | 4 | |
| Sink saturation voltage (output low) | VCEsat (L) | 1.1 | 1.8 | V | IO = +0.6 A | 4 |
CAD (KiCad official)
- Symbol:
HX293DDRG - Footprint:
Package_SO:SOP-20_7.5x12.8mm_P1.27mm - 3D model: SOP-20, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 2.65 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
hx293ddrg-etched.step/hx293ddrg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hx293ddrg.step/hx293ddrg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HANSCHIP semiconductor datasheet (10 pp, sha256
796df366bafe039c, retrieved 2026-10-17, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).