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Contents

README

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IPN60R1K5PFD7SATMA1

Infineon Technologies · MOSFETs · SOT-223

IPN60R1K5PFD7SATMA1 from Infineon Technologies, in a SOT-223. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate control terminal with static gate-source voltage limited to -20 V to 20 V and dynamic limit of -30 V to 30 V (AC f>1 Hz), and gate threshold voltage of 3.5 V to 4.5 V.
2 Drain passive Drain terminal rated for continuous drain current of 3.6 A at TC=25°C, with a drain-source breakdown voltage of 600 V minimum.
3 Source passive Source terminal is the reference for the gate-source voltage limits and the return path for the drain current.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-223
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Continuous drain current ID 3.6 A TC=25°C 3
Continuous drain current ID 2.2 A TC=100°C 3
Pulsed drain current ID,pulse 6 A TC=25°C 3
Avalanche energy, single pulse EAS 7 mJ ID=0.7A; VDD=50V; see table 10 3
Avalanche energy, repetitive EAR 0.04 mJ ID=0.7A; VDD=50V; see table 10 3
Avalanche current, single pulse IAS 0.7 A 3
MOSFET dv/dt ruggedness dv/dt 120 V/ns VDS=0...400V 3
Gate source voltage (static) VGS -20 20 V static; 3
Gate source voltage (dynamic) VGS -30 30 V AC (f>1 Hz) 3
Power dissipation Ptot 6 W TC=25°C 3
Storage temperature Tstg -40 150 °C 3
Operating junction temperature Tj -40 150 °C 3
Continuous diode forward current IS 3.6 A TC=25°C 3
Diode pulse current IS,pulse 6 A TC=25°C 3
Reverse diode dv/dt dv/dt 70 V/ns VDS=0...400V,ISD<=2.5A,Tj=25°C 3
Maximum diode commutation speed diF/dt 1300 A/µs VDS=0...400V,ISD<=2.5A,Tj=25°C 3
Thermal resistance, junction - solder point RthJS 19.73 °C/W 4
Thermal resistance, junction - ambient RthJA 160 °C/W device on PCB, minimal footprint 4
Thermal resistance, junction - ambient for SMD version RthJA 35 75 °C/W Device on 40mm40mm1.5mm epoxy PCB FR4 with 6cm² copper area for drain connection and cooling, vertical without air stream cooling 4
Soldering temperature, wavesoldering only allowed at leads Tsold 260 °C reflow MSL1 4
Drain-source breakdown voltage V(BR)DSS 600 V VGS=0V,ID=1mA 5
Gate threshold voltage V(GS)th 3.5 4 4.5 V VDS=VGS,ID=0.04mA 5
Zero gate voltage drain current IDSS 1 µA VDS=600V,VGS=0V,Tj=25°C 5
Zero gate voltage drain current IDSS 37 µA VDS=600V,VGS=0V,Tj=125°C 5
Gate-source leakage current IGSS 1000 nA VGS=20V,VDS=0V 5
Drain-source on-state resistance RDS(on) 1.23 1.5 Ω VGS=10V,ID=0.7A,Tj=25°C 5
Drain-source on-state resistance RDS(on) 2.893 Ω VGS=10V,ID=0.7A,Tj=150°C 5
Reverse recovery time trr 40 59 ns VR=400V,IF=0.7A,diF/dt=100A/µs; see table 8 6
Reverse recovery charge Qrr 0.06 0.12 µC VR=400V,IF=0.7A,diF/dt=100A/µs; see table 8 6

CAD (KiCad official)

  • Symbol: IPN60R1K5PFD7SATMA1
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223 (KiCad packages3D, STEP)
  • 3D model files: ipn60r1k5pfd7satma1-etched.step / ipn60r1k5pfd7satma1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ipn60r1k5pfd7satma1.step / ipn60r1k5pfd7satma1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (14 pp, sha256 429333c8a769ba97, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF