component
HNRVTSS3100ET3G
Public Made by Adomby adom
HXY MOSFET Schottky Diodes, SMB. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownHNRVTSS3100ET3G
HXY MOSFET · Schottky Diodes · SMB
HNRVTSS3100ET3G from HXY MOSFET, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SMB |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Average Forward Current | IF(AV) | 3 | A | 60Hz Half-sine wave, Resistance load, FIG.1 | 1 | ||
| Repetitive Peak Reverse Voltage | VRRM | 100 | V | 1 | |||
| Maximum RMS Voltage | VRMS | 70 | V | 1 | |||
| Surge (Non-repetitive) Forward Current | IFSM | 70 | A | 60Hz Half-sine wave, 1 cycle, Ta=25°C | 1 | ||
| Junction Temperature | TJ | -50 | 150 | °C | 1 | ||
| Storage Temperature | TSTG | -50 | 150 | °C | 1 | ||
| Peak Reverse Current | IRRM1 | 0.1 | mA | VRM=VRRM, Ta=25°C | 1 | ||
| Peak Reverse Current | IRRM2 | 5 | mA | VRM=VRRM, Ta=100°C | 1 | ||
| Thermal Resistance Junction to Ambient | Rθ J-A | 55 | °C/W | Between junction and ambient | 1 | ||
| Thermal Resistance Junction to Lead | Rθ J-L | 20 | °C/W | Between junction and terminal | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.6" x 0.6" (16 mm x 16 mm) copper pad areas | 1 |
CAD (KiCad official)
- Symbol:
HNRVTSS3100ET3G - Footprint:
Diode_SMD:D_SMB - 3D model: SMB (KiCad packages3D, STEP)
- 3D model files:
hnrvtss3100et3g-etched.step/hnrvtss3100et3g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hnrvtss3100et3g.step/hnrvtss3100et3g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (4 pp, sha256
e854a5766028dff6, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).