component
JK-SMD0603-075L-6
Public Made by Adomby adom
Jinrui Electronic Materials Co Resettable Fuses, 0603. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownJK-SMD0603-075L-6
Jinrui Electronic Materials Co · Resettable Fuses · 0603
JK-SMD0603-075L-6 from Jinrui Electronic Materials Co, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Jinrui Electronic Materials Co |
| Package | 0603 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum voltage (VMAX) | VMAX | 6 | V | Maximum continuous voltage the device can withstand without damage at rated current | 2 | ||
| Maximum fault current (IMAX) | IMAX | 50 | A | Maximum fault current the device can withstand without damage at rated voltage | 2 | ||
| Trip current (IT) | IT | 1.5 | A | Minimum current at which the device goes from low to high resistance in 25℃ still air | 2 | ||
| Minimum resistance before tripping (RiMIN) | RiMIN | 0.055 | Ω | 25℃, prior to tripping | 2 | ||
| Maximum resistance one hour post reflow (R1MAX) | R1MAX | 0.25 | Ω | Measured one hour post reflow | 2 | ||
| Maximum time-to-trip | 1 | Sec | At 8.0 A current | 2 | |||
| Operating temperature | -40 | 85 | ℃ | Operating temperature range | 1 | ||
| Storage maximum ambient temperature | 40 | ℃ | Storage; higher storage temperatures may deform packaging | 6 | |||
| Storage maximum relative humidity | 70 | % | Storage | 6 | |||
| Resistance change after passive aging | -10 | 10 | % | Passive aging 85℃, 1000 hours (typical) | 3 | ||
| Resistance change after humidity aging | -5 | 5 | % | 85℃/85%RH, 100 hours (typical) | 3 | ||
| Resistance change after thermal shock | -30 | % | MIL-STD-202 Method 107G, +85℃/-40℃, 20 times (typical) | 3 | |||
| Hold current (IH) | IH | 0.75 | A | 25℃ still air; no trip in 30 min at IH | 2 | ||
| Typical power dissipation (PD) | PD | 0.5 | W | 25℃ still air | 2 | ||
| Thermal derating IH at ambient -40℃ | IH | 0.99 | A | Maximum ambient operating temperature -40℃ | 2 | ||
| Thermal derating IH at ambient -20℃ | IH | 0.85 | A | Maximum ambient operating temperature -20℃ | 2 | ||
| Thermal derating IH at ambient 0℃ | IH | 0.79 | A | Maximum ambient operating temperature 0℃ | 2 | ||
| Thermal derating IH at ambient 25℃ | IH | 0.75 | A | Maximum ambient operating temperature 25℃ | 2 | ||
| Thermal derating IH at ambient 40℃ | IH | 0.61 | A | Maximum ambient operating temperature 40℃ | 2 | ||
| Thermal derating IH at ambient 50℃ | IH | 0.44 | A | Maximum ambient operating temperature 50℃ | 2 | ||
| Thermal derating IH at ambient 60℃ | IH | 0.3 | A | Maximum ambient operating temperature 60℃ | 2 | ||
| Thermal derating IH at ambient 70℃ | IH | 0.17 | A | Maximum ambient operating temperature 70℃ | 2 | ||
| Thermal derating IH at ambient 85℃ | IH | 0.07 | A | Maximum ambient operating temperature 85℃ | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | tin | Terminal Materials Tin-Plated Nickle-copper | 3 |
CAD (KiCad official)
- Symbol:
JK-SMD0603-075L-6 - Footprint:
Fuse:Fuse_0603_1608Metric - 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files:
jk-smd0603-075l-6-etched.step/jk-smd0603-075l-6-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);jk-smd0603-075l-6.step/jk-smd0603-075l-6.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Jinrui Electronic Materials Co datasheet (6 pp, sha256
4c896b04eb6400e3, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).