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README

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MC74HC164ADR2G

onsemi · Shift Registers · SOIC-14

MC74HC164ADR2G from onsemi, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 input Serial data input; A1 and A2 must both be high to enter a high into the first stage, so one input can act as a data enable, and an unused serial input must be tied to VCC.
2 A2 input Serial data input; A1 and A2 must both be high to enter a high into the first stage, so one input can act as a data enable, and an unused serial input must be tied to VCC.
3 QA output Parallel shift register output, presented in true (non-inverted) form; set low by an active-low Reset.
4 QB output Parallel shift register output, presented in true (non-inverted) form; set low by an active-low Reset.
5 QC output Parallel shift register output, presented in true (non-inverted) form; set low by an active-low Reset.
6 QD output Parallel shift register output, presented in true (non-inverted) form; set low by an active-low Reset.
7 GND power_in Ground reference; all voltages are referenced to this pin.
8 CLOCK input Shift register clock; data shifts one stage on each positive-going transition, and the register is static so clock rates down to DC are allowed.
9 RESET input Active-low asynchronous reset; a low voltage resets all internal flip-flops and forces QA to QH low, overriding the clock and serial data inputs.
10 QE output Parallel shift register output, presented in true (non-inverted) form; set low by an active-low Reset.
11 QF output Parallel shift register output, presented in true (non-inverted) form; set low by an active-low Reset.
12 QG output Parallel shift register output, presented in true (non-inverted) form; set low by an active-low Reset.
13 QH output Parallel shift register output, presented in true (non-inverted) form; set low by an active-low Reset.
14 VCC power_in Positive supply; the device operates from 2.0 V to 6.0 V DC referenced to GND.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-14
Category Logic
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
DC Supply Voltage (Referenced to GND) VCC 2 6 V 3
DC Input Voltage, Output Voltage (Referenced to GND) Vin, Vout 0 V Max = VCC 3
Operating Temperature, All Package Types TA -55 125 °C 3
Input Rise and Fall Time (Figure 1) tr, tf 0 1000 ns VCC = 2.0 V 3
Input Rise and Fall Time (Figure 1) tr, tf 0 500 ns VCC = 4.5 V 3
Input Rise and Fall Time (Figure 1) tr, tf 0 400 ns VCC = 6.0 V 3
DC Supply Voltage (Referenced to GND) VCC -0.5 7 V 3
DC Input Voltage (Referenced to GND) Vin -0.5 V Max = VCC + 0.5 V 3
DC Output Voltage (Referenced to GND) Vout -0.5 V Max = VCC + 0.5 V 3
DC Input Current, per Pin Iin -20 20 mA 3
DC Output Current, per Pin Iout -25 25 mA 3
DC Supply Current, VCC and GND Pins ICC -50 50 mA 3
Power Dissipation in Still Air, SOIC Package PD 500 mW Still air, SOIC package 3
Storage Temperature Tstg -65 150 °C 3
Lead Temperature TL 260 °C 1 mm from case for 10 seconds (SOIC package) 3
Minimum High-Level Input Voltage VIH 1.5 V VCC = 2.0 V; Vout = 0.1 V or VCC − 0.1 V; /Iout/ ≤ 20 µA 3
Minimum High-Level Input Voltage VIH 2.1 V VCC = 3.0 V; Vout = 0.1 V or VCC − 0.1 V; /Iout/ ≤ 20 µA 3
Minimum High-Level Input Voltage VIH 3.15 V VCC = 4.5 V; Vout = 0.1 V or VCC − 0.1 V; /Iout/ ≤ 20 µA 3
Minimum High-Level Input Voltage VIH 4.2 V VCC = 6.0 V; Vout = 0.1 V or VCC − 0.1 V; /Iout/ ≤ 20 µA 3
Maximum Low-Level Input Voltage VIL 0.5 V VCC = 2.0 V; Vout = 0.1 V or VCC − 0.1 V; /Iout/ ≤ 20 µA 3
Maximum Low-Level Input Voltage VIL 0.9 V VCC = 3.0 V; Vout = 0.1 V or VCC − 0.1 V; /Iout/ ≤ 20 µA 3
Maximum Low-Level Input Voltage VIL 1.35 V VCC = 4.5 V; Vout = 0.1 V or VCC − 0.1 V; /Iout/ ≤ 20 µA 3
Maximum Low-Level Input Voltage VIL 1.8 V VCC = 6.0 V; Vout = 0.1 V or VCC − 0.1 V; /Iout/ ≤ 20 µA 3
Minimum High-Level Output Voltage VOH 1.9 V VCC = 2.0 V; Vin = VIH or VIL; /Iout/ ≤ 20 µA 3
Minimum High-Level Output Voltage VOH 4.4 V VCC = 4.5 V; Vin = VIH or VIL; /Iout/ ≤ 20 µA 3
Minimum High-Level Output Voltage VOH 5.9 V VCC = 6.0 V; Vin = VIH or VIL; /Iout/ ≤ 20 µA 3
Minimum High-Level Output Voltage VOH 2.2 V VCC = 3.0 V; Vin = VIH or VIL; /Iout/ ≤ 2.4 mA; 125°C limit 3
Minimum High-Level Output Voltage VOH 3.7 V VCC = 4.5 V; Vin = VIH or VIL; /Iout/ ≤ 4.0 mA; 125°C limit 3
Minimum High-Level Output Voltage VOH 5.2 V VCC = 6.0 V; Vin = VIH or VIL; /Iout/ ≤ 5.2 mA; 125°C limit 3
Maximum Low-Level Output Voltage VOL 0.1 V VCC = 2.0 V; Vin = VIH or VIL; /Iout/ ≤ 20 µA 4
Maximum Low-Level Output Voltage VOL 0.26 V VCC = 3.0 V; Vin = VIH or VIL; /Iout/ ≤ 2.4 mA 4
Maximum Low-Level Output Voltage VOL 0.33 V VCC = 4.5 V; Vin = VIH or VIL; /Iout/ ≤ 4.0 mA 4
Maximum Low-Level Output Voltage VOL 0.4 V VCC = 6.0 V; Vin = VIH or VIL; /Iout/ ≤ 5.2 mA 4
Maximum Input Leakage Current Iin -1 1 µA VCC = 6.0 V; Vin = VCC or GND; 125°C limit 4
Maximum Quiescent Supply Current (per Package) ICC 160 µA VCC = 6.0 V; Vin = VCC or GND; Iout = 0 A; 125°C limit 4
Maximum Input Capacitance Cin 10 pF 4
Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) fmax 10 MHz VCC = 2.0 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) fmax 20 MHz VCC = 3.0 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) fmax 30 MHz VCC = 4.5 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) fmax 40 MHz VCC = 6.0 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Propagation Delay, Clock to Q (Figures 1 and 4) tPLH, tPHL 250 ns VCC = 2.0 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Propagation Delay, Clock to Q (Figures 1 and 4) tPLH, tPHL 200 ns VCC = 3.0 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Propagation Delay, Clock to Q (Figures 1 and 4) tPLH, tPHL 48 ns VCC = 4.5 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Propagation Delay, Clock to Q (Figures 1 and 4) tPLH, tPHL 42 ns VCC = 6.0 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Propagation Delay, Reset to Q (Figures 2 and 4) tPHL 260 ns VCC = 2.0 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Propagation Delay, Reset to Q (Figures 2 and 4) tPHL 200 ns VCC = 3.0 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Propagation Delay, Reset to Q (Figures 2 and 4) tPHL 53 ns VCC = 4.5 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Propagation Delay, Reset to Q (Figures 2 and 4) tPHL 45 ns VCC = 6.0 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Output Transition Time, Any Output (Figures 1 and 4) tTLH, tTHL 110 ns VCC = 2.0 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Output Transition Time, Any Output (Figures 1 and 4) tTLH, tTHL 36 ns VCC = 3.0 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Output Transition Time, Any Output (Figures 1 and 4) tTLH, tTHL 22 ns VCC = 4.5 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Maximum Output Transition Time, Any Output (Figures 1 and 4) tTLH, tTHL 19 ns VCC = 6.0 V; CL = 50 pF, Input tr = tf = 6 ns; 125°C limit 4
Minimum Setup Time, A1 or A2 to Clock (Figure 3) tsu 40 ns VCC = 2.0 V; 125°C limit 5
Minimum Setup Time, A1 or A2 to Clock (Figure 3) tsu 25 ns VCC = 3.0 V; 125°C limit 5
Minimum Setup Time, A1 or A2 to Clock (Figure 3) tsu 9 ns VCC = 4.5 V; 125°C limit 5
Minimum Setup Time, A1 or A2 to Clock (Figure 3) tsu 6 ns VCC = 6.0 V; 125°C limit 5
Minimum Hold Time, Clock to A1 or A2 (Figure 3) th 3 ns VCC = 2.0, 3.0, 4.5 and 6.0 V (same value at each VCC) 5
Minimum Recovery Time, Reset Inactive to Clock (Figure 2) trec 3 ns VCC = 2.0, 3.0, 4.5 and 6.0 V (same value at each VCC) 5

CAD (KiCad official)

  • Symbol: MC74HC164ADR2G
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: mc74hc164adr2g-etched.step / mc74hc164adr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc74hc164adr2g.step / mc74hc164adr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (11 pp, sha256 a1c89f9dfc62e83e, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF