Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

MC74HCT595ADG

onsemi · Registers · SOIC-16

MC74HCT595ADG from onsemi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 QB tri_state Noninverted, three-state parallel latch output B; forced to high impedance when Output Enable is high.
2 QC tri_state Noninverted, three-state parallel latch output C; forced to high impedance when Output Enable is high.
3 QD tri_state Noninverted, three-state parallel latch output D; forced to high impedance when Output Enable is high.
4 QE tri_state Noninverted, three-state parallel latch output E; forced to high impedance when Output Enable is high.
5 QF tri_state Noninverted, three-state parallel latch output F; forced to high impedance when Output Enable is high.
6 QG tri_state Noninverted, three-state parallel latch output G; forced to high impedance when Output Enable is high.
7 QH tri_state Noninverted, three-state parallel latch output H; forced to high impedance when Output Enable is high.
8 GND power_in Ground reference pin; all voltages are referenced to GND, and VCC must be held between 4.5 and 5.5 V relative to it.
9 SQH output Noninverted serial data output from the eighth shift register stage; it does not have three-state capability.
10 RESET input Active-low asynchronous reset for the shift register only; a low resets the shift register and does not affect the 8-bit latch.
11 SHIFT CLOCK input Shift register clock; a low-to-high transition shifts the data at the serial input A into the 8-bit shift register.
12 LATCH CLOCK input Storage latch clock; a low-to-high transition latches the shift register data into the 8-bit latch.
13 OUTPUT ENABLE input Active-low output enable; a low lets the latch data appear on QA-QH, while a high forces QA-QH into high impedance without affecting SQH.
14 A input Serial data input shifted into the 8-bit shift register on each low-to-high shift clock transition.
15 QA tri_state Noninverted, three-state parallel latch output A; forced to high impedance when Output Enable is high.
16 VCC power_in Positive supply pin; the recommended DC supply range is 4.5 to 5.5 V referenced to GND.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-16
Category Logic ICs
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Minimum High-Level Input Voltage VIH 2 V VCC 4.5 to 5.5 V; Vout = 0.1 V or VCC − 0.1 V; /Iout/ ≤ 20 µA 4
Maximum Low-Level Input Voltage VIL 0.8 V VCC 4.5 to 5.5 V; Vout = 0.1 V or VCC − 0.1 V; /Iout/ ≤ 20 µA 4
Minimum High-Level Output Voltage, QA−QH VOH 4.4 V VCC 4.5 V; Vin = VIH or VIL; /Iout/ ≤ 20 µA 4
Minimum High-Level Output Voltage, QA−QH (125°C column) VOH 3.7 V VCC 4.5 V; Vin = VIH or VIL; /Iout/ ≤ 6.0 mA; 125°C 4
Maximum Low-Level Output Voltage, QA−QH VOL 0.1 V VCC 4.5 V; Vin = VIH or VIL; /Iout/ ≤ 20 µA 4
Maximum Low-Level Output Voltage, QA−QH (125°C column) VOL 0.4 V VCC 4.5 V; Vin = VIH or VIL; /Iout/ ≤ 6.0 mA; 125°C 4
Minimum High-Level Output Voltage, SQH VOH 4.4 V VCC 4.5 V; Vin = VIH or VIL; /Iout/ ≤ 20 µA 4
Minimum High-Level Output Voltage, SQH (125°C column) VOH 3.7 V VCC 4.5 V; Vin = VIH or VIL; /Iout/ ≤ 4.0 mA; 125°C 4
Maximum Low-Level Output Voltage, SQH VOL 0.1 V VCC 4.5 V; Vin = VIH or VIL; /Iout/ ≤ 20 µA 4
Maximum Low-Level Output Voltage, SQH (125°C column) VOL 0.4 V VCC 4.5 V; Vin = VIH or VIL; /Iout/ ≤ 4.0 mA; 125°C 4
Maximum Input Leakage Current (125°C column) Iin -1 1 µA VCC 5.5 V; Vin = VCC or GND; 125°C 4
Maximum Three-State Leakage Current, QA−QH (125°C column) IOZ -10 10 µA VCC 5.5 V; output high-impedance; Vin = VIL or VIH; Vout = VCC or GND; 125°C 4
Maximum Quiescent Supply Current (per package, 125°C column) ICC 160 µA VCC 5.5 V; Vin = VCC or GND; Iout = 0 A; 125°C 4
Additional Quiescent Supply Current (≥ −55°C) ICC 2.9 mA VCC 5.5 V; Vin = 2.4 V on any one input; Vin = VCC or GND on other inputs; Iout = 0 A; ≥ −55°C 4
Additional Quiescent Supply Current (25 to 125°C) ICC 2.4 mA VCC 5.5 V; Vin = 2.4 V on any one input; Vin = VCC or GND on other inputs; Iout = 0 A; 25 to 125°C 4
Maximum Clock Frequency (50% duty cycle, 125°C column) fmax 20 MHz VCC 4.5 to 5.5 V; CL = 50 pF; tr = tf = 6.0 ns; 125°C 5
Maximum Propagation Delay, Shift Clock to SQH (125°C column) tPLH, tPHL 42 ns VCC 4.5 to 5.5 V; CL = 50 pF; tr = tf = 6.0 ns; 125°C 5
Maximum Propagation Delay, Reset to SQH (125°C column) tPHL 44 ns VCC 4.5 to 5.5 V; CL = 50 pF; tr = tf = 6.0 ns; 125°C 5
Maximum Propagation Delay, Latch Clock to QA−QH (125°C column) tPLH, tPHL 42 ns VCC 4.5 to 5.5 V; CL = 50 pF; tr = tf = 6.0 ns; 125°C 5
Maximum Propagation Delay, Output Enable to QA−QH, high-impedance (125°C column) tPLZ, tPHZ 45 ns VCC 4.5 to 5.5 V; CL = 50 pF; tr = tf = 6.0 ns; 125°C 5
Maximum Propagation Delay, Output Enable to QA−QH, enable (125°C column) tPZL, tPZH 41 ns VCC 4.5 to 5.5 V; CL = 50 pF; tr = tf = 6.0 ns; 125°C 5
Maximum Output Transition Time, QA−QH (125°C column) tTLH, tTHL 18 ns VCC 4.5 to 5.5 V; CL = 50 pF; tr = tf = 6.0 ns; 125°C 5
Maximum Output Transition Time, SQH (125°C column) tTLH, tTHL 22 ns VCC 4.5 to 5.5 V; CL = 50 pF; tr = tf = 6.0 ns; 125°C 5
Maximum Input Capacitance Cin 10 pF 5
Maximum Three-State Output Capacitance (output high-impedance), QA−QH Cout 15 pF Output in high-impedance state, QA−QH 5
Minimum Setup Time, Serial Data Input A to Shift Clock (125°C column) tsu 15 ns VCC 4.5 to 5.5 V; tr = tf = 6.0 ns; 125°C 5
Minimum Setup Time, Shift Clock to Latch Clock (125°C column) tsu 22 ns VCC 4.5 to 5.5 V; tr = tf = 6.0 ns; 125°C 5
Minimum Hold Time, Shift Clock to Serial Data Input A th 5 ns VCC 4.5 to 5.5 V; tr = tf = 6.0 ns 5
Minimum Recovery Time, Reset Inactive to Shift Clock (125°C column) trec 15 ns VCC 4.5 to 5.5 V; tr = tf = 6.0 ns; 125°C 5
Minimum Pulse Width, Reset (125°C column) tw 18 ns VCC 4.5 to 5.5 V; tr = tf = 6.0 ns; 125°C 5
Minimum Pulse Width, Shift Clock (125°C column) tw 15 ns VCC 4.5 to 5.5 V; tr = tf = 6.0 ns; 125°C 5
Minimum Pulse Width, Latch Clock (125°C column) tw 15 ns VCC 4.5 to 5.5 V; tr = tf = 6.0 ns; 125°C 5
Maximum Input Rise and Fall Times tr, tf 500 ns VCC 4.5 to 5.5 V; Figure 1 5
DC Supply Voltage (Referenced to GND), recommended VCC 4.5 5.5 V Referenced to GND 3
DC Input Voltage, Output Voltage (Referenced to GND), recommended Vin, Vout 0 V Referenced to GND; printed maximum is VCC 3
Operating Temperature Range, All Package Types TA -55 125 °C 3
Input Rise/Fall Time, recommended tr, tf 0 500 ns Figure 1 3
DC Supply Voltage (Referenced to GND), absolute maximum VCC -0.5 7 V Referenced to GND 3
DC Input Voltage (Referenced to GND), absolute maximum Vin -0.5 V Referenced to GND; printed maximum is VCC + 0.5 3
DC Output Voltage (Referenced to GND), absolute maximum Vout -0.5 V Referenced to GND; printed maximum is VCC + 0.5 3
DC Input Current, per Pin Iin -20 20 mA Per pin 3
DC Output Current, per Pin Iout -35 35 mA Per pin 3
DC Supply Current, VCC and GND Pins ICC -75 75 mA VCC and GND pins 3
Power Dissipation in Still Air, SOIC Package PD 500 mW Still air, SOIC package; derate −7 mW/°C from 65 to 125°C 3
Storage Temperature Tstg -65 150 °C 3
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC or TSSOP) TL 260 °C 1 mm from case for 10 seconds 3

CAD (KiCad official)

  • Symbol: MC74HCT595ADG
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: mc74hct595adg-etched.step / mc74hct595adg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc74hct595adg.step / mc74hct595adg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (12 pp, sha256 a09e1caabec3fe23, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF