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README

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74HC245WS20ARBQ

GR · Buffers, Drivers, Receivers, Transceivers · SOP-20-300mil

74HC245WS20ARBQ from GR, in a SOP-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DIR input Direction-control input: with OE low, DIR low selects B-to-A transfer and DIR high selects A-to-B transfer.
2 A1 bidirectional 3-state input/output on the A bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
3 A2 bidirectional 3-state input/output on the A bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
4 A3 bidirectional 3-state input/output on the A bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
5 A4 bidirectional 3-state input/output on the A bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
6 A5 bidirectional 3-state input/output on the A bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
7 A6 bidirectional 3-state input/output on the A bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
8 A7 bidirectional 3-state input/output on the A bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
9 A8 bidirectional 3-state input/output on the A bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
10 GND power_in Ground reference; all device voltages are referenced to GND (0 V).
11 B8 bidirectional 3-state input/output on the B bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
12 B7 bidirectional 3-state input/output on the B bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
13 B6 bidirectional 3-state input/output on the B bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
14 B5 bidirectional 3-state input/output on the B bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
15 B4 bidirectional 3-state input/output on the B bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
16 B3 bidirectional 3-state input/output on the B bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
17 B2 bidirectional 3-state input/output on the B bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
18 B1 bidirectional 3-state input/output on the B bus; output drive is ±6mA at 5V and the pin is active only when OE is low.
19 OE input Active-low output enable; when high, the device is in isolation and both buses are effectively disconnected.
20 VCC power_in Supply voltage; recommended operating range is 2 V to 6 V, with an absolute maximum of 7 V.

Key specifications

Parameter Value
Manufacturer GR
Package SOP-20-300mil
Category Logic
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.5 7 V 3
Power Dissipation PD 500 mW 3
Junction Temperature TJ 125 ℃ 3
Operating Temperature TOP 0 70 ℃ 3
Supply Voltage VCC 2 5 6 V 4
High Level Input Voltage VIH 1.5 V VCC=2V 4
High Level Input Voltage VIH 3.15 V VCC=4.5V 4
High Level Input Voltage VIH 4.2 V VCC=6V 4
Low Level Input Voltage VIL 0.5 V VCC=2V 4
Low Level Input Voltage VIL 1.35 V VCC=4.5V 4
Low Level Input Voltage VIL 1.8 V VCC=6V 4
Input voltage VI 0 V 4
High Level Output Voltage VOH 1.9 V VCC=2V,IO=-20uA 4
High Level Output Voltage VOH 4.4 V VCC=4.5V,IO=-20uA 4
High Level Output Voltage VOH 5.9 V VCC=6V,IO=-20uA 4
High Level Output Voltage VOH 4 V VCC=4.5V,IO=-6mA 4
High Level Output Voltage VOH 5.5 V VCC=6V,IO=-7.8mA 4
Low Level Output Voltage VOL 0.1 V VCC=2V,IO=20uA 4
Low Level Output Voltage VOL 0.3 V VCC=4.5V,IO=6mA 4
Input Leakage Current II -1 0 1 uA VCC=6V,VI=VCC or GND 4
Off-State (High Impedance State) Output Current (A or B) IOZ -5 0 5 uA VCC=6V,VO=VCC or GND 4
Quiescent Supply Current ICC 0 10 uA VCC=6V,VI=VCC/GND 4

CAD (KiCad official)

  • Symbol: 74HC245WS20ARBQ
  • Footprint: Package_SO:SOP-20_7.5x12.8mm_P1.27mm
  • 3D model: SOP-20-300mil, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 2.65 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: 74hc245ws20arbq-etched.step / 74hc245ws20arbq-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 74hc245ws20arbq.step / 74hc245ws20arbq.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GR datasheet (9 pp, sha256 790f2ed0ddfb2542, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF