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Contents

README

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MC14051BDR2G

onsemi · Analog Switches, Multiplexers · SOIC-16

MC14051BDR2G from onsemi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 X4 passive Channel 4 analog switch I/O, referenced to VEE, with recommended peak-to-peak swing from VEE to VDD.
2 X6 passive Channel 6 analog switch I/O, referenced to VEE, with recommended peak-to-peak swing from VEE to VDD.
3 X passive Common analog O/I for the MC14051B SP8T switch, referenced to VEE; analog levels must stay between VEE and VDD.
4 X7 passive Channel 7 analog switch I/O, referenced to VEE, with recommended peak-to-peak swing from VEE to VDD.
5 X5 passive Channel 5 analog switch I/O, referenced to VEE, with recommended peak-to-peak swing from VEE to VDD.
6 INH input Active-high inhibit control referenced to VSS; logic 1 turns all channels off (no channel selected), and it must be tied to a logic level when unused.
7 VEE power_in Most negative analog supply, must be less than or equal to VSS; analog switch I/O is referenced to VEE.
8 VSS power_in Digital control logic ground and reference for control inputs; must be greater than or equal to VEE.
9 C input Binary channel-select address bit (MSB) referenced to VSS; unused control inputs must be tied to VSS or VDD.
10 B input Binary channel-select address bit referenced to VSS; unused control inputs must be tied to VSS or VDD.
11 A input Binary channel-select address bit (LSB) referenced to VSS; unused control inputs must be tied to VSS or VDD.
12 X3 passive Channel 3 analog switch I/O, referenced to VEE, with recommended peak-to-peak swing from VEE to VDD.
13 X0 passive Channel 0 analog switch I/O, referenced to VEE, with recommended peak-to-peak swing from VEE to VDD.
14 X1 passive Channel 1 analog switch I/O, referenced to VEE, with recommended peak-to-peak swing from VEE to VDD.
15 X2 passive Channel 2 analog switch I/O, referenced to VEE, with recommended peak-to-peak swing from VEE to VDD.
16 VDD power_in Positive supply, 3.0 Vdc to 18 Vdc absolute maximum 18.0 V referenced to VEE; 15 V is the recommended maximum VDD-VEE difference.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-16
Category Interface
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
DC Supply Voltage Range (referenced to VEE) VDD -0.5 18 V Referenced to VEE, VSS ≥ VEE 1
Input or Output Voltage Range (DC or Transient) Vin, Vout -0.5 V Referenced to VSS for control inputs and VEE for switch I/O 1
Input Current (DC or Transient) per Control Pin Iin 10 mA Per control pin 1
Switch Through Current ISW -25 25 mA 1
Power Dissipation per Package PD 500 mW Note 1 1
Ambient Temperature Range TA -55 125 °C 1
Storage Temperature Range Tstg -65 150 °C 1
Lead Temperature TL 260 °C 8-second soldering 1
Power Dissipation Temperature Derating (D/DW packages) -7 mW/C From 65C to 125C 1
Maximum Difference between VDD and VEE (recommended) VDD − VEE 15 V Recommended maximum; most parameters specified up to 15 V 8
Recommended Peak-to-Peak Voltage Into or Out of the Switch VI/O 0 VPP Channel On or Off 3
Recommended Static or Dynamic Voltage Across the Switch Vswitch 0 600 mV Channel On; TA = −55°C; Note 3 3
Recommended Static or Dynamic Voltage Across the Switch Vswitch 0 300 mV Channel On; TA = 125°C; Note 3 3
Power Supply Voltage Range VDD − VEE 3 18 V VSS ≥ VEE 3
Quiescent Current Per Package IDD 5 µA VDD = 5.0 V; Control Inputs Vin = VSS or VDD; Switch I/O VEE ≤ VI/O ≤ VDD, Vswitch ≤ 500 mV (Note 3); TA = −55°C 3
Quiescent Current Per Package IDD 0.005 5 µA VDD = 5.0 V; Control Inputs Vin = VSS or VDD; Switch I/O VEE ≤ VI/O ≤ VDD, Vswitch ≤ 500 mV (Note 3); TA = 25°C 3
Quiescent Current Per Package IDD 150 µA VDD = 5.0 V; Control Inputs Vin = VSS or VDD; Switch I/O VEE ≤ VI/O ≤ VDD, Vswitch ≤ 500 mV (Note 3); TA = 125°C 3
Quiescent Current Per Package IDD 10 µA VDD = 10 V; Control Inputs Vin = VSS or VDD; Switch I/O VEE ≤ VI/O ≤ VDD, Vswitch ≤ 500 mV (Note 3); TA = −55°C 3
Quiescent Current Per Package IDD 0.01 10 µA VDD = 10 V; Control Inputs Vin = VSS or VDD; Switch I/O VEE ≤ VI/O ≤ VDD, Vswitch ≤ 500 mV (Note 3); TA = 25°C 3
Quiescent Current Per Package IDD 300 µA VDD = 10 V; Control Inputs Vin = VSS or VDD; Switch I/O VEE ≤ VI/O ≤ VDD, Vswitch ≤ 500 mV (Note 3); TA = 125°C 3
Quiescent Current Per Package IDD 20 µA VDD = 15 V; Control Inputs Vin = VSS or VDD; Switch I/O VEE ≤ VI/O ≤ VDD, Vswitch ≤ 500 mV (Note 3); TA = −55°C 3
Quiescent Current Per Package IDD 0.015 20 µA VDD = 15 V; Control Inputs Vin = VSS or VDD; Switch I/O VEE ≤ VI/O ≤ VDD, Vswitch ≤ 500 mV (Note 3); TA = 25°C 3
Quiescent Current Per Package IDD 600 µA VDD = 15 V; Control Inputs Vin = VSS or VDD; Switch I/O VEE ≤ VI/O ≤ VDD, Vswitch ≤ 500 mV (Note 3); TA = 125°C 3
Low-Level Input Voltage VIL 1.5 V VDD = 5.0 V; Ron = per spec, Ioff = per spec; TA = −55°C 3
Low-Level Input Voltage VIL 2.25 1.5 V VDD = 5.0 V; Ron = per spec, Ioff = per spec; TA = 25°C 3
Low-Level Input Voltage VIL 3 V VDD = 10 V; Ron = per spec, Ioff = per spec; TA = −55°C 3
Low-Level Input Voltage VIL 4.5 3 V VDD = 10 V; Ron = per spec, Ioff = per spec; TA = 25°C 3
Low-Level Input Voltage VIL 4 V VDD = 15 V; Ron = per spec, Ioff = per spec; TA = −55°C 3
Low-Level Input Voltage VIL 6.75 4 V VDD = 15 V; Ron = per spec, Ioff = per spec; TA = 25°C 3
High-Level Input Voltage VIH 3.5 V VDD = 5.0 V; Ron = per spec, Ioff = per spec; TA = −55°C 3
High-Level Input Voltage VIH 3.5 2.75 V VDD = 5.0 V; Ron = per spec, Ioff = per spec; TA = 25°C 3
High-Level Input Voltage VIH 7 V VDD = 10 V; Ron = per spec, Ioff = per spec; TA = −55°C 3
High-Level Input Voltage VIH 7 5.5 V VDD = 10 V; Ron = per spec, Ioff = per spec; TA = 25°C 3
High-Level Input Voltage VIH 11 V VDD = 15 V; Ron = per spec, Ioff = per spec; TA = −55°C 3
High-Level Input Voltage VIH 11 8.25 V VDD = 15 V; Ron = per spec, Ioff = per spec; TA = 25°C 3
Input Leakage Current Iin -0.1 0.1 µA VDD = 15 V; Vin = 0 or VDD; TA = 25°C 3
Input Leakage Current Iin 1 µA VDD = 15 V; Vin = 0 or VDD; TA = 125°C 3
ON Resistance Ron 800 Ω VDD = 5.0 V; Vswitch ≤ 500 mV (Note 3); Vin = VIL or VIH (Control), Vin = 0 to VDD (Switch); TA = −55°C 3
ON Resistance Ron 250 1050 Ω VDD = 5.0 V; Vswitch ≤ 500 mV (Note 3); Vin = VIL or VIH (Control), Vin = 0 to VDD (Switch); TA = 25°C 3
ON Resistance Ron 1200 Ω VDD = 5.0 V; Vswitch ≤ 500 mV (Note 3); Vin = VIL or VIH (Control), Vin = 0 to VDD (Switch); TA = 125°C 3
ON Resistance Ron 400 Ω VDD = 10 V; Vswitch ≤ 500 mV (Note 3); Vin = VIL or VIH (Control), Vin = 0 to VDD (Switch); TA = −55°C 3
ON Resistance Ron 120 500 Ω VDD = 10 V; Vswitch ≤ 500 mV (Note 3); Vin = VIL or VIH (Control), Vin = 0 to VDD (Switch); TA = 25°C 3
ON Resistance Ron 520 Ω VDD = 10 V; Vswitch ≤ 500 mV (Note 3); Vin = VIL or VIH (Control), Vin = 0 to VDD (Switch); TA = 125°C 3
ON Resistance Ron 220 Ω VDD = 15 V; Vswitch ≤ 500 mV (Note 3); Vin = VIL or VIH (Control), Vin = 0 to VDD (Switch); TA = −55°C 3
ON Resistance Ron 80 280 Ω VDD = 15 V; Vswitch ≤ 500 mV (Note 3); Vin = VIL or VIH (Control), Vin = 0 to VDD (Switch); TA = 25°C 3
ON Resistance Ron 300 Ω VDD = 15 V; Vswitch ≤ 500 mV (Note 3); Vin = VIL or VIH (Control), Vin = 0 to VDD (Switch); TA = 125°C 3
Off-Channel Leakage Current Ioff -100 100 nA VDD = 15 V; Vin = VIL or VIH (Control), channel to channel or any one channel; TA = −55°C 3
Off-Channel Leakage Current Ioff -1000 1000 nA VDD = 15 V; Vin = VIL or VIH (Control), channel to channel or any one channel; TA = 125°C 3
Input Capacitance Cin 5 7.5 pF 3
Propagation Delay, Switch Input to Switch Output (MC14051B) tPLH, tPHL 35 90 ns VDD − VEE = 5.0 V; CL = 50 pF, TA = 25°C; RL = 1 kΩ 4
Propagation Delay, Switch Input to Switch Output (MC14051B) tPLH, tPHL 15 40 ns VDD − VEE = 10 V; CL = 50 pF, TA = 25°C; RL = 1 kΩ 4
Propagation Delay, Switch Input to Switch Output (MC14051B) tPLH, tPHL 12 30 ns VDD − VEE = 15 V; CL = 50 pF, TA = 25°C; RL = 1 kΩ 4

CAD (KiCad official)

  • Symbol: MC14051BDR2G
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: mc14051bdr2g-etched.step / mc14051bdr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc14051bdr2g.step / mc14051bdr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (13 pp, sha256 b5cb85e9b6743183, retrieved 2026-10-16, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF