component
AQHV24-01ETG-C
Public Made by Adomby adom
Littelfuse ESD Protection Devices, SOD-882. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownAQHV24-01ETG-C
Littelfuse · ESD Protection Devices · SOD-882
AQHV24-01ETG-C from Littelfuse, in a SOD-882. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Bidirectional TVS diode terminal (interchangeable with pin 2) for the AQHV24-C, with 24.0 V reverse standoff voltage and 26.7 V breakdown voltage at IR=1mA. |
| 2 | 2 | passive | Bidirectional TVS diode terminal (interchangeable with pin 1) for the AQHV24-C, with 3.0 A peak pulse current (8/20µs) and ±24 kV IEC 61000-4-2 contact ESD withstand. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Littelfuse |
| Package | SOD-882 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Pulse Power | Ppk | 200 | W | tp=8/20μs | 2 | ||
| Operating Temperature | TOP | -40 | 150 | °C | 2 | ||
| Storage Temperature | TSTOR | -55 | 150 | °C | 2 | ||
| Reverse Standoff Voltage | VRWM | 24 | V | IR≤1μA | 3 | ||
| Breakdown Voltage | VBR | 26.7 | V | IR=1mA | 3 | ||
| Leakage Current | ILEAK | 1 | μA | VR=24V | 3 | ||
| Clamp Voltage | VC | 36 | V | IPP=1A, tp=8/20µs, Fwd | 3 | ||
| Clamp Voltage | VC | 50 | V | IPP=3A, tp=8/20µs, Fwd | 3 | ||
| Dynamic Resistance | RDYN | 0.65 | Ω | TLP, tp=100ns, I/O to GND | 3 | ||
| Peak Pulse Current | Ipp | 3 | A | tp=8/20µs | 3 | ||
| ESD Withstand Voltage (Contact Discharge) | VESD | 24 | kV | IEC 61000-4-2 (Contact Discharge) | 3 | ||
| ESD Withstand Voltage (Air Discharge) | VESD | 30 | kV | IEC 61000-4-2 (Air Discharge) | 3 | ||
| Diode Capacitance | CI/O-GND | 17 | pF | Reverse Bias=0V, f=1MHz | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper Alloy | Lead Plating Pre-Plated Frame Lead Material Copper Alloy | 5 |
CAD (KiCad official)
- Symbol:
AQHV24-01ETG-C - Footprint:
Diode_SMD:D_SOD-882 - 3D model: SOD-882 (KiCad packages3D, STEP)
- 3D model files:
aqhv24-01etg-c-etched.step/aqhv24-01etg-c-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);aqhv24-01etg-c.step/aqhv24-01etg-c.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Littelfuse datasheet (7 pp, sha256
44281cd02b603eb9, retrieved 2026-11-02, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).