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ISO6721FQDWVRQ1
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Texas Instruments Digital Isolators, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownISO6721FQDWVRQ1
Texas Instruments · Digital Isolators · SOIC-8
ISO6721FQDWVRQ1 from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC1 | power_in | Power supply for the input side, VCC1, referenced to GND1. |
| 2 | OUTA | output | Output, channel A. |
| 3 | INB | input | Input, channel B. |
| 4 | GND1 | power_in | Ground connection for VCC1. |
| 5 | GND2 | power_in | Ground connection for VCC2. |
| 6 | OUTB | output | Output, channel B. |
| 7 | INA | input | Input, channel A. |
| 8 | VCC2 | power_in | Power supply for the output side, VCC2, referenced to GND2. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Signal Isolation Devices |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage side 1 (VCC=1.8V) | VCC1 | 1.71 | 1.89 | V | VCC = 1.8V | 6 | |
| Supply voltage side 1 (VCC=2.5V to 5V) | VCC1 | 2.25 | 5.5 | V | VCC = 2.5V to 5V | 6 | |
| Supply voltage side 2 (VCC=1.8V) | VCC2 | 1.71 | 1.89 | V | VCC = 1.8V | 6 | |
| Supply voltage side 2 (VCC=2.5V to 5V) | VCC2 | 2.25 | 5.5 | V | VCC = 2.5V to 5V | 6 | |
| UVLO threshold when supply voltage is rising | VCC(UVLO+) | 1.53 | 1.71 | V | 6 | ||
| UVLO threshold when supply voltage is falling | VCC(UVLO-) | 1.1 | 1.41 | V | 6 | ||
| Supply voltage UVLO hysteresis | Vhys(UVLO) | 0.08 | 0.13 | V | 6 | ||
| High level output current | IOH | -4 | mA | VCCO = 5V | 6 | ||
| High level output current | IOH | -2 | mA | VCCO = 3.3V | 6 | ||
| High level output current | IOH | -1 | mA | VCCO = 2.5V | 6 | ||
| Low level output current | IOL | 4 | mA | VCCO = 5V | 6 | ||
| Low level output current | IOL | 2 | mA | VCCO = 3.3V | 6 | ||
| Low level output current | IOL | 1 | mA | VCCO = 2.5V | 6 | ||
| Data Rate | DR | 0 | 50 | Mbps | 6 | ||
| Ambient temperature | TA | -40 | 25 | 125 | °C | 6 | |
| Supply voltage VCC1 to GND1 | VCC1 | -0.5 | 6 | V | 5 | ||
| Supply voltage VCC2 to GND2 | VCC2 | -0.5 | 6 | V | 5 | ||
| Input voltage INx to GNDx | -0.5 | V | upper limit VCCX + 0.5, see footnote 3 | 5 | |||
| Output voltage OUTx to GNDx | -0.5 | V | upper limit VCCX + 0.5, see footnote 3 | 5 | |||
| Output current | Io | -15 | 15 | mA | 5 | ||
| Operating junction temperature | TJ | 150 | °C | 5 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 5 | ||
| High-level output current VCC | VOL | 0.4 | V | IOL = 4mA; See Figure 6-1 (5 V supply) | 13 | ||
| High-level input current | IIH | 10 | µA | VIH = VCCI at INx | 13 | ||
| Low-level input current | IIL | -10 | µA | VIL = 0V at INx | 13 | ||
| Common mode transient immunity (5 V) | CMTI | 100 | 150 | kV/µs | VI = VCC or 0V, VCM = 1200V | 13 | |
| Low-level output voltage (3.3 V) | VOL | 0.2 | V | IOL = 2mA; See Figure 6-1 | 15 | ||
| Common mode transient immunity (3.3 V) | CMTI | 100 | 150 | kV/µs | VI = VCC or 0V, VCM = 1200V | 15 | |
| Low-level output voltage (2.5 V) | VOL | 0.1 | V | IOL = 1mA; See Figure 6-1 | 17 | ||
| Common mode transient immunity (2.5 V) | CMTI | 100 | 150 | kV/µs | VI = VCC or 0 V, VCM = 1200 V | 17 | |
| Low-level output voltage (1.8 V) | VOL | 0.1 | V | IOL = 1mA; See Figure 6-1 | 19 | ||
| Common mode transient immunity (1.8 V) | CMTI | 100 | 150 | kV/µs | VI = VCC or 0V, VCM = 1200V | 19 | |
| Supply current DC signal (ISO6721) | ICC1, ICC2 | 1.2 | 2.1 | mA | VCC1 = VCC2 = 5 V ± 10%; VI = VCCI (ISO6721); VI = 0V (ISO6721 with F suffix) | 13 | |
| Supply current DC signal (ISO6721 F suffix) | ICC1, ICC2 | 2.3 | 3.5 | mA | VCC1 = VCC2 = 5 V ± 10%; VI = 0V (ISO6721); VI = VCCI (ISO6721 with F suffix) | 13 | |
| Supply current AC signal 1Mbps | ICC1, ICC2 | 1.9 | 2.9 | mA | VCC1 = VCC2 = 5 V ± 10%; all channels switching with square wave clock input; CL = 15pF; 1Mbps | 13 | |
| Supply current AC signal 10Mbps | ICC1, ICC2 | 2.5 | 3.6 | mA | VCC1 = VCC2 = 5 V ± 10%; all channels switching with square wave clock input; CL = 15pF; 10Mbps | 13 | |
| Supply current AC signal 50Mbps | ICC1, ICC2 | 5.2 | 6.7 | mA | VCC1 = VCC2 = 5 V ± 10%; all channels switching with square wave clock input; CL = 15pF; 50Mbps | 13 | |
| Propagation delay time (5 V) | tPLH, tPHL | 11 | 18 | ns | VCC1 = VCC2 = 5 V ± 10%; See Figure 6-1 | 21 | |
| Propagation delay time (3.3 V) | tPLH, tPHL | 11 | 18 | ns | VCC1 = VCC2 = 3.3 V ± 10%; See Figure 6-1 | 21 | |
| Propagation delay time (2.5 V) | tPLH, tPHL | 12 | 20.5 | ns | VCC1 = VCC2 = 2.5 V ± 10%; See Figure 6-1 | 22 | |
| Propagation delay time (1.8 V) | tPLH, tPHL | 15 | 24 | ns | VCC1 = VCC2 = 1.8 V ± 5%; See Figure 6-1 | 22 | |
| Minimum pulse width | tUI | 20 | ns | See Figure 6-1 | 21 | ||
| Channel-to-channel output skew time | tsk(o) | 6 | ns | Same direction channels | 21 | ||
| Time from UVLO to valid output data | tPU | 300 | µs | 21 | |||
| Maximum power dissipation (both sides), ISO6721 | PD | 73 | mW | VCC1 = VCC2 = 5.5V, TJ = 150°C, CL = 15pF, input a 25MHz 50% duty cycle square wave | 7 | ||
| Junction-to-ambient thermal resistance (DWV) | RθJA | 84.3 | °C/W | DWV (SOIC) package | 7 | ||
| Junction-to-case (top) thermal resistance (DWV) | RθJC(top) | 36.3 | °C/W | DWV (SOIC) package | 7 | ||
| Junction-to-board thermal resistance (DWV) | RθJB | 47 | °C/W | DWV (SOIC) package | 7 | ||
| Junction-to-top characterization parameter (DWV) | ψJT | 7.4 | °C/W | DWV (SOIC) package | 7 | ||
| Junction-to-board characterization parameter (DWV) | ψJB | 45.1 | °C/W | DWV (SOIC) package | 7 | ||
| Input capacitance (5 V) | Ci | 2.8 | pF | VI = VCC/2 + 0.4×sin(2πft), f = 2MHz, VCC = 5V; See Figure 6-3 | 13 | ||
| Barrier capacitance, input to output (DWV) | CIO | 0.5 | pF | VIO = 0.4 × sin(2πft), f = 1MHz | 8 |
CAD (KiCad official)
- Symbol:
ISO6721FQDWVRQ1 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
iso6721fqdwvrq1-etched.step/iso6721fqdwvrq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);iso6721fqdwvrq1.step/iso6721fqdwvrq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (61 pp, sha256
bffa2110449af290, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).