XR3078XID-F from MaxLinear, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RO	output	Receiver output: when RE is low and A-B is above -50mV, RO is high; when A-B is below -200mV, RO is low, and the -200mV to -50mV range is indeterminate.
2	RE	input	Receiver output enable (hot swap): RO is enabled when RE is low and is high-impedance when RE is high, and RE should be high with DE low to enter shutdown.
3	DE	input	Driver output enable (hot swap): the driver outputs are enabled when DE is high and high-impedance when DE is low, and DE should be low with RE high to enter shutdown.
4	DI	input	Driver input: with DE high, a low on DI forces the non-inverting output low and the inverting output high, and a high on DI forces the reverse.
5	GND	power_in	Ground reference for the device.
6	A	bidirectional	Non-inverting receiver input and non-inverting driver output on the bus; the bus pins withstand direct shorts up to ±18V and are ESD-protected to ±15kV.
7	B	bidirectional	Inverting receiver input and inverting driver output on the bus; the bus pins withstand direct shorts up to ±18V and are ESD-protected to ±15kV.
8	VCC	power_in	+3.3V power supply input (3.0V to 3.6V, 3.3V ±10%); bypass to ground with a 0.1µF capacitor.

Key specifications

Parameter	Value
Manufacturer	MaxLinear
Package	SOIC-8
Category	Interface ICs
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply Voltage (VCC) absolute maximum	VCC	-0.3		7	V		2
Input Voltage at Control and Driver Input (RE, DE, DI)		-0.3		7	V		2
Receiver Output Voltage (RO)		-0.3			V	Upper limit printed as (VCC + 0.3V)	2
Driver Output Voltage (A, B, Y and Z)		-18		18	V		2
Receiver Input Voltage (A and B, half or full duplex)		-18		18	V		2
Transient Voltage Pulse		-70		70	V	through 100	2
Driver Output Current		-250		250	mA		2
Storage Temperature Range		-65		150	°C		2
Lead Temperature (soldering)				300	°C	soldering, 10s	2
Maximum Junction Temperature				150	°C		2
Package Thermal Resistance, 8-Pin SO (Package Power Dissipation)	JA		128.4		°C/W	8-Pin SO	2
Thermal Shutdown Temperature	TTS		175		°C	Junction temperature, Note 4	3
Thermal Shutdown Hysteresis	TTSH		15		°C	Note 4	3
VCC Supply Voltage Range	VCC	3		3.6	V		3
Differential Driver Output (no load)	VOD	3			V	No Load	3
Differential Driver Output (RS-422)	VOD	2			V	RL = 100 (RS-422), Figure 3	3
Differential Driver Output (RS-485)	VOD	1.65			V	RL = 54 (RS-485), Figure 3	3
Differential Driver Output over common mode	VOD	1.5			V	-7V VCM +12V, Figure 4	3
Change in Magnitude of Differential Output Voltage	VOD	-0.2		0.2	V	RL = 100 (RS-422), or RL = 54 (RS-485), Figure 3, Note 1	3
Driver Common-Mode Output Voltage (steady state)	VCM			3	V		3
Change in Magnitude of Common-Mode Output Voltage	VCM	-0.2		0.2	V		3
Logic Input High	VIH	2			V	Logic Input Thresholds (DI, DE, RE)	3
Logic Input Low	VIL			0.8	V	Logic Input Thresholds (DI, DE, RE)	3
Input Hysteresis (DI, DE, RE)	VHYS		100		mV		3
Logic Input Current (DI, DE, RE)	IIN	-1		1	μA	0V VIN VCC, After first transition, Note 2	3
Logic Input Current (DE and RE) until first transition	IIN	-200	100	200	μA	Until first transition, Note 2	3
IA, B Input Current (A and B) at high output	IA, B			125	μA	VOUT = +12V, DE = 0V, VCC = 0V or 5.5V	3
IA, B Input Current (A and B) at low output	IA, B	-100			μA	VOUT = -7V, DE = 0V, VCC = 0V or 5.5V	3
Driver Short-Circuit Output Current	IOSD	-250		250	mA	-7V VOUT +12V, Figure 5	3
Receiver Differential Threshold Voltage (VA - VB)	VTH	-200	-125	-50	mV	-7V VCM +12V	4
Receiver Input Hysteresis	VOH		25		mV	VCM = 0V	4
Receiver Output Low Voltage (RO)	VOL			0.4	V	IOUT = 1mA	4
High-Z Receiver Output Current	IOZR	-1		1	μA	0V VOUT VCC	4
Receiver Input Resistance	RIN	96			k	-7V VCM +12V	4
Receiver Output Short-Circuit Current	IOSC	-80		80	mA	0V VRO VCC	4
Supply Current (driver enabled, receiver disabled)	ICC		425	600	μA	No Load, RE = 0V, DE = VCC, DI = 0V	4
Supply Current (both enabled)	ICC		330	600	μA	No Load, RE = VCC, DE = VCC, DI = 0V	4
Supply Current (both disabled, receiver inputs open)	ICC		300	500	μA	No Load, RE = 0V, DE = 0V, Receiver A and B inputs open	4
Supply Current in Shutdown Mode	ISHDN		0.001	1	μA	RE = VCC, DE = 0V	4
ESD Protection for A, B, Y, and Z		-15		15	kV	Human Body Model	4
ESD Protection for A, B, Y, and Z		-8		8	kV	IEC 61000-4-2 Contact	4
ESD Protection for all other pins		-4		4	kV	Human Body Model	4
Driver Prop. Delay (Low to High)	tDPLH		25		ns	CL = 50pF, RL = 54, Figure 6	7
Driver Prop. Delay (High to Low)	tDPHL		25		ns	CL = 50pF, RL = 54, Figure 6	7
Differential Driver Output Skew	/tDPLH-tDPHL/		5		ns		7
Driver Differential Output Rise or Fall Time	tDR, tDF		15		ns		7
Driver Enable to Output High	tDZH		45		ns	CL = 50pF, RL = 500, Figure 7	7
Driver Enable to Output Low	tDZL		45		ns		7
Driver Enable from Shutdown to Output High	tDZH(SHDN)		250		ns	CL = 50pF, RL = 500, Figure 7	7
Driver Enable from Shutdown to Output Low	tDZL(SHDN)		250		ns	CL = 50pF, RL = 500, Figure 7	7
Time to Shutdown	tSHDN	50	200	600	ns	Notes 3 and 4	7
Receiver Prop. Delay (Low to High)	tRPLH		50		ns	CL = 15pF, VID = ±2V, VID Rise and Fall times < 15ns, Figure 8	7
Receiver Prop. Delay (High to Low)	tRPHL		50		ns		7
Receiver Propagation Delay Skew	/tRPLH-tRPHL/		5		ns		7
Receiver Enable to Output High	tRZH		30		ns	CL = 15pF, RL = 1k, Figure 9	7
Receiver Enable to Output Low	tRZL		30		ns		7
Receiver Enable from Shutdown to Output High	tRZH(SHDN)		1800		ns	CL = 15pF, RL = 1k, Figure 9	7
Receiver Enable from Shutdown to Output Low	tRZL(SHDN)		1800		ns	CL = 15pF, RL = 1k, Figure 9	7
Time to Shutdown (receiver)	tSHDN	50	200	600	ns	Notes 3 and 4	7

CAD (KiCad official)

Symbol: XR3078XID-F
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: xr3078xid-f-etched.step / xr3078xid-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xr3078xid-f.step / xr3078xid-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: MaxLinear datasheet (23 pp, sha256 61b624227d774389, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

XR3078XID-F

Verified XR3078XID-F

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3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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