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Contents

README

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KIA1117BF33-RTF

KEC Semicon · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · DPAK

KIA1117BF33-RTF from KEC Semicon, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND(Adj) power_in Ground/adjust pin; in the adjustable version it sets the output through VOUT = VREF x (1 + R2/R1) + IADJ x R2, with adjust pin current typically 35 uA.
2 OUTPUT power_out Regulated output providing up to 1 A, with short circuit current limit of 1.1 A minimum and a minimum 10 uF capacitor (ESR 1 mOhm to 200 Ohm) required for stability.
3 INPUT power_in Unregulated input supply with a maximum rating of 15 V, and a typical dropout voltage of 1.1 V at 1 A output current.

Key specifications

Parameter Value
Manufacturer KEC Semicon
Package DPAK
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage (VIN=4.8V, IOUT=10mA) VOUT1 3.234 3.3 3.366 V VIN=4.8V, IOUT=10mA 2
Output Voltage (10mA to 1A, 4.8V to 10V) VOUT2 3.201 3.3 3.399 V 10mA IOUT 1A, 4.8V VIN 10V 2
Load Regulation Reg Load 0.5 1 % 10mA IOUT 1A, VIN=VOUT+2.0V 2
Line Regulation Reg Line 1 10 mV VOUT+1.5V VIN 10V, IOUT=10mA 2
Quiescent Current IB1 5 10 mA VIN=VOUT+1.25V, IOUT=0A 2
Short Circuit Current Limit ISC 1.1 A VIN=VOUT+2.0V 2
Ripple Rejection RR 60 80 dB IOUT=40mA, f=120Hz, Vripple=1Vp-p, VIN=VOUT+3V 2
Dropout Voltage VD 1.1 1.4 V IOUT=1A 2
Input Voltage VIN 15 V 1
Output Current IOUT 1 A 1
Power Dissipation 1 PD1 1.3 W No heatsink, DPAK (F-type) package; mounted on FR-4 PCB per note 1
Power Dissipation 2 PD2 13 W Infinite heatsink, DPAK (F-type) package 1
Maximum Junction Temperature Tj(max) 150 °C 1
Operating Junction Temperature Topr -40 150 °C 1
Storage Temperature Tstg -55 150 °C 1
Thermal Resistance Junction-to-Case Rth(j-c) 9.62 °C/W Infinite heatsink (TC=Ta), DPAK (F-type) 5
Thermal Resistance Junction-to-Ambient Rth(j-a) 96.2 °C/W No heatsink, DPAK (F-type) 5

CAD (KiCad official)

  • Symbol: KIA1117BF33-RTF
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: DPAK (KiCad packages3D, STEP)
  • 3D model files: kia1117bf33-rtf-etched.step / kia1117bf33-rtf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); kia1117bf33-rtf.step / kia1117bf33-rtf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: KEC Semicon datasheet (7 pp, sha256 63fb9a022402fdaa, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF