component
MBRS230LT3G-FS
Public Made by Adomby adom
FUXINSEMI Schottky Diodes, SMB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMBRS230LT3G-FS
FUXINSEMI · Schottky Diodes · SMB
MBRS230LT3G-FS from FUXINSEMI, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, indicated by the cathode band on the SMB/DO-214AA package. |
| 2 | A | passive | Anode of the 30V, 2.0A Schottky barrier rectifier. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | FUXINSEMI |
| Package | SMB |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum RMS voltage | VRMS | 28 | V | TA=25°C | 1 | ||
| Maximum average forward rectified current | IO | 2 | A | TA=25°C | 1 | ||
| Non-repetitive peak forward surge current | IFSM | 50 | A | 8.3ms single half sine-wave | 1 | ||
| Operating junction temperature range | TJ | -55 | 125 | °C | 1 | ||
| Storage temperature range | TSTG | -65 | 150 | °C | 1 | ||
| Maximum instantaneous forward voltage | VF | 0.43 | V | IF=2.0A, TA=25°C | 1 | ||
| Maximum reverse leakage current | IR | 1 | mA | TJ=25°C, at rated VR | 1 | ||
| Maximum reverse leakage current | IR | 50 | mA | TJ=100°C, at rated VR | 1 | ||
| Typical diode junction capacitance | CJ | 160 | pF | 1 MHz, applied reverse voltage 4.0 VDC | 1 | ||
| Typical thermal resistance junction to ambient | RθJA | 78 | °C/W | Mounted on FR-4 PCB copper, minimum recommended pad layout | 1 | ||
| Typical thermal resistance junction to case | RθJC | 18 | °C/W | Mounted on FR-4 PCB copper, minimum recommended pad layout | 1 |
CAD (KiCad official)
- Symbol:
MBRS230LT3G-FS - Footprint:
Diode_SMD:D_SMB - 3D model: SMB (KiCad packages3D, STEP)
- 3D model files:
mbrs230lt3g-fs-etched.step/mbrs230lt3g-fs-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mbrs230lt3g-fs.step/mbrs230lt3g-fs.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: FUXINSEMI datasheet (4 pp, sha256
b0fc497d2d30e201, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).