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Contents

README

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SZ1SMA30CAT3G

Littelfuse · TVS · SMA

SZ1SMA30CAT3G from Littelfuse, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Littelfuse
Package SMA
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage, minimum VBR 33.3 V @ IT = 1 mA (bi-directional table; note 7: measured at 25°C ambient) 4
Breakdown voltage, maximum VBR 36.81 V @ IT = 1 mA (bi-directional table; note 7: measured at 25°C ambient) 4
Maximum reverse leakage current IR 2.5 µA @ VRWM = 30 V 4
Breakdown voltage, nominal VBR 35.06 V @ IT = 1 mA (bi-directional table; note 7: measured at 25°C ambient) 4
Peak power dissipation PPK 400 W TL = 25°C, pulse width 1 ms (note 1: 10 x 1000 µs, non-repetitive) 1
DC power dissipation at TL = 75°C PD 1.5 W TL = 75°C, measured zero lead length (note 2) 1
DC power dissipation derating above 75°C PD 20 mW/°C Derate above TL = 75°C 1
DC power dissipation at TA = 25°C PD 0.5 W TA = 25°C, FR-4 board, Littelfuse minimum recommended footprint (note 3) 1
DC power dissipation derating above 25°C PD 4 mW/°C Derate above TA = 25°C 1
Operating and storage temperature range TJ, Tstg -65 150 °C 1
Thermal resistance, junction-to-lead RθJL 50 °C/W Measured zero lead length, 1 in² copper pad, FR-4 (note 2) 1
Thermal resistance, junction-to-ambient RθJA 250 °C/W FR-4 board, Littelfuse minimum recommended footprint (note 3) 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin and the terminal finish material is tin(Sn) (IPC/ 1

CAD (KiCad official)

  • Symbol: SZ1SMA30CAT3G
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA (KiCad packages3D, STEP)
  • 3D model files: sz1sma30cat3g-etched.step / sz1sma30cat3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sz1sma30cat3g.step / sz1sma30cat3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse datasheet (7 pp, sha256 2dcbd1b5c6bf6a05, retrieved 2026-10-28, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF