component
HoGS2512-0.2mR-3W-1%
Public Made by Adomby adom
Milliohm Current Sense Resistors / Shunt Resistors, 2512. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHoGS2512-0.2mR-3W-1%
Milliohm · Current Sense Resistors / Shunt Resistors · 2512
HoGS2512-0.2mR-3W-1% from Milliohm, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised resistor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised resistor; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Milliohm |
| Package | 2512 |
| Category | Resistors |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Resistance tolerance | -1 | 1 | % | 3 | |||
| Temperature coefficient of resistance | TCR | -100 | 100 | ppm/°C | 3 | ||
| Operating temperature range | -55 | 170 | ℃ | 3 | |||
| Storage ambient temperature | 5 | 35 | ℃ | Storage; humidity <65%RH, kept as low as possible | 7 | ||
| Solderability - solder coverage | 95 | % | Dip at 245±5℃ for 3±0.5 s; J-STD-002 | 5 | |||
| Short-time overload resistance change | ΔR | -0.5 | 0.5 | % | 5× rated power for 5 s; JIS-C-5201 | 5 | |
| Bending strength resistance change | ΔR | -1 | 1 | % | 2 mm deflection, support time at least 60 s; AEC-Q200-005 | 5 | |
| Solvent resistance resistance change | ΔR | -1 | 1 | % | Immersed in isopropyl alcohol at 20~25°C for 60±5 s; AEC-Q200 TEST 12 | 5 | |
| Solder heat resistance change | ΔR | -1 | 1 | % | Immersed in 260±5℃ solder bath for 10±1 s; AEC-Q200 TEST 15 | 5 | |
| Temperature cycling resistance change | ΔR | -1 | 1 | % | 1000 cycles, -55~155℃, 30 min dwell; AEC-Q200 TEST 4 | 5 | |
| High temperature storage resistance change | ΔR | -1 | 1 | % | 155℃, 1000 h, unpowered; AEC-Q200 TEST 3 | 5 | |
| Damp heat resistance change | ΔR | -1 | 1 | % | 85℃, 85%RH, 10% rated power, 1000 h; AEC-Q200 TEST 7 | 5 | |
| Load life resistance change | ΔR | -1 | 1 | % | Rated current, Ta=125℃, 100% power, 0.5 h off / 1.5 h on, 1000 h; AEC-Q200 TEST 8 | 5 | |
| Low temperature storage resistance change | ΔR | -1 | 1 | % | -55℃, 1000 h; IEC60115-1 4.23.4 | 5 | |
| Mechanical shock resistance change | ΔR | -1 | 1 | % | X, Y, Z directions, half-sine pulse 0.5 ms, 100 g peak; AEC-Q200 TEST 13 | 5 | |
| Vibration resistance change | ΔR | -1 | 1 | % | 10~2000 Hz, 12 cycles in each of 3 perpendicular directions; AEC-Q200 TEST 14 | 5 | |
| Rated power | P | 3 | W | 3 | |||
| Rated current | I | 122.47 | A | 3 | |||
| Nominal resistance | R | 0.2 | mR | 3 |
CAD (KiCad official)
- Symbol:
HoGS2512-0.2mR-3W-1% - Footprint:
Resistor_SMD:R_2512_6332Metric - 3D model: 2512 (KiCad packages3D, STEP)
- 3D model files:
hogs2512-0-2mr-3w-1-etched.step/hogs2512-0-2mr-3w-1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hogs2512-0-2mr-3w-1.step/hogs2512-0-2mr-3w-1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Milliohm datasheet (7 pp, sha256
ce8c906211fa5030, retrieved 2026-10-17, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).