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AMC1204BDWVR
Public Made by Adomby adom
Texas Instruments Analog To Digital Converters (ADCs), SOIC-8-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAMC1204BDWVR
Texas Instruments · Analog To Digital Converters (ADCs) · SOIC-8-300mil
AMC1204BDWVR from Texas Instruments, in a SOIC-8-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AVDD | power_in | High-side (analog) supply, specified at 4.5 V to 5.5 V (5 V nominal) referenced to AGND. |
| 2 | VINP | input | Noninverting analog input of the differential ±250 mV input range optimized for shunt resistors. |
| 3 | VINN | input | Inverting analog input of the differential ±250 mV input range, connected to the low side of the shunt resistor. |
| 4 | AGND | power_in | High-side ground reference for the isolated modulator, to which the floating shunt ground is connected. |
| 5 | DGND | power_in | Controller-side (digital) ground reference for the digital interface. |
| 6 | DATA | output | 1-bit modulator data output that feeds the external digital filter. |
| 7 | CLKIN | input | Modulator clock input, which can be driven at up to 20 MHz from the controller or system clock. |
| 8 | DVDD | power_in | Controller-side (digital) supply, specified at 2.7 V to 5.5 V (3.3 V nominal) referenced to DGND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8-300mil |
| Category | Data Converters |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage, AVDD to AGND or DVDD to DGND | -0.3 | 6 | V | 5 | |||
| Input current to any pin except supply pins | -10 | 10 | mA | 5 | |||
| Maximum virtual junction temperature | TJ | 150 | °C | 5 | |||
| Operating ambient temperature | TOA | -40 | 125 | °C | 5 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 5 | ||
| Operating ambient temperature | TA | -40 | 105 | °C | 5 | ||
| High-side (analog) supply voltage | AVDD | 4.5 | 5 | 5.5 | V | 5 | |
| Controller-side (digital) supply voltage | DVDD | 2.7 | 3.3 | 5.5 | V | 5 | |
| Integral linearity error | INL | -8 | 2 | 8 | LSB | TA = -40°C to 85°C | 9 |
| Integral linearity error | INL | -16 | 5 | 16 | LSB | TA = -40°C to 105°C | 9 |
| Differential nonlinearity | DNL | -1 | 1 | LSB | 9 | ||
| Offset error | VOS | -1 | 0.1 | 1 | mV | 9 | |
| Offset error thermal drift | TCVOS | -3.5 | 1 | 3.5 | μV/°C | 9 | |
| Gain error | GERR | -2 | 0.5 | 2 | % | 9 | |
| Gain error thermal drift | TCGERR | -30 | 30 | ppm/°C | 9 | ||
| Full-scale differential voltage input range (VINP, VINN) | FSR | -320 | 320 | mV | 9 | ||
| Specified full-scale range | FSR | -250 | 250 | mV | 9 | ||
| Operating common-mode signal | VCM | -160 | mV | 9 | |||
| Input leakage current | IIL | -10 | 10 | μA | VINP, VINN = ±250 mV | 9 | |
| Input leakage current | IIL | -50 | 50 | μA | VINP, VINN = ±320 mV | 9 | |
| Clock period | tCLKIN | 45.5 | 50 | 200 | ns | 9 | |
| Input clock frequency | fCLKIN | 5 | 20 | 22 | MHz | 9 | |
| Duty cycle | DutyCLKIN | 40 | 50 | 60 | % | 5 MHz ≤ fCLKIN < 20 MHz | 9 |
| Duty cycle | DutyCLKIN | 45 | 50 | 55 | % | 20 MHz ≤ fCLKIN ≤ 22 MHz | 9 |
| Signal-to-noise + distortion | SINAD | 78 | 87 | dB | fIN = 1kHz, TA = -40°C to 85°C | 9 | |
| Signal-to-noise + distortion | SINAD | 70 | 87 | dB | fIN = 1kHz, TA = -40°C to 105°C | 9 | |
| Signal-to-noise ratio | SNR | 84 | 88 | dB | fIN = 1kHz, TA = -40°C to 85°C | 9 | |
| Signal-to-noise ratio | SNR | 83 | 88 | dB | fIN = 1kHz, TA = -40°C to 105°C | 9 | |
| Total harmonic distortion | THD | -96 | -80 | dB | fIN = 1kHz, TA = -40°C to 85°C | 9 | |
| Total harmonic distortion | THD | -96 | -70 | dB | fIN = 1kHz, TA = -40°C to 105°C | 9 | |
| Spurious-free dynamic range | SFDR | 82 | 96 | dB | fIN = 1kHz, TA = -40°C to 85°C | 9 | |
| Spurious-free dynamic range | SFDR | 72 | 96 | dB | fIN = 1kHz, TA = -40°C to 105°C | 9 | |
| Input current | IIN | -10 | 10 | μA | VIN = DVDD to DGND | 9 | |
| Low-level input voltage (CMOS with Schmitt-trigger) | VIL | -0.3 | V | DVDD = 4.5 V to 5.5 V | 9 | ||
| High-level input voltage (LVCMOS) | VIH | 2 | V | DVDD = 2.7 V to 3.6 V | 9 | ||
| Low-level input voltage (LVCMOS) | VIL | -0.3 | 0.8 | V | DVDD = 2.7 V to 3.6 V | 10 | |
| High-side supply voltage | AVDD | 4.5 | 5 | 5.5 | V | 10 | |
| Controller-side supply voltage | DVDD | 2.7 | 3.3 | 5.5 | V | 10 | |
| High-side supply current | IAVDD | 11 | 16 | mA | 4.5 V ≤ AVDD ≤ 5.5 V | 10 | |
| Controller-side supply current | IDVDD | 2 | 4 | mA | 2.7 V ≤ DVDD ≤ 3.6 V | 10 | |
| Controller-side supply current | IDVDD | 2.8 | 5 | mA | 4.5 V ≤ DVDD ≤ 5.5 V | 10 | |
| Power dissipation | PD | 61.6 | 102.4 | mW | AVDD = 5.5 V, DVDD = 3.6 V | 10 | |
| CLKIN clock period | tCLK | 45.5 | 50 | 200 | ns | 10 | |
| CLKIN clock high time | tHIGH | 20 | 25 | 120 | ns | 10 | |
| CLKIN clock low time | tLOW | 20 | 25 | 120 | ns | 10 | |
| Delayed falling edge of CLKIN to DATA valid | tD | 2 | 15 | ns | 10 | ||
| Junction-to-ambient thermal resistance | RθJA | 106.5 | °C/W | DWV (SOIC) 8-pin package | 5 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 53.6 | °C/W | DWV (SOIC) 8-pin package | 5 | ||
| Junction-to-board thermal resistance | RθJB | 60.3 | °C/W | DWV (SOIC) 8-pin package | 5 | ||
| Junction-to-top characterization parameter | ψJT | 18.5 | °C/W | DWV (SOIC) 8-pin package | 5 | ||
| Junction-to-board characterization parameter | ψJB | 58.9 | °C/W | DWV (SOIC) 8-pin package | 5 |
CAD (KiCad official)
- Symbol:
AMC1204BDWVR - Footprint:
Package_SO:SOIC-8_7.5x5.85mm_P1.27mm - 3D model: SOIC-8-300mil (KiCad packages3D, STEP)
- 3D model files:
amc1204bdwvr-etched.step/amc1204bdwvr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);amc1204bdwvr.step/amc1204bdwvr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (46 pp, sha256
59b4ffc6b2b9478a, retrieved 2026-11-06, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).