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Contents

README

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IRL6372PBF-HXY

HXY MOSFET · MOSFETs · SOP-8

IRL6372PBF-HXY from HXY MOSFET, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source terminal of MOSFET 1 in the dual N-channel device, rated with the part's 30V drain-source voltage and ±20V gate-source voltage limits.
2 G1 input Gate terminal of MOSFET 1, rated for a gate-source voltage of ±20V and specified for RDS(ON) at VGS = 4.5V and 10V.
3 S2 passive Source terminal of MOSFET 2 in the dual N-channel device, rated with the part's 30V drain-source voltage and ±20V gate-source voltage limits.
4 G2 input Gate terminal of MOSFET 2, rated for a gate-source voltage of ±20V and specified for RDS(ON) at VGS = 4.5V and 10V.
5 D2 passive Drain terminal of MOSFET 2; the datasheet lists the pin as D2 in the package diagram and gives a 30V drain-source breakdown rating for the device.
6 D2 passive Drain terminal of MOSFET 2 (second drain pin, tied to pin 5); the datasheet gives a 30V drain-source breakdown rating for the device.
7 D1 passive Drain terminal of MOSFET 1; the datasheet lists the pin as D1 in the package diagram and gives a 30V drain-source breakdown rating for the device.
8 D1 passive Drain terminal of MOSFET 1 (second drain pin, tied to pin 7); the datasheet gives a 30V drain-source breakdown rating for the device.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 30 V 1
Gate-Source Voltage VGS 20 V printed as +20 V 1
Drain Current ID@TA=25℃ 8.5 A TA=25℃, VGS @ 4.5V, note 3 1
Drain Current ID@TA=70℃ 5.8 A TA=70℃, VGS @ 4.5V, note 3 1
Pulsed Drain Current IDM 37 A note 1 1
Total Power Dissipation PD@TA=25℃ 1.5 W TA=25℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Maximum Thermal Resistance, Junction-ambient Rthj-a 85 ℃/W junction-ambient, note 3 1
Drain-Source Breakdown Voltage BVDSS 30 V VGS=0V, ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 18 mΩ VGS=10V, ID=7A; column placement of the printed value is ambiguous (see review_required) 2
Static Drain-Source On-Resistance RDS(ON) 28 mΩ VGS=4.5V, ID=4A; column placement of the printed value is ambiguous (see review_required) 2
Gate Threshold Voltage VGS(th) 1.2 2.5 V VGS=VDS, ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=24V, VGS=0V, TJ=25℃ 2
Drain-Source Leakage Current IDSS 5 uA VDS=24V, VGS=0V, TJ=55℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
BVDSS Temperature Coefficient △BVDSS/△TJ 0.034 V/℃ Reference to 25℃, ID=1mA 2
VGS(th) Temperature Coefficient △VGS(th) -5.8 mV/℃ 2
Forward Transconductance gfs 6 S VDS=5V, ID=7A 2
Gate Resistance Rg 2.5 VDS=0V, VGS=0V, f=1MHz 2
Total Gate Charge (4.5V) Qg 6 nC VDS=15V, VGS=4.5V, ID=7A 2
Gate-Source Charge Qgs 2.5 nC VDS=15V, VGS=4.5V, ID=7A 2
Gate-Drain Charge Qgd 2.1 nC VDS=15V, VGS=4.5V, ID=7A 2
Turn-On Delay Time Td(on) 2.4 ns VDD=15V, VGS=10V, RG=3.3, ID=7A 2
Rise Time Tr 7.8 ns VDD=15V, VGS=10V, RG=3.3, ID=7A 2
Turn-Off Delay Time Td(off) 22 ns VDD=15V, VGS=10V, RG=3.3, ID=7A 2
Fall Time Tf 4 ns VDD=15V, VGS=10V, RG=3.3, ID=7A 2
Input Capacitance Ciss 572 pF VDS=15V, VGS=0V, f=1MHz 2
Output Capacitance Coss 80 pF VDS=15V, VGS=0V, f=1MHz 2
Reverse Transfer Capacitance Crss 65 pF VDS=15V, VGS=0V, f=1MHz 2
Continuous Source Current IS 7.3 A VG=VD=0V, Force Current, notes 1,5 2
Pulsed Source Current ISM 37 A notes 2,5 2
Diode Forward Voltage VSD 1.2 V VGS=0V, IS=1A, TJ=25℃ 2
Reverse Recovery Time trr 20 nS IF=7A, dI/dt=100A/µs, TJ=25℃ 2
Reverse Recovery Charge Qrr 1.1 nC IF=7A, dI/dt=100A/µs, TJ=25℃ 2

CAD (KiCad official)

  • Symbol: IRL6372PBF-HXY
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: irl6372pbf-hxy-etched.step / irl6372pbf-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); irl6372pbf-hxy.step / irl6372pbf-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (6 pp, sha256 d4a68e75196a266a, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF