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Contents

README

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MCP1824T-3302E

Microchip Tech · Linear Voltage Regulators (LDO) · SOT-23-5

MCP1824T-3302E from Microchip Tech, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input voltage supply for the unregulated or regulated source (operating range 2.1V to 6.0V), with a 1 µF to 10 µF input capacitor recommended if the source is far away or a battery.
2 GND power_in Ground pin that conducts only the LDO ground current and should be tied to an electrically quiet circuit ground for best noise and PSRR.
3 SHDN input Shutdown control input where a logic-high enables the LDO output and a logic-low disables it and drives PWRGD low, reducing quiescent current to a typical 0.1 µA.
4 PWRGD output Open-drain power good output that indicates the output is within 92% (typical) of nominal regulation with 2% typical hysteresis and a fixed 110 µs (typical) delay.
5 VOUT power_out Regulated output voltage (3.3V for this fixed version) requiring a minimum 1.0 µF output capacitance for stability.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOT-23-5
Category Power Management ICs
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Operating Voltage VIN 2.1 6 V 7
Input Quiescent Current Iq 120 220 µA IL = 0 mA, VOUT = 0.8V to 5.0V 7
Input Quiescent Current for SHDN Mode ISHDN 0.1 3 µA SHDN = GND 7
Maximum Continuous Output Current IOUT 300 mA VIN = 2.1V to 6.0V, VR = 0.8V to 5.0V 7
Line Regulation ΔVOUT/(VOUT x ΔVIN) 0.05 0.17 %/V (Note 1) ≤ VIN ≤ 6V; typ and max printed as ± 7
Load Regulation ΔVOUT/VOUT -1 0.5 1 % IOUT = 1 mA to 300 mA, (Note 4); typ printed as ± 7
Output Short Circuit Current IOUT_SC 720 mA RLOAD < 0.1Ω, Peak Current 7
Dropout Voltage VDROPOUT 200 320 mV Note 5, IOUT = 300 mA, VIN(MIN) = 2.1V 7
Maximum Pulsed Output Current IPULSE 500 mA VIN = 2.1V to 6.0V, VR = 0.8V to 5.0V, Duty Cycle ≤ 60%, Period < 10 ms 7
Maximum Pulsed Output Duty Cycle IPULSE_DUTY 60 % VIN = 2.1V to 6.0V, VR = 0.8V to 5.0V, IOUT = 500 mA, Period < 10 ms 8
Maximum Pulsed Output Period IPULSE_PERIOD 10 ms VIN = 2.1V to 6.0V, VR = 0.8V to 5.0V, IOUT = 500 mA 8
Fixed Output Voltage Regulation (min/max as % of VR) VOUT -2.5 0.5 2.5 % Note 2, VR = 3.3V; typ printed as ±0.5% 8
PWRGD Input Voltage Operating Range VPWRGD_VIN 1 6 V TA = +25°C; For VIN < 2.1V, ISINK = 100 µA 8
PWRGD Input Voltage Operating Range VPWRGD_VIN 1.2 6 V TA = -40°C to +125°C; For VIN < 2.1V, ISINK = 100 µA 8
PWRGD Threshold Voltage VPWRGD_TH 90 92 94 %VOUT Falling Edge, VOUT >= 2.5V Fixed 8
PWRGD Threshold Hysteresis VPWRGD_HYS 1 2 3 %VOUT 8
PWRGD Output Voltage Low VPWRGD_L 0.05 0.4 V IPWRGD SINK = 1.2 mA, ADJ = 0V 8
PWRGD Output Current Sink Capability IPWRGD 1.2 6 mA VPWRGD = 0.200V 8
PWRGD Leakage PWRGD_LK 1 nA VPWRGD = VIN = 6.0V 8
PWRGD Time Delay TPG 110 µs Rising Edge, RPULLUP = 10 kΩ 8
Detect Threshold to PWRGD Active Time Delay TVDET-PWRGD 200 µs VOUT = VPWRGD_TH + 50 mV to VPWRGD_TH - 50 mV 9
SHDN Logic High Input VSHDN-HIGH 45 %VIN VIN = 2.1V to 6.0V 9
SHDN Logic Low Input VSHDN-LOW 15 %VIN VIN = 2.1V to 6.0V 9
SHDN Input Leakage Current SHDNILK -0.1 0.001 0.1 µA VIN = 6V, SHDN =VIN, SHDN = GND; typ printed as ± 9
Output Delay From SHDN TOR 100 µs SHDN = GND to VIN, VOUT = GND to 95% VR 9
Output Noise eN 2 µV/√Hz IOUT = 200 mA, f = 1 kHz, COUT = 10 µF (X7R Ceramic), VOUT = 2.5V 9
Power Supply Ripple Rejection Ratio PSRR 55 dB f = 100 Hz, IOUT = 10 mA, VINAC = 200 mV pk-pk, CIN = 0 µF 9
Thermal Shutdown Temperature TSD 150 °C IOUT = 100 µA, VOUT = 1.8V, VIN = 2.8V 9
Thermal Shutdown Hysteresis ΔTSD 10 °C IOUT = 100 µA, VOUT = 1.8V, VIN = 2.8V 9
Maximum Voltage on Any Pin -0.3 0.3 V (GND, 0.3V) to (VIN + 0.3)V; max is offset above VIN 7
Storage Temperature TA -65 150 °C 7
Maximum Junction Temperature TJ 150 °C 7
Operating Junction Temperature TJ -40 125 °C Steady State 10
Thermal Resistance, 5LD SOT-23 Junction to Ambient θJA 256 °C/W EIA/JEDEC JESD51-751-7, 4 Layer Board 10
Thermal Resistance, 5LD SOT-23 Junction to Case θJC 81 °C/W EIA/JEDEC JESD51-751-7, 4 Layer Board 10

CAD (KiCad official)

  • Symbol: MCP1824T-3302E
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: mcp1824t-3302e-etched.step / mcp1824t-3302e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1824t-3302e.step / mcp1824t-3302e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (34 pp, sha256 dda3986a6bed8be8, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF