W25Q16JVSNIQ from Winbond Elec, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	/CS	input	SPI Chip Select input, active low. Drive low to select the device; when high the device is deselected and DO/IOx go to high impedance and the part enters standby. /CS must track VCC at power-up/down; a pull-up to VCC is recommended.
2	DO (IO1)	bidirectional	Serial Data Output in Standard SPI (data shifted out on falling edge of CLK). Becomes bidirectional IO1 for Dual/Quad SPI instructions.
3	/WP (IO2)	bidirectional	Write Protect input, active low; when asserted with the appropriate Status Register bits (SRP/SRL, CMP, SEC, TB, BP[2:0]) it hardware-protects the Status Register from writes. Becomes bidirectional IO2 in Quad SPI mode when Status Register-2 QE bit = 1.
4	GND	power_in	Device ground reference (0 V).
5	DI (IO0)	bidirectional	Serial Data Input in Standard SPI (instructions, addresses and data shifted in on rising edge of CLK). Becomes bidirectional IO0 for Dual/Quad SPI instructions.
6	CLK	input	SPI Serial Clock input. Sampling edge for data-in on rising edge, data-out on falling edge. Supports SPI Modes 0 and 3, up to 133 MHz.
7	/HOLD or /RESET (IO3)	bidirectional	Multi-function pin. In Standard/Dual SPI it acts as /HOLD (active low, pauses SPI activity while /CS is low) or as /RESET when the feature is enabled in Status Register-3; in Quad SPI mode (QE=1) it becomes bidirectional IO3.
8	VCC	power_in	Core / I/O supply, 2.7 V to 3.6 V single supply. Typical power-down current <1 µA. /CS must track VCC at power-up/down; decouple with a local bypass capacitor.

Key specifications

Parameter	Value
Manufacturer	Winbond Elec
Package	SOIC-8
Category	Memory
Pins	8

Ordering variants

Same part, different packaging or reel option.

W25Q16JVSNIQ
W25Q16JVSNIQSNJQ
W25Q16JVSNIQSNIM
W25Q16JVSNIQSNJM
W25Q16JVSNIQSSIQ
W25Q16JVSNIQSSJQ
W25Q16JVSNIQSSIM
W25Q16JVSNIQSSJM
W25Q16JVSNIQZPIQ
W25Q16JVSNIQZPJQ
W25Q16JVSNIQZPIM
W25Q16JVSNIQZPJM
W25Q16JVSNIQUXIQ
W25Q16JVSNIQUXJQ
W25Q16JVSNIQUXIM
W25Q16JVSNIQUXJM
W25Q16JVSNIQUUIQ
W25Q16JVSNIQUUJQ
W25Q16JVSNIQUUIM
W25Q16JVSNIQUUJM
W25Q16JVSNIQXGIQ
W25Q16JVSNIQXGJQ
W25Q16JVSNIQBYIQ
W25Q16JVSNIQBYJQ

CAD (KiCad official)

Symbol: W25Q16JVSNIQ
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`w25q16jvsniq.step`	122 KB	You want the bare part, or you mark your own boards.
`w25q16jvsniq-etched.step`	2.4 MB	You want the part with `W25Q16JVSNIQ` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 580 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Winbond Elec datasheet (75 pp, sha256 6d23cdf57fd63fc2, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF