AD8553ARMZ-REEL from Analog Devices, in a MSOP-10. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RGA	passive	Gain-setting resistor R1 connection; parasitic capacitance on this pin must be minimized and matched with pin 10 to maintain CMR and low gain error.
2	VINP	input	Noninverting input with an input voltage range of 0 V to 3.3 V at VCC = 5 V and 0 V to 0.15 V at VS = 1.8 V.
3	VCC	power_in	Positive supply pin operable from 1.8 V to 5.5 V, bypassed with a 0.1 µF surface-mount capacitor placed as close to the pin as possible.
4	VO	output	Rail-to-rail output buffer that can drive capacitive loads up to 100 pF.
5	VFB	passive	Provides access to the signal current at the output of the voltage-to-current converter, allowing the device to be used as a current-output amplifier.
6	ENABLE	input	Shutdown control that is connected to the positive supply for normal operation and to the negative supply to turn the device off, and must not be left floating.
7	VREF	power_in	Reference voltage input that sets the output reference level, with a specified VREF range of 0.8 V to 4.2 V.
8	GND	power_in	Ground reference pin for the device supply connections.
9	VINN	input	Inverting input; the differential input voltage is limited to ±VSUPPLY or ±5.0 V, whichever is less.
10	RGB	passive	Gain-setting resistor R1 connection; traces from this pin to R1 must be kept short and symmetric with pin 1 to avoid gain error.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	MSOP-10
Category	Operational Amplifier/Comparator
Pins	10

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Input Offset Voltage	VOS		4	20	μV	G = 1000	3
Input Offset Voltage	VOS		15	50	μV	G = 10	3
Input Offset Voltage	VOS		120	375	μV	G = 1	3
Input Offset Voltage vs. Temperature	ΔVOS/ΔT		0.02	0.1	μV/°C	G = 1000, −40°C ≤ TA ≤ +85°C	3
Input Offset Voltage vs. Temperature	ΔVOS/ΔT		0.1	0.3	μV/°C	G = 10, −40°C ≤ TA ≤ +85°C	3
Input Offset Voltage vs. Temperature	ΔVOS/ΔT		1	3	μV/°C	G = 1, −40°C ≤ TA ≤ +85°C	3
Input Bias Current	IB		0.4	1	nA		3
Input Bias Current	IB			2	nA	−40°C ≤ TA ≤ +85°C	3
Input Offset Current	IOS			2	nA		3
VREF Pin Current	IREF		0.01	1	nA		3
Input Voltage Range		0		3.3	V		3
Common-Mode Rejection	CMR	120	140		dB	G = 100, VCM = 0 V to 3.3 V, −40°C ≤ TA ≤ +85°C	3
Common-Mode Rejection	CMR	100	120		dB	G = 10, VCM = 0 V to 3.3 V, −40°C ≤ TA ≤ +85°C	3
Gain Error			0.1	0.3	%	G = 100, VCM = 12.125 mV, VO = 0.075 V to 4.925 V	3
Gain Error			0.15	0.4	%	G = 10, VCM = 121.25 mV , VO = 0.075 V to 4.925 V	3
Gain Drift			5	25	ppm/°C	G = 10, 100, 1000, −40°C ≤ TA ≤ +85°C	3
Gain Drift			30	50	ppm/°C	G = 1, −40°C ≤ TA ≤ +85°C	3
Nonlinearity			0.001	0.003	% FS	G = 100, VCM = 12.125 mV, VO = 0.075 V to 4.925 V	3
Nonlinearity			0.04	0.06	% FS	G = 10, VCM = 121.25 mV, VO = 0.075 V to 4.925 V	3
VREF Range		0.8		4.2	V		3
Output Voltage High	VOH		4.925		V		3
Output Voltage Low	VOL		0.075		V		3
Short-Circuit Current	ISC	-35		35	mA		3
Power Supply Rejection	PSR	100	120		dB	G = 100, VS = 1.8 V to 5.5 V, VCM = 0 V	3
Power Supply Rejection	PSR	90	110		dB	G = 10, VS = 1.8 V to 5.5 V, VCM = 0 V	3
Supply Current	ISY		1.1	1.3	mA	IO = 0 mA, VIN = 0 V	3
Supply Current	ISY			1.5	mA	−40°C ≤ TA ≤ +85°C	3
Supply Current Shutdown Mode	ISD		2	4	μA		3
Logic High Voltage		2.4			V		3
Logic Low Voltage				0.8	V		3
Voltage Noise p-p	en p-p		0.7		μV p-p	f = 0.01 Hz to 10 Hz	3
Voltage Noise Density	en		30		nV/√Hz	G = 100, f = 1 kHz	3
Voltage Noise Density	en		150		nV/√Hz	G = 10, f = 1 kHz	3
Internal Clock Frequency			60		kHz		3
Signal Bandwidth			1		kHz	G = 1 to 1000	3
Supply Voltage				6	V		5
Operating Temperature Range		-40		85	°C		5
Storage Temperature Range (RM Package)		-65		150	°C		5
Junction Temperature Range (RM Package)		-65		150	°C		5
Lead Temperature Range (Soldering)				300	°C	Soldering, 10 sec	5
Thermal Resistance Junction-to-Ambient	θJA		110		°C/W	Device soldered in circuit board	5
Thermal Resistance Junction-to-Case	θJC		32.2		°C/W		5

CAD (KiCad official)

Symbol: AD8553ARMZ-REEL
Footprint: Package_SO:MSOP-10_3x3mm_P0.5mm
3D model: MSOP-10 (KiCad packages3D, STEP)
3D model files: ad8553armz-reel-etched.step / ad8553armz-reel-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ad8553armz-reel.step / ad8553armz-reel.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (20 pp, sha256 e23eaa57bbdd4b19, retrieved 2026-11-02, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

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AD8553ARMZ-REEL

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